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Method for providing a thermal transfer device for the removal of heat from packaged elements

  • US 5,083,373 A
  • Filed: 05/21/1991
  • Issued: 01/28/1992
  • Est. Priority Date: 04/25/1986
  • Status: Expired due to Fees
First Claim
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1. The process for fabricating a thermal transfer device comprising the steps of:

  • positioning a strip of a spacer material between each member of a first set of parallel thermally conducting unassembled cooling fins and an adjacent member of a second set of parallel thermally conducting unassembled cooling fins interleaved with said first member;

    connecting said first set of cooling fins to a first thermally conducting base member to form a first thermal transfer unit;

    connecting said second set of thermally conducting cooling fins to a second thermally conducting base member to form a second thermal transfer unit; and

    removing said spacer material, wherein said first and said second set of cooling fins are interleaved in an operative thermal transfer configuration.

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