Electronic component mounting apparatus

• US 5,086,556 A
• Filed: 06/10/1991
• Issued: 02/11/1992
• Est. Priority Date: 06/14/1990
• Status: Expired due to Fees

• Current Assignee: Sony Corporation (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: Toi, Hiroshi
• Primary Examiner(s): ECHOLS, PERCY W
• Application Number:
  US07/712,670
• Time in Patent Office: 246 Days
• Field of Search: 29/740, 29/705, 29/714, 29/720, 29/743, 364/571.02, 364/571.05, 364/559, 364/561, 364/474.37, 901/46, 901/47
• US Class Current: 29/740
• CPC Class Codes: H05K 13/0812 the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
• CPC Class Codes: Y10T 29/53022 with means to test work or product
• CPC Class Codes: Y10T 29/53087 with signal, scale, illuminator, or optical viewer
• CPC Class Codes: Y10T 29/53178 Chip component

Abstract

An electronic component mounting apparatus wherein any unflatness value such as skew at each of predetermined points on the surface of a substrate supported at a component mounting position is measured by a non-contact type measuring instrument. Such unflatness value and a predetermined height of each electronic component to be mounted are calculated, and the descent stroke of each suction nozzle is adjusted in accordance with the result of such calculation in such a manner that the bottom face of the component is set exactly at the predetermined position on the substrate surface, thereby ensuring accurate mounting of the component on the substrate surface without causing any impact thereto to consequently attain proper attachment.

Claims

1. An electronic component mounting apparatus comprising:

means for holding electronic components supplied from a component feeder and mounting the same sequentially on a substrate;

a means for positioning the substrate;

a measuring means disposed facing the positioned substrate for measuring the unflatness values of the substrate at predetermined surface points thereof in a non-contact manner and producing output data representative of the measured unflatness values; and

a means for adding the unflatness values of the substrate as correction values to the descent strokes of said component holding means.

2. An electronic component mounting apparatus according to claim 1, further comprising:

a means for storing the data representative of the heights of electronic components to be mounted; and

a means for adding the data of the component heights as correction values to the descent strokes of said component holding means.