Particulate thermosetting adhesive compositions

• US 5,085,930 A
• Filed: 05/21/1990
• Issued: 02/04/1992
• Est. Priority Date: 01/18/1989
• Status: Expired due to Fees

• Current Assignee: BTL Specialty Resins Corp.
• Original Assignee: BTL Specialty Resins Corp.
• Inventors: Hickey, James H., Widmann, Marcel
• Primary Examiner(s): Cashion, Jr., Merrell C.
• Assistant Examiner(s): FOLLETT, ROBERT JOHN
• Application Number:
  US07/526,730
• Time in Patent Office: 624 Days
• Field of Search: 428/407, 428/403, 428/404, 428/405, 428/323, 156/283, 156/213
• US Class Current: 428/323
• CPC Class Codes: C08G 12/32 Melamines
• CPC Class Codes: C08G 16/0218 containing atoms other than carbon and hydrogen
• CPC Class Codes: C08K 9/08 Ingredients agglomerated by treatment with a binding agent
• CPC Class Codes: C09J 161/28 with melamine
• CPC Class Codes: C09J 161/34 Condensation polymers of aldehydes or ketones with monomers covered by at least two of the groups C09J161/04, C09J161/18 and C09J161/20
• CPC Class Codes: Y10T 428/25 Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
• CPC Class Codes: Y10T 428/2991 Coated
• CPC Class Codes: Y10T 428/2998 including synthetic resin or polymer

Abstract

Particulate thermosetting adhesive compositions exhibiting heat softening properties and capable of resisting penetration into porous substrates can be made at significantly lower cost than conventional adhesives by coating inorganic carrier particles with a previously prepared liquid thermosetting resin and spray drying the resulting mixture.

Claims

1. An article of manufacture comprising a particulate thermosetting adhesive composition and a substrate, wherein said adhesive composition comprises individual free flowing finely divided discrete particles of substantially water insoluble inorganic particulate matter inert to and coated with a thermosetting resin comprising at least one aldehyde condensation product selected from the group consisting of phenol, resorcinol, melamine, urea, acetone, dicyandiamide, and mixtures thereof;

and wherein the amount of particulate matter varies from about 1 to 240 parts by weight per 100 parts by weight of the solids content of the thermosetting resin.

2. The article of claim 1, wherein said substrate is porous.

3. The article of claim 1, wherein said substrate is non-porous.

4. The article of claim 2, wherein the porous substrate is selected from the group consisting of waferboard, particleboard, fibermat, and molded wood products.

5. The article of claim 3, wherein said substrate is derived from a metal selected from the group consisting of aluminum, brass, copper, steel, chromium, lead, silver, zinc, gold, platinum, magnesium, and titanium.

6. The article of claim 3, wherein said substrate is derived from a plastic selected from the group consisting of melamines, phenolics, and polyesters.

7. The article of claim 1, wherein the amount of adhesive varies from about 1 to 40% by weight.

8. The article of claim 1, wherein the amount of particulate matter varies from about 5 to 100 parts by weight.

9. The article of claim 1, also including an aminofunctional coupling agent selected from the group consisting of organosilanes, organotitanates and mixtures thereof, wherein the coupling agent varies from about 0.001 to 1.0% by weight of the particulate matter.

10. The article of claim 1, wherein the particulate matter comprises discrete particles of inorganic compositions having at least 50% by weight of particles greater than 5 microns in the maximum particle dimension and a solubility in water not more than 0.1% by weight, and are selected from the group consisting of inorganic oxides, inorganic salts, inorganic silicates, and mixtures thereof.

11. The article of claim 1, wherein at least 50% by weight of the water insoluble inorganic particulate matter comprises particles greater than 5 microns and at least 50 weight % comprises particles smaller than 100 microns, in the maximum particle dimension.

12. In a method for bonding composite substrate materials with adhesive resins, the improvement which comprises:

contacting the substrate materials with a particulate thermosetting adhesive composition comprising substantially water insoluble inorganic particulate matter inert to and coated with a thermosetting resin comprising at least one aldehyde condensation product selected from the group consisting of phenol, resorcinol, melamine, urea, acetone, dicyandiamide, and mixtures thereof;

wherein the amount of particulate matter varies from about 1 to 240 parts by weight per 100 parts by weight of the solids content of the thermosetting resin.

13. The method of claim 12, wherein the adhesive composition includes an amino-functional coupling agent selected from the group consisting of organosilane, organotitinates, and mixtures thereof, and wherein the coupling agent varies from about 0.001 to 1% by weight of the particulate matter.

14. The method of claim 12, wherein the substrate is a porous material derived from cellulosic or cotton based materials.

15. The method of claim 14, wherein the porous substrate is selected from the group consisting of particleboard, fiberboard, waferboard, and molded wood.

16. The method of claim 12, wherein the substrate is non-porous.

17. The method of claim 16, wherein the substrate is a plastic material.

18. The method of claim 16, wherein the substrate is metallic.

19. The method of claim 12, wherein the particulate matter comprises discrete particles of inorganic compositions having at least 50% by weight of particles greater than 5 microns in the maximum particle dimension and a solubility in water not more than 0.1% by weight, and are selected from the group consisting of inorganic oxides, inorganic salts, inorganic silicates, and mixtures thereof.