Laser diode module

• US 5,065,226 A
• Filed: 06/15/1990
• Issued: 11/12/1991
• Est. Priority Date: 06/16/1989
• Status: Expired due to Term

• Current Assignee: Viavi Solutions, Inc. (Lumentum Holdings Inc.)
• Original Assignee: US Philips Corporation (Koninklijke Philips N.V.)
• Inventors: Kock, Hendrikus G., Tjassens, Hindrik, Kluitmans, Johannes T. M.
• Primary Examiner(s): Hille, Rolf
• Assistant Examiner(s): OSTROWSKI, DAVID M
• Application Number:
  US07/539,092
• Time in Patent Office: 515 Days
• Field of Search: 357/74, 357/76, 357/79, 357/80, 372/36, 372/38, 372/44, 372/45, 350/96.1, 350/96.2, 350/96.17, 333/246, 333/32
• US Class Current: 257/433
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/30107 Inductance
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01S 5/02216 Butterfly-type, i.e. with electrode pins extending horizontally from the housings
• CPC Class Codes: H01S 5/02251 using optical fibres
• CPC Class Codes: H01S 5/02325 Mechanically integrated components on mount members or optical micro-benches
• CPC Class Codes: H01S 5/02423 Liquid cooling, e.g. a liquid cools a mount of the laser
• CPC Class Codes: H01S 5/02438 Characterized by cooling of elements other than the laser chip, e.g. an optical element being part of an external cavity or a collimating lens
• CPC Class Codes: H01S 5/0427 for applying modulation to the laser
• CPC Class Codes: H01S 5/06226 Modulation at ultra-high frequencies
• CPC Class Codes: H01S 5/0683 by monitoring the optical output parameters
• CPC Class Codes: Y10S 257/93 Thermoelectric, e.g. peltier effect cooling

Abstract

A laser diode module includes a rectangular box-shaped metal casing having a bottom (B), an even number of guide pins (1-14) being led through the bottom (B) in a standardized DIL order. In addition to the laser diode itself (LD) the laser diode module further includes a metal base carrier (BC) on which the laser diode (LD), a photo diode (PD) and a support (S) for the glass fiber (F) are installed. The laser diode module further includes a guide pin (9) which is inserted in the bottom (B) by means of a feedthrough insulator for electrically connecting the laser diode module to an external transmission line (MT). In order to achieve a proper matching of the laser diode module and the characteristic impedance of the external transmission line (MT), so that reflection phenomena are avoided and the laser diode module is made suitable for use in systems with considerably higher bit rates than 1 Gbit/s, the aforesaid guide pin (9) forms the inner guide of a coaxial transmission line situated inside the casing, of which transmission line the outer guide (CBL) is electrically conductively connected to the casing, whereas in the connecting line between the inner guide (9) and the laser diode (LD) a resistor (CS) is inserted having a value such that the sum of the resistances of this resistor (CS) and the laser diode (LD) is substantially equal to the characteristic impedance of the coaxial transmission line (9, CBL).

Claims

1. A laser diode module comprising:

a rectangular box-shaped metal casing with a bottom, two long and two short side walls, a tubular passage for a glass fiber being provided in one of the short side walls, and in which at least six guide pins are passed through the bottom in a standardized DIL order, at least one of the guide pins being inserted in the bottom by means of an electrically conductive material and the remaining guide pins being inserted in the bottom by means of feedthrough insulators;

a sheet-like metal base carrier having a electrically conductive coupling with the casing, on which base carrier are mounted a first subcarrier with a laser diode attached to it, a support for mounting the glass fiber in a manner such that its end faces the front facet of the laser diode, and a second subcarrier with the photodiode attached to it; and

connecting lines for electrically connecting the laser diode, the photodiode and the metal base carrier to the respective guide pins, characterized in that the guide pin for electrically connecting the laser diode, which pin is inserted in the bottom by means of a feedthrough insulator, forms, only inside the casing and substantially throughout its entire length inside the casing, the inner guide of a coaxial transmission line whose outer guide is electrically conductively connected to the casing, and in the connecting line between the linear guide and the laser diode a resistor is inserted having a value such that the sum of the resistances of this resistor and the laser diode is substantially equal to the characteristic impedance of the coaxial transmission line.

2. A laser diode module as claimed in claim 1, characterized in that the outer conductor has at least one flat side face which is electrically conductively connected over its entire surface to the associated long side wall of the casing.

3. A laser diode module as claimed in claim 1, wherein the laser diode module further includes a thermoelectric cooler with two thermal contact faces, one of which being thermoconductively coupled to the bottom of the metal casing and the other contact face being thermoconductively connected to the base carrier, on which base carrier is installed a thermistor thermally coupled to the base carrier, and the laser diode module further includes connecting lines for electrically connecting the thermistor and the thermoelectric cooler to the respective guide pins, characterized in that inside the casing, in parallel with the long and short side walls, a rod of electrically conductive material is provided which, over its entire length, is electrically conductively connected to a long side wall of the casing, an electrical coupling also being provided between the head face of the rod and the base carrier.

4. A laser diode module as claimed in claim 2, characterized in that the outer guide of the coaxial transmission line is formed by a rod having a circular cylindrical feedthrough for the inner guide and that the head face of the rod is electrically conductively connected to the base carrier.

5. A laser diode module as claimed in claim 1, wherein an insulating spacer having at its top side at least one electrically conductive contact face is installed on the base carrier, characterized in that the resistor is installed on the top side of the spacer between the two conductive contact faces.

6. A laser diode module as claimed in claim 1, characterized in that the resistor is installed on a head face of the outer guide of the coaxial transmission line with insulating material inserted therebetween.

7. A laser diode module as claimed in claim 3, characterized in that at least one of the respective electrically conductive connections, connecting the said head face of the rod to the base carrier and the resistor to the inner guide as well as the laser diode, is realized in the form of a relatively wide connecting strip.

8. A laser diode module as claimed in claim 3, characterized in that the length of the rod is substantially equal to the distance between the bottom of the casing and the top of the base carrier.

9. A laser diode module as claimed in claim 3, characterized in that the maximum rod dimension in the direction perpendicular to the relevant long side wall of the casing is not larger than the distance between this side wall and the facing side of the base carrier.

10. A rectangular box-like metal casing suitable for use in a laser diode module as claimed in claim 1, having a bottom, two long and two short side walls, a tubular feedthrough for a glass fiber being mounted in one of the short side walls, and at least six guide pins being fed through the bottom in a standardized DIL order, at least one of the guide pins being inserted in the bottom by means of electrically conductive material and further guide pins being installed in the bottom by means of feedthrough insulators, characterized in that the guide pin intended for connecting the laser diode and inserted in the bottom by means of the feedthrough insulator forms the inner guide of a coaxial transmission line situated inside the casing, while its outer guide is electrically conductively connected to the casing.

11. A casing as claimed in claim 10, characterized in that the outer guide of the coaxial transmission line comprises at least one flat side face which over its entire surface is electrically conductively connected to the associated long side wall of the case.

12. A casing as claimed in claim 11, characterized in that the outer guide of the coaxial transmission line is formed by a rod having a circular cylindrical feedthrough for the inner guide.

13. A casing as claimed in claim 11, characterized in that the length of the outer guide of the coaxial transmission line is substantially equal to the distance between the bottom and the casing of the top of a base carrier of the laser diode module to be installed inside the casing.

14. A casing as claimed in claim 10, characterized in that the maximum dimension of an outer guide of the coaxial transmission line in the direction perpendicular to the associated long side wall of the casing is not larger than the distance between this side wall and the facing side of the base carrier to be installed inside the casing.

15. A laser diode module as claimed in claim 2, wherein the laser diode module further includes a thermoelectric cooler with two thermal contact faces, on of which being thermoconductively coupled to the bottom of the metal casing and the other contact face being thermoconductively connected to the base carrier, on which base carrier is installed a thermistor thermally coupled to the base carrier, and the laser diode module further includes connecting lines for electrically connecting the thermistor and the thermoelectric cooler to the respective guide pins, characterized in that inside the casing, in parallel with the long and short side walls, a rod of electrically conductive material is provided which, over its entire length, is electrically conductive connected to a long side wall of the casing, an electrically coupling being provided between the head face of the rod and the base carrier.

16. A laser diode module as claimed in claim 15, characterized in that the outer guide of the coaxial transmission line is formed by a rod having a circular cylindrical feedthrough for the inner guide and that the head face of the rod is electrically conductively connected to the base carrier.

17. A laser diode module as claimed in claim 3, characterized in that the outer guide of the coaxial transmission line is formed by a rod having a circular cylindrical feedthrough for the inner guide and that the head face of the rod is electrically conductive connected to the base carrier.