Non-moire' shielded window forming method

• US 5,084,132 A
• Filed: 01/14/1991
• Issued: 01/28/1992
• Est. Priority Date: 04/13/1989
• Status: Expired due to Term

• Current Assignee: Parker Intangibles LLC (Parker-Hannifin Corporation)
• Original Assignee: Chomerics, Inc. (Parker-Hannifin Corporation)
• Inventors: Smith, David C.
• Primary Examiner(s): Powell, William A.
• Application Number:
  US07/640,670
• Time in Patent Office: 379 Days
• Field of Search: 156/629, 156/633, 156/654, 156/659.1, 156/655, 156/663, 156/668, 430/23, 430/24, 430/313, 430/314, 430/321, 430/323, 427/109, 427/165, 427/270, 427/271, 427/272, 427/307, 427/309, 428/209
• US Class Current: 216/39
• CPC Class Codes: G03F 7/0007 Filters, e.g. additive colour filters; Components for display devices
• CPC Class Codes: H01J 29/867 Means associated with the outside of the vessel for shielding, e.g. magnetic shields screens for shielding inside the vessel H01J29/06; magnetic shielding in general H05K9/00
• CPC Class Codes: H01J 29/89 Optical or photographic arrangements structurally combined or co-operating with the vessel H01J29/866 and H01J29/868 take precedence
• CPC Class Codes: H01J 9/20 Manufacture of screens on or from which an image or pattern is formed, picked up, converted or stored; Applying coatings to the vessel

Abstract

A shielded substrate is disclosed which has a randomly oriented, non-linear conductive pattern formed on at least one surface of the substrate. The conductive pattern provides excellent EMI/RFI shielding and visual opacity properties without generating moire'"'"' patterns. The conductive pattern is formed of a series of interconnecting non-linear, conductive elements, such as circles, ovals, ellipses and polygonal shapes. The conductive substrate may be formed through the use of photolithography process.

Claims

1. A method for forming a moire'"'"'-free EMI/RFI shield comprising the steps of:

(a) generating a photomask pattern having a series of randomly oriented, interconnected, non-linear elements;

(b) coating a substrate with a photoresist;

(c) exposing the photoresist to the photomask;

(d) developing the exposed photoresist;

(e) etching the photomask pattern into the substrate;

(f) washing and removing the photoresist;

(g) filling the etched pattern in the substrate with an electrically conductive material; and

(h) placing the placed substrate within a frame for mounting to an electronic device.

2. The method of claim 1 wherein the randomly oriented, interconnected, non-linear design is formed from a series of elements selected from the group consisting of circles, ovals, ellipses, polygons and mixtures thereof.

3. The method of claim 1 wherein the substrate is a metal-clad glass or plastic.

4. The method of claim 1 wherein the electrically conductive material is selected from the group consisting of noble metals, non noble metals, conductive adhesives, conductive inks, and conductive frits.

5. The method of claim 1 further comprising a step of coating the filled etched pattern of (g) with a protective layer.

6. The method of claim 5 wherein the protective layer is selected from the group consisting of conductive metal platings, conductive metal films, conductive metal coatings, polymeric coatings and film, an additional substrate layer and combinations thereof.

7. The method of claim 6 wherein the protective layer is a conductive metal coating of indium tin oxide.