Programmable resistor and an array of the same
First Claim
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1. A programmable resistor, comprising:
- a substrate formed of a layer of semiconductor of a first type;
a current path region of a second type formed in said substrate wherein an interface having interfacial traps is formed between said current path and said substrate;
a backgate formed adjacent said current path; and
circuitry coupled to said backgate for varying the number of carriers residing in said interfacial traps.
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Abstract
A programmable resistor 10 is provided having a resistive element 12. Resistive element 12 includes a substrate 26 formed by a layer of semiconductor of a first conductivity-type. A current path 32 is formed in substrate 26 by a layer of semiconductor of a second conductivity-type. An interface 36 having interfacial traps is formed between current path 32 and substrate 26. A backgate 24 is formed adjacent substrate 26. A first switch 14 selectively couples backgate 24 to a first voltage while a second switch 16 selectively couples backgate 24 to a second voltage.
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Citations
31 Claims
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1. A programmable resistor, comprising:
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a substrate formed of a layer of semiconductor of a first type; a current path region of a second type formed in said substrate wherein an interface having interfacial traps is formed between said current path and said substrate; a backgate formed adjacent said current path; and circuitry coupled to said backgate for varying the number of carriers residing in said interfacial traps. - View Dependent Claims (2, 3, 4)
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5. A programmable resistor, comprising:
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a field effect transistor including a channel area formed in a layer of semiconductor so as to create a plurality of interfacial traps along an interface between the channel and the layer of semiconductor; a backgate spaced from said channel area operable to vary the resistance of the channel area responsive to a voltage applied thereto; a first switch selectively coupling said backgate to a first voltage source; and a second switch selectively coupling said backgate to a second voltage source. - View Dependent Claims (6, 7, 8, 9, 10, 11)
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12. A programmable resistor, comprising:
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a field effect transistor formed in a semiconductor substrate of a first type conductivity comprising; a source region of a second conductivity type formed in said substrate; a drain region of said second conductivity type formed adjacent said substrate; a channel area of said second conductivity type formed adjacent said substrate, such that an interface having interfacial traps with said substrate is formed therebetween; and a gate formed adjacent to said channel area; a backgate spaced from said channel area and formed adjacent said substrate to be of said second conductivity type such that the resistance of the channel area can be varied responsive to a voltage applied to the backgate; a first switch selectively connecting said backgate to a first voltage; and a second switch selectively connecting said backgate to a second voltage. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
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21. A neural network array comprising:
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a plurality of input lines; a plurality of output lines; a plurality of programmable resistors coupling each of said input lines with each of said output lines, said programmable resistors comprising; a substrate formed of a layer of semiconductor of a first type; a current path region of a second type formed in said substrate wherein an interface having interfacial traps is formed between said current path and said substrate; a backgate formed adjacent said current path; and circuitry coupled to said backgate for varying the number of carriers residing in said interfacial traps. - View Dependent Claims (23, 24, 25)
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22. A method for providing a variable resistance element in a semiconductor substrate, comprising the steps of:
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generating a current flow through a doped region of a first conductivity type having an interface with a substrate of a second conductivity type; increasing the resistance of the doped region by filling the traps with electrons; and decreasing the resistance of the current path by removing electrons from the traps.
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26. A method for forming a programmable resistor at a face of a layer of semiconductor of a first conductivity type, comprising the steps of:
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forming a horizontal portion of a backgate of a second conductivity type by an implant into the face of the layer of semiconductor; forming a vertical portion of the backgate continuous with the horizontal portion by an implant into the face of the layer of semiconductor; and forming source and drain regions of the second conductivity type spaced by a channel area of the second conductivity type. - View Dependent Claims (27, 28)
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29. A method for forming a programmable resistor at a face of a layer of semiconductor of a first conductivity type, comprising the steps of:
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forming a horizontal portion of a backgate of a second conductivity type by epitaxial growth; forming a second layer of semiconductor of the first conductivity type adjacent the horizontal portion of the backgate; forming a vertical portion of the backgate continuous with the horizontal portion by at least one implant into the face of the second layer of semiconductor; and forming source and drain regions of the second conductivity type spaced by a channel area of the second conductivity type, the source, drain and channel area formed by at least one implant into the face of the second layer of semiconductor.
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30. A method for forming a programmable resistor at a face of a layer of semiconductor of a first conductivity type, comprising the steps of:
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forming a horizontal portion of a backgate of a second conductivity type by epitaxial growth; forming a second layer of semiconductor of the first conductivity type adjacent the horizontal portion of the backgate; forming a vertical portion of the backgate continuous with the horizontal portion of the backgate by implantation and a channel area of the second conductivity type by epitaxial growth of semiconductor of the second conductivity type; forming a top layer of semiconductor of the second conductivity type vertically adjacent the channel area by epitaxial growth; and defining the boundaries of a source region, a drain region and a vertical extension of the backgate, each vertically spaced from the channel area, by an etch of the top layer of semiconductor. - View Dependent Claims (31)
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Specification