Power MOSFET transistor circuit with active clamp

• US 5,079,608 A
• Filed: 11/06/1990
• Issued: 01/07/1992
• Est. Priority Date: 11/06/1990
• Status: Expired due to Term

• Current Assignee: Fairchild Semiconductor Corporation (ON Semiconductor Corporation)
• Original Assignee: Harris Corporation (L3Harris Technologies, Inc.)
• Inventors: Wodarczyk, Paul J., Yedinak, Joseph A., Neilson, John M. S., Jones, Frederick P.
• Primary Examiner(s): Jackson, Jr., Jerome
• Application Number:
  US07/609,685
• Time in Patent Office: 427 Days
• Field of Search: 357/23.13, 357/23.4, 357/13, 361/101
• US Class Current: 257/355
• CPC Class Codes: H01L 27/0251 for MOS devices
• CPC Class Codes: H01L 29/0696 of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
• CPC Class Codes: H01L 29/7802 Vertical DMOS transistors, i.e. VDMOS transistors
• CPC Class Codes: H01L 29/7808 the other device being a breakdown diode, e.g. Zener diode
• CPC Class Codes: H03K 17/0822 in field-effect transistor switches

Abstract

A power MOS transistor, including source, drain, and gate electrodes, comprises a substrate of a semiconductor material of one conductivity type having first and second opposed surfaces; a drain region extending through the substrate between the surfaces; a plurality of spaced body regions of the opposite conductivity type extending into the substrate from the first surface; and a source region of the one conductivity type extending into the substrate from the first surface within each of the body regions, the interface of each of the source regions with its respective body region at the first surface being spaced from the interface of its respective body region and the drain region at the first surface to form a channel region therebetween. A gate electrode overlies and is insulated from the first surface and extends across the channel regions. A conductive electrode extends over and is insulated from the gate electrode, and contacts at least a portion of the source regions. A current limiting circuit is coupled between the conductive electrode and the gate electrode and a voltage limiting circuit is coupled between the drain electrode and the gate electrode.

Claims

1. A power MOS transistor, including source, drain, and gate electrodes, comprising:

a substrate of a semiconductor material of one conductivity type having first and second opposed surfaces;

a drain region extending through said substrate between said surfaces;

a plurality of spaced body regions of the opposite conductivity type extending into said substrate from said first surface;

a plurality of source regions of the one conductivity type extending into said substrate from said first surface within each of said body regions, the interface of each of said source regions with its respective body region at said first surface being spaced from the interface of its respective body region and the drain region at said first surface to form a channel region therebetween;

a conductive gate overlying and being insulated from said first surface and extending across said channel regions;

a conductive electrode extending over and being insulated from said gate electrode and contacting at least a portion of said source regions;

a current limiting circuit coupled between said conductive electrode and the gate electrode; and

a voltage limiting circuit coupled between said drain electrode and said gate electrode, including Zener diode means and a first diode connected in series, said Zener diode means and first diode being poled for passing current in opposite directions when forward biased, respectively.

2. A power MOS transistor in accordance with claim 1, wherein said zener diode means comprises at least one zener diode.

3. A power MOS transistor in accordance with claim 2, wherein said zener diode means comprises a plurality of zener diodes in series connection.

4. A power MOS transistor in accordance with claim 3, wherein each of said plurality of zener diodes comprises a first well region of said opposite conductivity type extending into said substrate from said first surface serving as one electrode and a region of the one conductivity type extending into said first well region serving as the other electrode.

5. A power MOS transistor in accordance with claim 4, wherein said first diode comprises a region of polysilicon of said first conductivity type serving as one electrode, and a region of polysilicon of the opposite conductivity type, in contact with said region of polysilicon of said first conductivity type, serving as the other electrode.

6. A power MOS transistor in accordance with claim 5, wherein said current limiting circuit comprises a bipolar transistor having emitter, collector, and base electrodes, said base electrode being connected to said conductive electrode, said emitter electrode being connected to a source terminal pad, said collector electrode being connected to said conductive gate and to a gate terminal pad;

and a first resistance connected at one end thereof to said source terminal pad and at the other end thereof to said conductive electrode.

7. A power MOS transistor in accordance with claim 6, wherein said current limiting circuit comprises a second resistance connected between said gate terminal pad and said collector electrode of said bipolar transistor.

8. A power MOS transistor in accordance with claim 7, wherein said current limiting circuit comprises a third resistance connected between said collector electrode of said bipolar transistor and the common connection of said first diode and said gate electrode.

9. A power MOS transistor in accordance with claim 8, wherein said second and third resistances form a low-pass filter in cooperation with a circuit capacitance.

10. A power MOS transistor in accordance with claim 8, wherein said bipolar transistor comprises a second well region of the opposite conductivity type extending into said substrate from said first surface serving as the base region of said bipolar transistor, at least one region of the opposite conductivity type extending into the substrate from said first surface within the well region and serving as the collector electrode of said bipolar transistor, and at least one region of the one conductivity type extending into the substrate from said first surface within said second well region and serving as the emitter electrode of said bipolar transistor.

11. A power MOS transistor in accordance with claim 10, wherein said bipolar transistor comprises a plurality of said emitter regions and a respective collector region surrounding each emitter region.

12. A power MOS transistor in accordance with claim 11, wherein said first resistance comprises at least one strip of an electrically partially conductive material overlying and being insulated from said first surface over a portion of said second well region.

13. A power MOS transistor in accordance with claim 11, wherein said first resistance comprises a plurality of strips of an electrically conductive material overlying and being insulated from said first surface over a portion of said second well region.

14. A power MOS transistor in accordance with claim 13, wherein said second diode comprises a third well region of the opposite conductivity type in said substrate at said first surface and spaced from said second well region, and a region of the one conductivity type in the substrate at said first surface within said third well and forming a PN junction with said third well.

15. A power MOS transistor in accordance with claim 14, wherein said second resistance comprises a strip of a partially conductive material overlying and being insulated from said first surface and extending between said second and third well regions.

16. A power MOS transistor in accordance with claim 15, wherein said second resistance comprises a strip of the same material as said gate electrode.

17. A power MOS transistor in accordance with claim 16, wherein a strip of said first resistance makes contact with said conductive electrode and with said emitter region of said bipolar transistor, respectively.

18. A power MOS transistor in accordance with claim 17, wherein one end of a strip of said second resistance is electrically connected to the region of the one conductivity type of said second diode and connecting means connects the other end of said strip of said second resistance to said collector region of said bipolar transistor and said gate electrode.

19. A power MOS transistor in accordance with claim 18, wherein said first diode is of the same material as said gate electrode.

20. A power MOS comprising:

a substrate of a semiconductor material of one conductivity type having first and second opposed surfaces;

a drain region extending through said substrate between said surfaces;

a plurality of spaced body regions of the opposite conductivity type in said substrate at said first surface, each of said body regions forming a body/drain junction with the drain region;

a separate source region of the one conductivity type in said substrate at the first surface and within each body region, each of said source regions forming a source/body junction with its respective body region which is spaced from the body/drain junction of its respective body region to form a channel region therebetween along the first surface, each of the source regions and its respective body region forming a source/body cell;

a conductive gate overlying and being insulated from said first surface and extending across the channel regions;

a conductive electrode overlying and being insulated from said gate and contacting at least a portion of said source/body cells;

.

diode means comprising at least one zener diode in the substrate and a first diode;

first and second resistors overlying and being insulated from said first surface;

a bipolar transistor in said substrate at said first surface having a collector region, an emitter region and a base region;

a second diode in said substrate;

said zener diode means having one electrode thereof connected to said drain region;

said first diode having one electrode thereof connected to the other electrode of said zener diode means, the other electrode of said first diode being connected to said gate electrode;

said first resistor having one end thereof connected to said conductive electrode and to said base region of said bipolar transistor and the other end of said first resistor being connected to a source terminal, and to said emitter region of said bipolar transistor;

the other end of said second diode being connected to a gate terminal and to one end of said second resistor;

the other end of said second resistor being connected to said collector region of said bipolar transistor and to one end of a third resistor; and

the other end of said third resistor being connected to said other electrode of said first diode and said gate electrode.