Micropump having a constant output

• US 5,085,562 A
• Filed: 04/04/1990
• Issued: 02/04/1992
• Est. Priority Date: 04/11/1989
• Status: Expired due to Term

• Current Assignee: Debiotech S.A.
• Original Assignee: Westonbridge International Limited
• Inventors: van Lintel, Harald
• Primary Examiner(s): RIVELL, JOHN A
• Application Number:
  US07/503,977
• Time in Patent Office: 671 Days
• Field of Search: 417/322, 417/412, 417/413
• US Class Current: 417/413.3
• CPC Class Codes: A61M 2205/0244 Micromachined materials, e.g. made from silicon wafers, microelectromechanical systems [MEMS] or comprising nanotechnology
• CPC Class Codes: A61M 2205/0294 Piezoelectric materials
• CPC Class Codes: F04B 43/046 with piezoelectric drive

Abstract

A micropump comprising a pumping chamber, an inlet channel communicating with the pumping chamber by an inlet valve and an outlet channel communicating with the pumping chamber via an outlet valve, these elements being manufactured by etching a silicon wafer is then sealed to glass wafers, the micropump also comprising a piezoelectric wafer to vary the volume of the pumping chamber by bending a wall forming part of the wall of this pumping chamber. In accordance with the invention the pumping chamber has a stop which determines the amplitude of movement of the flexible wall. The variation in the volume of the chamber caused by the displacement of the flexible wall is precisely defined, thus making it possible to maintain the output of the micropump constant during normal operating conditions.

Claims

1. A micropump comprising a plurality of wafers sealed to one another so as to form a pumping chamber defined by two bonded wafers defining a cavity formed by etching at least one of said bonded wafers, at least one inlet valve and at lest one outlet valve enabling the pumping chamber to communicate with one inlet channel and one outlet channel respectively, said micropump also comprising a control element arranged to resiliently displace a part of one of said bonded wafers constituting a flexible wall of the pumping chamber between a first position in which said flexible wall is relatively far from an opposing wall of the pumping chamber when said control element is not active and a second position in which said flexible wall is closer to said opposing wall when said control element is active, the displacements of said flexible wall causing suction of a fluid into the pumping chamber or the delivery thereof, and said pumping chamber comprising a stop means which defines said second position of said flexible wall.

2. A micropump according to claim 1 wherein the stop means comprises a projection formed on an inner face of the pumping chamber.

3. A micropump according to claim 2 wherein the surface of a stop means comes into contact with an inner face of the pumping chamber when the flexible wall assumes the second position, and is substantially planar.

4. A micropump according to claim 2 wherein the projection is formed in the bottom of the cavity during the etching thereof.

5. A micropump according to claim 1 wherein the stop means comprises the inner face of the wall of the pumping chamber located facing the flexible wall.

6. A micropump according to claim 1 wherein one of the wafers defining the pumping chamber is of silicon and the other of glass, the cavity being formed by etching the silicon wafer.

7. A micropump according to claim 6 wherein the flexible wall is one part of the silicon wafer.

8. A micropump according to claim 6 wherein the silicon wafer is of monocrystalline silicon.

9. A micropump according to claim 1 wherein said inlet valve is disposed in the wall of the pumping chamber opposite the flexible wall and wherein the stop comprises at least one part of this valve.

10. A micropump according to claim 1 wherein the control element comprises a piezoelectric disc fixed to the flexible wall.

11. A micropump according to claim 1 wherein the stop means comprises at least one part of the inner face of the flexible wall.

12. A micropump according to claim 3 wherein the projection is formed in the bottom of the cavity during the etching thereof.

13. A micropump according to claim 3 wherein one of the wafers defining the pumping chamber is of silicon and the other of glass, the cavity and the stop means being formed by etching the silicon wafer.

14. A micropump according to claim 4 wherein one of the wafers defining the pumping chamber is of silicon and the other of glass, the cavity and the stop means being formed by etching the silicon wafer.

15. A micropump according to claim 6 wherein the flexible wall is one part of the glass wafer.

16. A micropump according to claim 15 wherein the control element comprises a piezoelectric disc fixed to the flexible wall.

17. A micropump according to claim 7 wherein the control element comprises a piezoelectric disc fixed to the flexible wall.

18. A micropump according to claim 15 wherein said inlet valve is disposed in the wall of the pumping chamber opposite the flexible wall and wherein the stop means comprises at least one part of this valve.

19. A micropump according to claim 6 comprising a silicon wafer bonded between two glass wafers, said silicon wafer being etched on opposite sides to form at least two cavities each having an inner face opposite to a corresponding one of said glass wafers.

20. A micropump according to claim 19 wherein the control element comprises a piezoelectric disc fixed to the flexible wall.

21. A micropump according to claim 1 wherein a surface of the stop means comes into contact with an inner face of the pumping chamber when the flexible wall assumes the second position, and is substantially planar.