Resistor under wirebond pad
First Claim
Patent Images
1. IC apparatus comprising:
- (a) a semiconductor substrate, having active circuitry formed thereon;
(b) a resistor including a layer of polysilicon disposed over said substrate;
(c) a wirebond pad, said wirebond pad being remote from said active circuitry;
(d) a first group of contacts, contacting said wirebond pad to said resistor; and
(e) a second group of contacts, contacting said resistor to other circuitry located on said substrate;
wherein said wirebond pad is disposed over a portion of said resistor.
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Abstract
A preferred embodiment of the invention is a poly input resistor located underneath, rather than alongside, an IC wirebond pad. This offers the advantages of a more efficient layout, more contacts connecting the pad to the resistor, a better contact configuration, and a larger, higher current resistor.
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Citations
12 Claims
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1. IC apparatus comprising:
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(a) a semiconductor substrate, having active circuitry formed thereon; (b) a resistor including a layer of polysilicon disposed over said substrate; (c) a wirebond pad, said wirebond pad being remote from said active circuitry; (d) a first group of contacts, contacting said wirebond pad to said resistor; and (e) a second group of contacts, contacting said resistor to other circuitry located on said substrate; wherein said wirebond pad is disposed over a portion of said resistor. - View Dependent Claims (2, 3)
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4. IC apparatus comprising:
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(a) a semiconductor substrate of a first conductivity type; (b) a resistor including a well of a second conductivity type in said substrate; (c) a wirebond pad; (d) a first group of contacts, contacting said wirebond pad to said resistor; and (e) a second group of contacts, contacting said resistor to other circuitry located on said substrate; wherein said wirebond pad is disposed over a portion of said resistor. - View Dependent Claims (5, 6)
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7. IC apparatus comprising:
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(a) a semiconductor substrate, having active circuitry formed thereon; (b) a resistor including a layer of polysilicon disposed over said substrate; (c) a wirebond pad, said wirebond pad being remote from said active circuitry; (d) a first group of contacts, contacting said wirebond pad to said resistor; and (e) a second group of contacts, contacting said resistor to other circuitry located on said substrate; wherein said wirebond pad is substantially disposed over said resistor. - View Dependent Claims (8, 9)
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10. IC apparatus comprising:
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(a) a semiconductor substrate of a first conductivity type, said substrate having active circuitry formed thereon; (b) a resistor including a well of a second conductivity type in said substrate; (c) a wirebond pad, said wirebond pad being remote from said active circuitry; (d) a first group of contacts, contacting said wirebond pad to said resistor; and (e) a second group of contacts, contacting said resistor to other circuitry located on said substrate; wherein said wirebond pad is substantially disposed over said resistor. - View Dependent Claims (11, 12)
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Specification