Temperature sensor for an ink jet printhead

• US 5,075,690 A
• Filed: 12/18/1989
• Issued: 12/24/1991
• Est. Priority Date: 12/18/1989
• Status: Expired due to Term

• Current Assignee: Xerox Corporation (Xerox Holdings Corp.)
• Original Assignee: Xerox Corporation (Xerox Holdings Corp.)
• Inventors: Kneezel, Gary A.
• Primary Examiner(s): Fuller, Benjamin R.
• Assistant Examiner(s): Devito, Victor
• Application Number:
  US07/452,178
• Time in Patent Office: 736 Days
• Field of Search: 346/140 R, 346/76 ph, 346/1.1, 338/195
• US Class Current: 347/17
• CPC Class Codes: B41J 2/04563 detecting head temperature; Ink temperature
• CPC Class Codes: B41J 2/0458 controlling heads based on heating elements forming bubbles
• CPC Class Codes: B41J 2/14153 Structures including a sensor
• CPC Class Codes: B41J 2/1604 of the edge shooter type
• CPC Class Codes: B41J 2/1634 laser machining

Abstract

An ink jet printhead is fabricated with a resistive temperature sensor formed adjacent to the heater resistors and, in a preferred embodiment, of the same material. Temperature sensing variations between a plurality of printheads used in the same printer is achieved by trimming the termistors to the desired resistance value while holding the printhead at the nominal set temperature. In one embodiment, the heater resistor and thermistor are formed within the same polysilicon layer, and the resistor trimmed therein. In a second embodiment, a thick or thin film resistor is formed of bonded in series with the polysilicon thermistor with the trimming being accomplished at the thick, or thin film resistor.

Claims

1. A thermal ink jet printhead including:

a silicon substrate,

a polysilicon ink heating resistive layer disposed within said substrate comprising individual resistive elements in communication with adjacent ink filled channels,

a temperature-sensitive polysilicon resistive layer disposed within said substrate and proximate to said polysilicon ink heating resistive layer, said temperature sensitive polysilicon resistive layer having a resistance value established by a trimming operation implemented while the printhead is at operating temperature and

a temperature control circuit electrically connected to said temperature sensitive polysilicon resistive layer.

2. A thermal ink jet printhead including:

a silicon substrate,

a polysilicon, ink heating resistive layer disposed within said substrate comprising individual resistive elements in communication with adjacent ink filled channels,

a temperature-sensitive polysilicon resistive layer disposed within said substrate and proximate to said polysilicon ink heating resistive layer,

a resistive element formed contiguous to said silicon substrate and connected in series with said temperature-sensitive polysilicon resistive layer, said resistive element having a resistance value established by a trimming operation implemented when the printhead is at operating temperature,

and a temperature control circuit electrically connected to said resistive element.

3. A method for maintaining accurate temperature measurements of a thermal ink jet printhead comprising the steps of:

forming an ink-heating resistive layer with a silicon substrate, said ink-heating resistive layer comprising individual resistive elements in communication with adjacent ink-filled channels,

forming a temperature-sensitive resistive thermistor layer within said silicon substrate and proximate to said ink-heating resistive layer,

maintaining said printhead at a desired operating temperature while trimming said temperature-sensitive resistive layer to a desired resistance value and,

providing an electrical connection between said temperature-sensitive resistive thermistor layer and a temperature control circuit.

4. A method for maintaining accurate temperature measurements of a thermal ink jet printhead comprising the steps of:

forming an ink-heating resistive layer within a silicon substrate, said ink-heating resistive layer comprising individual resistive elements in communication with adjacent ink-filled channels,

forming a resistive thermistor layer within said silicon substrate and proximate to said ink-heating resistive layer,

forming a thick film resistor in series with said resistive thermistor layer and

trimming said thick film resitor to a desired resistance while maintaining said printhead at a desired operating temperature.