DC to DC converter apparatus
First Claim
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1. An improved DC to DC converter apparatus comprising:
- a generally rectangular, metal-backed first PC board including a metal layer, an insulating layer and a first circuit layer, the insulating layer being sandwiched between said metal layer and said first circuit layer, said first board having a first surface region and a second surface region, said second region having a plurality of electrical circuit components disposed thereon and electrically connected to conductive traces forming said first circuit layer;
a second PC board comprised of a dielectric substrate having a second circuit layer on one side, said second board having mounted thereto a plurality of electrical circuit components and input and output pins electrically interconnected by the conductive traces of said second circuit layers;
electrically conductive means affixing said second board to said first board in proximate, spaced apart relationship to said first region, said electrically conductive means serving to electrically interconnect the circuit traces of said first and second boards and to thermally interconnect said second board with said first board; and
potting means encapsulating said first and second boards and their associated electrical components with only said input-output pins extending therefrom, one side of said first board forming a heat conducting external surface of the encapsulated device.
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Abstract
An improved DC to DC converter apparatus including a metal-backed PC board which serves as the base plate of the device and has the principal power consuming components affixed thereto, and a conventional circuit board having the relatively lower power consuming electronic components affixed to it, the latter board being secured in closely spaced relationship to the metal-backed board using connecting elements which provide both electrical and thermal interconnection between the two boards. All device connect pins extend from the conventional board, and the entire device is potted in a thermally conductive potting material.
67 Citations
20 Claims
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1. An improved DC to DC converter apparatus comprising:
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a generally rectangular, metal-backed first PC board including a metal layer, an insulating layer and a first circuit layer, the insulating layer being sandwiched between said metal layer and said first circuit layer, said first board having a first surface region and a second surface region, said second region having a plurality of electrical circuit components disposed thereon and electrically connected to conductive traces forming said first circuit layer; a second PC board comprised of a dielectric substrate having a second circuit layer on one side, said second board having mounted thereto a plurality of electrical circuit components and input and output pins electrically interconnected by the conductive traces of said second circuit layers; electrically conductive means affixing said second board to said first board in proximate, spaced apart relationship to said first region, said electrically conductive means serving to electrically interconnect the circuit traces of said first and second boards and to thermally interconnect said second board with said first board; and potting means encapsulating said first and second boards and their associated electrical components with only said input-output pins extending therefrom, one side of said first board forming a heat conducting external surface of the encapsulated device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 15, 16, 17, 18, 19, 20)
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14. An improved DC to DC converter apparatus as recited in claim wherein said second board is generally L-shaped in configuration and lies entirely within said potting means.
Specification
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Current AssigneeAstrodyne Corp. (Astrodyne Holding Corp.)
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Original AssigneeRO Associates
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InventorsMcDonnal, John E.
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Primary Examiner(s)Tolin, Gerald P.
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Assistant Examiner(s)WHANG, YOUNG
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Application NumberUS07/609,751Time in Patent Office414 DaysField of Search361/386, 361/387, 361/388, 361/392, 361/395, 361/396, 361/412, 361/413, 361/414, 174/52.2, 174/252, 165/80.3, 165/185, 357/81US Class Current361/721CPC Class CodesH02M 3/003 Constructional details, e.g...H05K 1/144 Stacked arrangements of pla...H05K 7/209 Heat transfer by conduction...
