Full wafer integrated circuit testing device
First Claim
1. An integrated circuit testing device simultaneously connected to a plurality of subject integrated circuits for testing substantially all of said plurality of subject integrated circuits formed on a semiconductor wafer, said testing device connected to and operating in conjunction with a test control unit, said testing device comprising:
- a support wafer;
a plurality of probe units formed on said support wafer, each one of said plurality of probe units for testing respective ones of said plurality of subject integrated circuits and comprising a plurality of probe tips operable to communicate with respective nodes associated with a respective subject integrated circuit; and
at least one active interface cirucuit formed on said support wafer and connected between said test control unit and said probe units for selectively controlling data transmitted between the test control unit and the subject integrated circuits.
1 Assignment
0 Petitions
Accused Products
Abstract
A full wafer integrated circuit testing device (10) tests integrated circuits (15) formed as a wafer in conjunction with a test control unit (40). Probe units (14) associate with respective integrated circuits (15). Probe tips (16) on probe units (14) communicate with respective pads (19) with the integrated circuits (15). Interface circuitry (36) selectively communicates test data between the test control unit (40) and the integrated circuit (15). Test pins (16) have positions on probe units (14) associated with respective integrated circuit connection points (19) for testing associated integrated circuit (15) components. Interface circuitry (36) includes comparators (54 and 56) that compare signals between the integrated circuit (15) and the test control unit (40). Memory components (66 and 68) store data associated with signals from test control unit (40) and said integrated circuit (15). Compliant material (32) assures that probe tips (16) throughout probe card (10) positively and conductively engage integrated circuit pads (19) of all associated integrated circuits (15) of a wafer.
474 Citations
32 Claims
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1. An integrated circuit testing device simultaneously connected to a plurality of subject integrated circuits for testing substantially all of said plurality of subject integrated circuits formed on a semiconductor wafer, said testing device connected to and operating in conjunction with a test control unit, said testing device comprising:
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a support wafer; a plurality of probe units formed on said support wafer, each one of said plurality of probe units for testing respective ones of said plurality of subject integrated circuits and comprising a plurality of probe tips operable to communicate with respective nodes associated with a respective subject integrated circuit; and at least one active interface cirucuit formed on said support wafer and connected between said test control unit and said probe units for selectively controlling data transmitted between the test control unit and the subject integrated circuits. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. An integrated circuit testing device simultaneously connected to a plurality of subject integrated circuits for testing substantially all of a plurality of subject integrated circuits formed on a semiconductor wafer, said testing device connected to and operating in conjunction with a test control unit, said testing device comprising:
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a support wafer; a plurality of probe units formed on the support wafer by integrated circuit fabrication processes, each one of said plurality of probe units for testing respective ones of said plurality of subject integrated circuits and comprising a plurality of probe tips integrally mounted to said probe units and operable to communicate with respective nodes associated with a respective integrated circuit; and at least one active interface circuit formed within the wafer and connected between said test control unit and said probe unit for selectively processing data transmitted between the test control unit and the subject integrated circuits. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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24. An integrated circuit testing system for testing substantially all integrated circuits on a single semiconductor wafer, comprising:
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a test control unit for generating and receiving test signals; an integrated circuit testing device simultaneously connected to a plurality of subject integrated circuits for testing substantially all of said subject integrated circuits formed on a wafer, said testing device connected to and operating in conjunction with said test control unit, said integrated circuit test device comprising; a support wafer; a plurality of probe units formed on said support wafer, each one of said plurality of probe units for testing respective ones of said plurality of subject integrated circuits and comprising a plurality of probe tips operable to communicate with respective nodes associated with a respective integrated circuit; and at least one active interface circuit formed on said support wafer and connected between said test control unit and a probe unit for selectively controlling data transmitted between the test control unit and the subject integrated circuits.
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25. A method of integrated circuit testing for testing substantially all of a plurality of subject integrated circuits formed as a wafer in conjunction with a test control unit, comprising:
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communicating between nodes associated with each of the subject integrated circuits and a plurality of probe units formed on a support wafer, said probe units associated with each of the respective integrated circuits; and selectively controlling the transmission of data between the test control unit and the subject integrated circuits. - View Dependent Claims (26, 27, 28, 29, 30, 31, 32)
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Specification