Process for forming extremely thin integrated circuit dice

• US 5,071,792 A
• Filed: 11/05/1990
• Issued: 12/10/1991
• Est. Priority Date: 11/05/1990
• Status: Expired due to Fees

• Current Assignee: Harris Corporation (L3Harris Technologies, Inc.)
• Original Assignee: Harris Corporation (L3Harris Technologies, Inc.)
• Inventors: VanVonno, Nicolaas W., Matlock, Dyer A.
• Primary Examiner(s): NOT, DEFINED
• Assistant Examiner(s): Kutz, Steve
• Application Number:
  US07/613,091
• Time in Patent Office: 400 Days
• Field of Search: 437/227, 437/226, 437/228, 437/209, 437/974, 437/249, 156/645, 141/DIG. 51, 141/DIG. 28
• US Class Current: 438/17
• CPC Class Codes: H01L 21/30604 Chemical etching
• CPC Class Codes: H01L 21/78 with subsequent division of the substrate into plural individual devices cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L21/304
• CPC Class Codes: H01L 2221/68363 used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
• CPC Class Codes: H01L 2225/06551 Conductive connections on the side of the device
• CPC Class Codes: H01L 2225/06555 Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
• CPC Class Codes: H01L 2225/06596 Structural arrangements for testing
• CPC Class Codes: Y10S 438/977 Thinning or removal of substrate

Abstract

A wafer processing technique separates an extremely thin wafer into a plurality of completed circuit-containing dice without having to directly handle the wafer. In one embodiment, a substrate is thinned by forming a trench pattern in its top surface, the trench depth being the intended thickness of the die. A polishing resistant material is then formed in the trench and planarized down to a topside passivating layer, which is patterned to expose surface test regions. After wafer-probe testing, the wafer is affixed face-down on a support handle by means of an adhesion material such as wax. The substrate is backside-lapped down to the stop material in the trench, leaving a thin wafer layer. After the trench material is removed. Individual dice are separated from the support handle by melting the wax. In a further embodiment, a thin wafer layer if formed on a buried oxide layer. After trench patterning and face-down wax-mounting, the support substrate is polished down to the buried insulator layer. The buried oxide layer is then etched off. The dice are removed by heating the wax. In another embodiment, an etch resistant material is formed on the passivating layer and on the sidewalls of the trench, with a floor portion of the trench pattern exposing the buried oxide. An etchant is then applied to the buried oxide by way of the exposed floor portion of the trench pattern, so as to etch away the buried oxide, thereby lifting off the dice from the support substrate.

Claims

1. A method of manufacturing a semiconductor device comprising the steps of:

(a) providing a semiconductor substrate containing integrated circuit components formed in a first surface thereof and having a passivating layer formed on said first surface of said substrate overlying said integrated circuit components;

(b) forming a trench pattern through said passivating layer into said first surface of said substrate;

(c) forming a layer of a prescribed material in said trench pattern;

(d) selectively patterning said passivating layer to expose surface areas of said integrated circuit components;

(e) mounting said semiconductor substrate on a support member such that the first surface of said semiconductor substrate faces said support member;

(f) removing material from a second surface of said semiconductor substrate, opposite to said first surface, so as to effect a thinning of said substrate down to a level which exposes said prescribed material in said trench pattern;

(g) removing said prescribed material from said trench pattern, thereby leaving a plurality of spaced apart semiconductor dice that are supported by way of said support member; and

(h) removing said plurality of dice from said support member.

2. A method according to claim 1, wherein step (e) comprises joining said semiconductor substrate to said support member by way of a layer of adhesion material that adheres said support member to said passivating layer, and step (h) comprises separating said plurality of dice from said support member by relieving the adhering property of adhesion material.

3. A method according to claim 2, wherein said adhering material comprises wax and step (h) comprises melting said wax.

4. A method according to claim 1, wherein step (d) includes the step of testing said integrated circuit components by way of exposed surface areas of said integrated circuit components.

5. A method according to claim--1, wherein step (c) comprises filling said trench pattern with a fill material the resistance of which to physical removal is greater than that of said semiconductor substrate.

6. A method according to claim 5, wherein step (c) comprises non-selectively depositing one or more layers of fill material on the structure resulting from step (b) so as to fill said trench pattern with said fill material.

7. A method according to claim 6, wherein said fill material contains at least one of silicon nitride, tungsten and silicon carbide.

8. A method according to claim 5, wherein step (c) comprises non-selectively depositing a first layer of fill material on the structure resulting from step (b), so as to form said first layer of fill material in said trench and on said passivating layer, and non-selectively depositing a second layer of fill material on said first layer of fill material, so as to fill the remainder of said trench pattern with said second layer of fill material, and thereafter removing said first and second layers of fill material down to the surface of said passivating layer, so that said first and second layers of fill material remain in said trench pattern.

9. A method according to claim 8, wherein said first layer of fill material comprises silicon nitride and said second layer of fill material includes tungsten or silicon carbide.

10. A method according to claim 8, wherein step (g) comprises etching said first layer of fill material so as to cause said second layer of fill material to be lifted out.

11. A method according to claim 1, wherein step (c) comprises forming, as said layer of prescribed material, a layer of etchable material on floor and wall portions of said trench pattern.

12. A method of manufacturing a semiconductor device comprising the steps of:

(a) providing a planar semiconductor wafer having integrated circuit components formed in a first surface thereof and a passivating overcoat layer formed on said first surface of said semiconductor wafer overlying said integrated circuit components;

(b) forming a trench pattern through said passivating layer to a depth in said wafer which defines the intended thickness of semiconductor circuit-containing die to be obtained from said wafer;

(c) filling said trench pattern with a trench fill material the resistance of which to physical removal is greater than that of said semiconductor wafer;

(d) selectively patterning said passivating layer to expose surface areas of said integrated circuit components and testing said integrated circuit components by way of their exposed surface areas;

(e) adhering said planar semiconductor wafer, first surface down, onto a planar support member;

(f) removing, by mechanical polishing, material from a second surface of said planar semiconductor wafer, opposite to said first surface, so as to effect a thinning of said wafer down to a level which exposes said trench fill material;

(g) removing said trench fill material from said trench pattern, so that a plurality of spaced-apart semiconductor dice are supported by way of said support member; and

(h) removing said plurality of dice from said support member.

13. A method according to claim 12, wherein step (e) comprises joining said semiconductor wafer to said support member by way of a layer of adhesion material that adheres said support member to the passivating layer of said wafer, and step (h) comprises separating said plurality of dice from said support member by relieving the adhering property of said layer of adhesion material.

14. A method according to claim 13, wherein step (c) comprises non-selectively depositing a first layer of fill material on the structure resulting from step (b) so as to form said first layer of fill material in said trench and on said passivating layer, and non-selectively depositing a second layer of fill material on said first layer of fill material, so as to fill said trench pattern with said first and second layers of fill material and form said first and second layers of fill material on said passivating layer, and thereafter removing said first and second layers of fill material from said passivating layer, so that said first and second layers of fill material remain in said trench pattern.

15. A method according to claim 14, wherein said first layer of fill material comprises nitride and said second layer of fill material comprises tungsten or silicon carbide.

16. A method according to claim 14, wherein step (g) comprises etching said first layer of fill material so as to cause said second layer of fill material to be lifted out.

17. A method according to claim 12, wherein said trench fill material is one selected from the group consisting of silicon, carbide and tungsten.

18. A method according to claim 12, wherein step (c) comprises non-selectively depositing a nitride layer on the structure resulting from step (b) so as to form said nitride layer in said trench and on said passivating layer, and removing said nitride layer from said passivating layer, so that said nitride layer is formed only in said trench pattern.

19. A method according to claim 18, wherein step (c) the structure resulting from step (b) so as to form said buffer layer in said trench and on said passivating layer, non-selectively depositing a further polishing stop layer on said nitride layer, so as to fill said trench pattern with polishing stop layer and form said polishing stop layer on said passivating layer, and thereafter removing said polishing stop layer and said buffer nitride layer from said passivating layer, so that said buffer nitride layer and said polishing stop layer remain as a fill layer in said trench pattern.

20. A method according to claim 19, wherein said further polishing stop layer comprises tungsten or silicon carbide.

21. A method of manufacturing a semiconductor device comprising the steps of:

(a) providing a substrate having a semiconductor layer containing integrated circuit components formed in a first planar surface thereof, a passivating layer being formed on said first planar surface so as to extend over integrated circuit components therebeneath, and having a buried insulator layer formed beneath said integrated circuit components, said substrate having material beneath said buried insulator layer;

(b) forming a trench pattern through said passivating layer and the thickness of said semiconductor layer down to said buried insulator layer;

(c) filling said trench pattern with a prescribed trench fill material;

(d) mounting the structure resulting from step (c) on a layer faces said support member;

(e) removing said material of said substrate beneath said buried insulator layer so as to expose said buried insulator layer;

(f) removing said buried insulator layer, thereby exposing said trench fill material in said trench pattern;

(g) removing said trench fill material from said trench pattern, so that a plurality of spaced apart semiconductor dice are supported by way of said support member; and

(h) removing said plurality of dice from said support member.

22. A method according to claim 21, wherein step (c) comprises removing said passivating layer and non-selectively forming said trench fill material on said first surface of said semiconductor layer and in said trench pattern.

23. A method according to claim 22, wherein said trench fill material comprises a layer of adhesion material that adheres said support member to said first surface of said semiconductor layer, and step (h) comprises separating said plurality of dice from said support member by relieving the adhering property of said adhesion material.

24. A method according to claim 23, wherein said adhesion material comprises wax and step (h) comprises melting said wax.

25. A method of manufacturing a semiconductor device comprising the steps of:

(a) providing a substrate having a semiconductor layer containing integrated circuit components formed in a first planar surface thereof, a passivating layer being formed on said first planar surface so as to extend over integrated circuit components therebeneath, and having a buried insulator layer formed beneath said integrated circuit components, said substrate having material beneath said buried insulator layer;

(b) forming a trench pattern through said passivating layer and the thickness of said semiconductor layer down to said buried insulator layer, so as to separate said semiconductor layer into a plurality of semiconductor dice supported on said buried insulator layer;

(c) forming etch resistant material on said passivating layer and on sidewalls of said trench pattern, with a floor portion of said trench pattern exposing said buried insulator layer; and

(e) applying an etchant to said buried insulator layer by way of the exposed floor portion of said trench pattern, so as to etch 1 away said buried insulator layer and thereby remove said plurality of semiconductor dice from substrate material beneath said buried insulator layer.

26. A method according to claim -25, wherein said buried insulator layer is doped with impurities that accelerate the etching of said buried insulator layer by said etchant.

27. A method according to claim 26, wherein said buried insulator layer comprises an oxide layer heavily doped with phosphorous and said etchant comprises a concentrated hydrogen fluoride etchant solution.

28. A method according to claim 25, wherein step (e) comprises immersing the structure resulting from step (d) in an etchant solution, so as to etch said buried insulator layer by way of the exposed floor portion of said trench pattern, and thereby remove said plurality of semiconductor dice from substrate material beneath said buried insulator layer.