Microdynamic release structure
First Claim
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1. A microdynamic structure, comprising:
- a substrate having a top surface;
insulator means on said substrate, said insulator means forming a beam support means;
an elongated metal cantilever beam mounted on said insulator beam support means and having a length extending over and spaced above said substrate top surface;
electrode means adjacent said beam; and
means supplying electrical potential between said beam and said electrode means, said potential producing deflection of said beam along the length thereof and in a direction parallel to said substrate top surface.
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Abstract
A selective chemical vapor deposition (CVD) tungsten process is used to fabricate three-dimensional tungsten cantilever beams on a substrate. Two beams form micromechanical tweezers that move in three dimensions by the application of potential differences between the beams, and between the beams and the silicon substrate. A high deposition rate selective tungsten CVD process is used to fabricate beams of greater than 3 micrometers thickness in patterned, CVD silicon dioxide trenches ion-implanted with silicon. Tweezers 200 micrometers in length with a cross section of 2.7 by 2.5 micrometers will close upon application of a voltage of less than 150 volts.
127 Citations
23 Claims
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1. A microdynamic structure, comprising:
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a substrate having a top surface; insulator means on said substrate, said insulator means forming a beam support means; an elongated metal cantilever beam mounted on said insulator beam support means and having a length extending over and spaced above said substrate top surface; electrode means adjacent said beam; and means supplying electrical potential between said beam and said electrode means, said potential producing deflection of said beam along the length thereof and in a direction parallel to said substrate top surface. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A microdynamic tweezer structure, comprising:
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a substrate having a top surface, a layer of insulating material on said substrate; a cavity formed in said layer of insulating material, said cavity including at least one side wall; and first and second elongated cantilever beams, each beam having a near end embedded in said insulating material at said cavity side wall and having a free end extending into said cavity, the free ends of said beams being spaced from the walls of said cavity for free motion with respect to each other at least in a horizontal plane which includes both of said beams and with respect to said substrate in a direction perpendicular to said horizontal plane. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A three-dimensional microdynamic structure comprising:
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a semiconductor substrate having a surface defining an X-Y plane; an insulator layer on said substrate; a metal line formed in said insulator layer and spaced from said substrate surface, said metal line having a terminal end portion; cavity means in said insulator layer, said cavity means being located at said terminal end portion of said metal line to release said terminal end portion from said insulator layer to allow motion thereof in an X-Y plane parallel to said substrate surface and in a Z direction perpendicular to said substrate; electrode means adjacent said metal line; and circuit means connected to said metal line for applying an electrostatic potential between said terminal end portion and said electrode means to produce motion of said terminal end portion in said X-Y plane and in said Z direction, selectively, with respect to said substrate. - View Dependent Claims (20, 21, 22, 23)
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Specification