Method of adhesively and hermetically sealing a semiconductor package lid by scrubbing

• US 5,064,782 A
• Filed: 04/06/1990
• Issued: 11/12/1991
• Est. Priority Date: 04/17/1989
• Status: Expired due to Term

• Current Assignee: Sumitomo Electric Industries Limited (Sumitomo Corporation)
• Original Assignee: Sumitomo Electric Industries Limited (Sumitomo Corporation)
• Inventors: Nishiguchi, Masanori
• Primary Examiner(s): Chaudhuri, Olik
• Assistant Examiner(s): Graybill, David E.
• Application Number:
  US07/505,591
• Time in Patent Office: 585 Days
• Field of Search: 174/50, 174/51, 174/52.1, 174/52.5, 174/52.3, 174/52.4, 174/52.5, 437/215, 437/216, 437/218, 437/221, 437/222, 437/927, 437/209, 228/193, 228/194, 228/195, 228/263.12, 228/263.13, 228/112, 228/2, 228/243, 228/43, 228/44.3, 228/48, 228/49.1, 357/74
• US Class Current: 228/121
• CPC Class Codes: H01L 21/50 Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
• CPC Class Codes: H01L 21/67121 Apparatus for making assemblies not otherwise provided for, e.g. package constructions
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/16195 Flat cap [not enclosing an internal cavity]

Abstract

A semiconductor device package is disclosed which includes (1) a carrier body which is to be mounted with a semiconductor device chip and which has an annular adhesion layer formed thereon, (2) a cap which is to be adhered to the carrier body to hermetically seal the carrier body, and (3) an adhesive which is applied between the adhesion layer of the carrier body and the cap and which becomes hardened after at least one of the carrier body and the cap is pivoted about an axis coaxial with the annular adhesion layer to eliminate voids in the adhesive and to improve the sealing properties of the package.

Claims

1. A sealing method for a semiconductor device package, comprising:

(a) mounting a semiconductor device chip on a package body having an annular adhesion layer formed thereon, applying an adhesive to said adhesion layer, and thereafter mounting a lid having an annular adhesion layer formed thereon on said package body through a sealing solder film to cause said annular adhesion layer of said package body to overlap said annular adhesion layer of said lid;

(b) urging at least one of said package body and said lid against the other of said package body and said lid to hermetically seal said package body; and

(c) pivoting one of said package body and said lid about a substantially central axis of one of said annular adhesion layer of said lid and said annular adhesion layer of said package body.

2. A sealing method for a semiconductor device package according to claim 1, wherein a center of said annular adhesion layer of said package body is substantially aligned with a center of said annular adhesion layer of said lid.

3. A sealing method for a semiconductor device package according to claim 1, wherein said annular adhesion layer of said lid and said annular adhesion layer of said package body are Au/Ni plating layers and said sealing solder film is an Au/Sn alloy.