Laminates utilizing chemically etchable adhesives

• US 5,084,345 A
• Filed: 11/26/1990
• Issued: 01/28/1992
• Est. Priority Date: 11/26/1990
• Status: Expired due to Fees

• Current Assignee: E. I. du Pont de Nemours and Company (Corteva, Inc.)
• Original Assignee: E. I. du Pont de Nemours and Company (Corteva, Inc.)
• Inventors: Manos, Philip
• Primary Examiner(s): SLUBY, PATRICIA
• Application Number:
  US07/618,112
• Time in Patent Office: 428 Days
• Field of Search: 428/413, 428/414, 428/473.3, 428/335, 428/446, 428/910, 428/458
• US Class Current: 428/335
• CPC Class Codes: B32B 15/08 of synthetic resin
• CPC Class Codes: B32B 2307/204 Di-electric
• CPC Class Codes: B32B 2311/12 Copper
• CPC Class Codes: B32B 2379/08 Polyimides
• CPC Class Codes: B32B 27/281 comprising polyimides
• CPC Class Codes: B32B 7/12 using interposed adhesives or interposed materials with bonding properties
• CPC Class Codes: C07C 229/56 with amino and carboxyl groups bound in ortho-position
• CPC Class Codes: C07C 229/60 with amino and carboxyl groups bound in meta- or para- positions
• CPC Class Codes: C08G 73/101 containing chain terminating or branching agents
• CPC Class Codes: C08G 73/16 Polyester-imides
• CPC Class Codes: H05K 2201/0154 Polyimide
• CPC Class Codes: H05K 2201/0355 Metal foils
• CPC Class Codes: H05K 3/386 by the use of an organic polymeric bonding layer, e.g. adhesive
• CPC Class Codes: Y10S 428/91 Product with molecular orientation
• CPC Class Codes: Y10T 428/264 Up to 3 mils
• CPC Class Codes: Y10T 428/31511 Of epoxy ether
• CPC Class Codes: Y10T 428/31515 As intermediate layer
• CPC Class Codes: Y10T 428/31522 Next to metal
• CPC Class Codes: Y10T 428/31681 Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Abstract

A multilayer laminate having a metallic layer and a dielectric layer, such as a chemically etchable polyimide, bonded to each other with a chemically etchable adhesive containing phenolic ester groups in the backbone.

Claims

1. A laminate comprising in order a metallic layer, an adhesive composition layer and an etchable polyimide layer, wherein the adhesive composition comprises a cross-linked reactive oligomer having in a backbone hydrolyzable phenolic ester groups of an equivalent weight in a range from 200 to 10,000, with the requirement that a 50 micrometer thick film of the composition after cure disintegrates within 50 cycles of alternatingly submersing the film in a stirred solution containing by weight 13% potassium hydroxide, 11% distilled water, and 76% ethanol at 60°

C. for 1 minute, and in a stirred bath of deionized water at 60°

C. for 30 seconds, one submersion in the ethanolic potassium hydroxide solution followed by one submersion in the deionized water, constituting one cycle.

2. A laminate as defined in claim 1, wherein the metallic film is copper.

3. A laminate as defined in claim 1, wherein the crosslinked reactive oligomer is a cross-linked epoxy.

4. A laminate as defined in claim 1, wherein the cross-linked reactive oligomer is a cross-linked oligoimide.

5. A laminate as defined in claim 1, wherein the cross-linked oligoimide has the formula:

##STR4## R₁ is --H, --CH₃, --C₂ H₅ or --CF₃ ;

R₂ is --H, --CH₃, --C₂ H₅ or --CF₃ ;

R3 is a divalent radical having at least an aromatic portion through which it provides at least one of its two valencies;

R₃, R₄ and R₅ have molecular weights so that their sum is less than 2,000;

n is 0 to 1;

m is 0 to 1, so that m+n=1;

p is 0 to 15;

v is 0 to 1;

t is 0.95 to 0;

s is 0.05 to 1, so that t+s=1; and

q is greater than 10.