Electric probing-test machine having a cooling system

• US 5,084,671 A
• Filed: 04/20/1990
• Issued: 01/28/1992
• Est. Priority Date: 09/02/1987
• Status: Expired due to Term

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Sugiyama, Masahiko, Hatta, Masataka, Miyata, Eiji, Kohno, Masahiko
• Primary Examiner(s): Wieder, Kenneth A.
• Assistant Examiner(s): BURNS, WILLIAM
• Application Number:
  US07/512,105
• Time in Patent Office: 648 Days
• Field of Search: 324/158 P, 324/158 F, 324/72.5, 374/50, 374/57, 165/80.4, 361/385
• US Class Current: 324/750.09
• CPC Class Codes: F25B 21/04 reversible
• CPC Class Codes: G01R 1/07314 the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support on an elastic support, e.g. a film, G01R1/0735
• CPC Class Codes: G01R 31/2868 Complete testing stations; systems; procedures; software aspects
• CPC Class Codes: G01R 31/2875 related to heating

Abstract

An electric probing-test machine comprises a probe card having a plurality of probes contacted with chips of a semiconductor wafer and serving to apply test signal to a tester which judges whether circuits on the chips of the wafer are correct or deficient, a main chuck for holding the wafer at a test temperature, a system for cooling the main chuck, and a controller for controlling the cooling system. The main chuck includes a chuck top contacted directly with the wafer, a jacket arranged to conduct heat exchange relative to the chuck top, and a temperature sensor for detecting the temperature of the chuck top. The cooling system has a pump for supplying a coolant from a reservoir to the jacket. Responsive to temperature information detected by the temperature sensor, the amount of the coolant supplied from the reservoir to the jacket is controlled by the controller to thereby control the temperature of the chuck top.

Claims

1. An electric probing-test machine comprising:

probe means having a plurality of probes contacted with an object and serving to apply test signal to a tester which judges whether circuits on the object are correct or deficient;

chuck means, having a chuck top contacted directly with the object, for holding the object;

cooling means for cooling the chuck means, and

control means for controlling the cooling means wherein said chuck means includes;

a heat exchange jacket arranged to conduct heat exchange relative to the chuck top;

a cooling plate arranged between said chuck top and said heat exchange jacket;

Peltier elements arranged between said chuck top and said heat exchange jacket;

temperature detecting means for detecting the temperature of the chuck top; and

coolant supply means, being included in said cooling means, for supplying a coolant from a coolant reservoir to the heat exchange jacket;

wherein current applied to said Peltier elements and the amount of the coolant supplied from the coolant supply means to the heat exchange jacket is controlled by the control means responsive to temperature information detected by the temperature detecting means to thereby control the temperature of the chuck top.

2. The electric probing-test machine according to claim 1, wherein said coolant supply means includes a first pump for supplying the coolant to the heat exchange jacket and a second pump for discharging the coolant from the heat exchange jacket and wherein the coolant reservoir is common to the first and the second pump and a system is provided to circulate the coolant between the coolant reservoir and the heat exchange jacket.

3. The electric probing-test machine according to claim 1, wherein a bypass for returning the coolant to the coolant reservoir is arranged between a coolant supply pump of the coolant supply means and the heat exchange jacket.

5. The electric probing-test machine according to claim 1, wherein a cooling plate is arranged between the chuck top and the heat exchange jacket and the cooling plate has such a peripheral portion that covers a part of the peripheral portion of the chuck top.

6. The electric probing-test machine according to claim 1, wherein a cooling plate is arranged between the top and the heat exchange jacket and the cooling plate is made of copper or copper alloy.

7. The electric probing-test machine according to claim 1, wherein the passage in the heat exchange jacket through which the coolant flows is a labyrinth flow path.

8. The electric probing-test machine according to claim 1, wherein a heater is located in the heat exchange jacket remote from the chuck top.

9. The electric probing-test machine according to claim 1, wherein said temperature detecting means has a second sensor for detecting the temperature of the heat exchange jacket.

10. The electric probing-test machine according to claim 1, wherein the heat exchange jacket can be detached from the chuck top.

11. The electric probing-test machine according to claim 1, further comprising enclosing means for enclosing the chuck means together with the object and a means for supplying dry gas into a space which is enclosed by the enclosing means.

12. The apparatus according to claim 1, wherein said cooling plate has a diameter substantially the same as that of said chuck top, and wherein the cooling plate is formed so that a peripheral portion thereof is thicker than a central portion thereof.

13. The apparatus according to claim 1, further comprising a supply pump for supplying said coolant from said coolant reservoir to said heat exchange jacket.

14. The apparatus according to claim 1, further comprising a return pump for returning said coolant from said heat exchange jacket to said coolant reservoir.

15. The apparatus according to claim 3, wherein a coolant discharge opening of said bypass is positioned above the surface of the liquid in said coolant reservoir.

16. The apparatus according to claim 1, further comprising a heating coil immersed in the coolant in said coolant reservoir.

4. The electric probing-test machine comprising:

probe means having a plurality of probes contacted with an object and serving to apply test signal to a tester which judges whether circuits on the object are correct or deficient;

chuck means, having a chuck top contacted directly with the object, for holding the object;

cooling means for cooling the chuck means, and

control means for controlling the cooling means wherein said chuck means includes;

a heat exchange jacket arranged to conduct heat exchange relative to the chuck top;

a cooling plate arranged between the chuck top and the heat exchange jacket, the cooling plate having a diameter larger than that of the chuck top;

temperature detecting means for detecting the temperature of the chuck top; and

cooling supply means included in said cooling means for supplying a coolant from a coolant reservoir to the heat exchange jacket,

wherein the amount of the coolant supplied from the coolant supply means to the heat exchange jacket is controlled by the control means responsive to temperature information detected by the temperature detecting means to thereby control the temperature of the chuck top.