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Apparatus for automatic separation along predetermined bending fracture lines in basic ceramic platelets of hybrid electronic circuits

  • US 5,069,195 A
  • Filed: 06/13/1989
  • Issued: 12/03/1991
  • Est. Priority Date: 06/16/1988
  • Status: Expired due to Fees
First Claim
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1. An apparatus for automatically subdividing a basic ceramic platelet of hybrid electronic circuits into a plurality of single elements along a plurality of predetermined bending-fracture lines of said platelet, said apparatus comprising:

  • a support plate having a lower face and an upper face spaced from said lower face and parallel thereto, said upper face being juxtaposed with the ceramic platelet, said lower face being provided with;

    a plurality of intersecting grooves open at and traversing said lower face, said grooves extending upwardly toward said upper face but terminating at a distance therefrom, said grooves forming boundaries defining a plurality of bays of said plate therebetween and defining bending lines connecting said bays and being in registry with the fracture lines of the platelet, said bays being rigid upon a successive bending of said support plate along said bending lines;

    means juxtaposed with said upper face of the plate for pressing each of the plurality of single elements to be separated against the respective bay of said plate;

    a fixed support juxtaposed with said lower face of the plate and being in a continuous contact with one of said bays;

    a plurality of retractable members facing said lower face of the plate and acting against others of said bays; and

    means for controlling the retraction of said retractable members in a predetermined sequence upon the successive bending of said plate and the platelet by said means for pressing along said bending lines, so that the ceramic platelet is subdivided in the plurality of single elements along the fracture lines of the platelet.

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