Method for providing a thermal transfer device for the removal of heat from packaged elements

• US 5,083,373 A
• Filed: 05/21/1991
• Issued: 01/28/1992
• Est. Priority Date: 04/25/1986
• Status: Expired due to Fees

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: William R. Hamburgen
• Inventors: Hamburgen, William R.
• Primary Examiner(s): ROSENBAUM, IRENE CUDA
• Application Number:
  US07/704,898
• Time in Patent Office: 252 Days
• Field of Search: 29/829, 29/890.03, 29/445, 29/462, 29/464, 29/469, 361/386-389, 174/163, 228/183, 228/212, 165/185, 165/80.3, 165/80.4, 437/902, 357/81
• US Class Current: 29/890.03
• CPC Class Codes: H01L 23/433 Auxiliary members in containers characterised by their shape, e.g. pistons
• CPC Class Codes: H01L 23/4338 Pistons, e.g. spring-loaded members
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/4935 Heat exchanger or boiler making
• CPC Class Codes: Y10T 29/49861 Sizing mating parts during final positional association
• CPC Class Codes: Y10T 29/49892 Joining plate edge perpendicularly to frame
• CPC Class Codes: Y10T 29/49904 Assembling a subassembly, then assembling with a second subassembly

Abstract

In order to provide thermal coupling of a package, particularly a package containing electronic components, and a heat sink, a thermal transfer assembly includes a first assembly having a group of generally parallel cooling fins coupled to the package. Coupled to the heat sink, such as cooling plate, is a second assembly also including a plurality of generally parallel cooling fins. The second set of cooling fins is positioned on the heat sink so that when the heat sink is in a predetermined position with respect to the package, the cooling fins overlap. The overlapping cooling fins permit efficient transfer of heat thus permitting heat generated in the package to be conveyed to the heat sink. The overlapping fins also permit convenient disassembly and reassembly for test and maintenance procedures. Techniques for fabrication of the thermal transfer assembly are described along with procedures for improving the operation of the heat transfer assembly. Parameters optimizing the performance of thermal transfer assembly are discussed. The individual components of the thermal transfer unit can be used separately as heat exchange units.

Claims

1. The process for fabricating a thermal transfer device comprising the steps of:

positioning a strip of a spacer material between each member of a first set of parallel thermally conducting unassembled cooling fins and an adjacent member of a second set of parallel thermally conducting unassembled cooling fins interleaved with said first member;

connecting said first set of cooling fins to a first thermally conducting base member to form a first thermal transfer unit;

connecting said second set of thermally conducting cooling fins to a second thermally conducting base member to form a second thermal transfer unit; and

removing said spacer material, wherein said first and said second set of cooling fins are interleaved in an operative thermal transfer configuration.

2. The process for fabricating a thermal transfer device of claim 1 further comprising the steps of coupling said first thermal transfer unit to a heat source and coupling said second thermal transfer unit to a heat sink.

3. The process for fabricating a thermal transfer device of claim 2 further comprising the steps of:

coupling said heat sink to a first structure;

coupling said heat source to a second structure; and

coupling said first and said second structure wherein said first and said second sets of fins can be engaged into and disengaged from said protective configuration.

4. The process for fabricating a thermal transfer device of claim 1 further comprising the steps of:

positioning spacer material between each member of a third set of parallel thermally conducting unassembled cooling fins and an adjacent member of a fourth set of parallel thermally conducting unassembled cooling fins interleaved with said third set;

connecting said third set of cooling fins to said second thermally conducting base member to form an intermediate thermal transfer unit; and

connecting said fourth set of thermally conducting cooling fins to a third thermally conducting base member to form a second thermal transfer unit, wherein said third and said fourth set of cooling fins are interleaved in said operative thermal transfer configuration.

5. A method for providing a thermal transfer device

having a first thermal transfer unit, and

a second thermal transfer unit, said method comprising the steps of:

positioning a strip of a spacer material between each member of a first set of parallel thermally conducting unassembled cooling fins and an adjacent member of a second set of parallel thermally conducting unassembled cooling fins interleaved with said first member;

bonding said first set of cooling fins to a first thermally conducting base member to form said first thermal transfer unit;

bonding said second set of thermally conducting cooling fins to a second thermally conducting base member to form said second thermal transfer unit; and

removing said spacer material, wherein said first and said second set of cooling fins are interleaved in an operative thermal transfer configuration.

6. The method of claim 5 further comprising the step of fabricating said fins and selected said spacer material according to the relationship

7. A method for providing a thermal transfer device

having a first thermal transfer unit, and

a second thermal transfer unit, said method of comprising the steps of:

positioning a strip of spacer material between each member of a first set of parallel thermally conducting unassembled cooling fins and an adjacent member of a second set of parallel thermally conducting unassembled cooling fins interleaved with said first member;

connecting said first set of cooling fins to a first thermally conducting base member to form said first thermal transfer unit;

connecting said second set of thermally conducting cooling fins to a second thermally conducting base member to form said second thermal transfer unit;

removing said spacer material, wherein said first and said second set of cooling fins are interleaved in an operative thermal transfer configuration;

coupling said second thermal transfer unit to a heat sink;

coupling said heat source to a second structure; and

coupling said first and said second structure wherein said first and said second sets of fins can be engaged into and disengaged from said operative configuration.

8. The method of claim 7 further comprising the step of:

compensating for thermal expansion of said first structure by orienting said first set of fins generally parallel to a selected point on said structure.

9. A method of fabricating a thermal transfer device said method of comprising the steps of:

positioning a strip of spacer material between each member of a first set of parallel thermally conducting unassembled cooling fins and an adjacent member of a second set of parallel thermally conducting unassembled cooling fins interleaved with said first member;

connecting said first set of cooling fins to a first thermally conducting base member to form said first thermal transfer unit;

connecting said second set of thermally conducting cooling fins to a second thermally conducting base member to form a second thermal transfer unit; and

removing said spacer material, wherein said first and said second set of cooling fins are interleaved in an operative thermal transfer configuration

positioning spacer material between each member of a third set of parallel thermally conducting unassembled cooling fins and an adjacent member of a fourth set of parallel thermally conducting unassembled cooling fins interleaved with said third set;

connecting said third set of cooling fins to said second thermally conducting base member to form an intermediate thermal transfer unit; and

connecting said fourth set of thermally conducting cooling fins to a third thermally conducting base member to form a second thermal transfer unit, wherein said third and said fourth set of cooling fins are interleaved in said operative thermal transfer configuration.