Cold plate for cooling electronics

• US 5,088,005 A
• Filed: 05/08/1990
• Issued: 02/11/1992
• Est. Priority Date: 05/08/1990
• Status: Expired due to Fees

• Current Assignee: Sundstrand Corporation (Raytheon Technologies Corporation d/b/a RTX)
• Original Assignee: Sundstrand Corporation (Raytheon Technologies Corporation d/b/a RTX)
• Inventors: Ciaccio, Michael P.
• Primary Examiner(s): Thompson, Gregory D.
• Application Number:
  US07/520,801
• Time in Patent Office: 644 Days
• Field of Search: 165/80.3, 165/104.33, 165/166, 165/167, 165/908, 174/15.1, 174/15.2, 174/16.3, 357/82, 361/382, 361/384-389
• US Class Current: 361/699
• CPC Class Codes: H05K 7/20636 within sub-racks for removing heat from electronic boards

Abstract

A multi-layered cold plate is customized for cooling a plurality of electronic components to be arranged in thermal communication with the cold plate by dividing the cold plate into a plurality of hypothetical cooling zones, determining the cooling needed for the respective cooling zones for cooling the electronic components adjacent the zones, and tailoring a heat exchanger layer of the multi-layered cold plate with different heat exchanger structures in respective cooling zones to provide relatively high and relatively lower efficiency cooling where needed. A coolant flow, jet impingement heat exchange structure formed of alternately stacked orifice plates and spacer plates provides the high efficiency cooling. The heat exchanger layer is the only layer of the cold plate which must be customized for accommodating a particular arrangement of electronic components to be cooled.

Claims

1. A cold plate for cooling electronic components comprising a plurality of layers which are assembled in stacked relation, said plurality of layers including a heat exchanger layer, means defining a flow path for circulating a cooling liquid through said cold plate for cooling electronic components located in heat conducting relation to said cold plate, said flow path extending through a plurality of cooling zones of said cold plate, respective portions of said heat exchanger layer being located in said cooling zones for heat exchange with coolant circulated along the flow path, said respective portions of the heat exchanger layer including at least one first heat exchanger structure for relatively high efficiency cooling and at least one second heat exchanger structure for relatively lower efficiency cooling, each of said first and second heat exchanger structures being located in a respective one of said cooling zones whereby for heat removal efficiency a relatively high heat producing electronic component can be located adjacent one of said cooling zones with a first heat exchanger structure associated therewith and a relatively lower heat producing electronic component can be located adjacent one of said cooling zones with a second heat exchanger structure associated therewith.

2. A cold plate according to claim 1, wherein said plurality of layers further include a top plate and a bottom plate, said heat exchanger layer being located intermediate said top and bottom plates.

3. A cold plate according to claim 2, wherein said plurality of layers further comprise a top target spacer plate located between said top plate and said heat exchanger layer and a bottom target spacer plate located between said bottom plate and said heat exchanger layer, said flow path circulating cooling liquid through said heat exchanger layer in said cooling zones from one of said top and bottom target spacer plates to the other.

4. A cold plate according to claim 1, wherein said cold plate in a cooling zone having said first heat exchanger structure associated therewith is capable of effectively dissipating local heat fluxes of greater than or equal to 100 watts/cm² from a heat producing electronic component.

7. A cold plate according to claim 1, wherein said cold plate is planar with said flow path extending serpentine in the plane of said cold plate.

8. A cold plate according to claim 1, wherein said first heat exchanger structure comprises a plurality of orifice plates having coolant flow impingement orifices extending therethrough and spacer plates, said orifice plates and spacer plates being stacked alternately to provide for the removal of dissipated heat at relatively high heat fluxes from a relatively high heat producing electronic component.

9. A cold plate according to claim 8, wherein said stacked plates of said first heat exchanger structure are bonded to one another.

10. A cold plate according to claim 1, wherein said second heat exchanger structure comprises a plurality of stacked plates which each have a relatively large aperture therethrough with the apertures of the respective plates at a given cooling zone being aligned with one another for free flow of said coolant therethrough from one side of said heat exchanger layer to the opposite side in a direction along said flow path.

11. A cold plate according to claim 1, wherein at least one printed circuit board with a plurality of heat generating electronic components is connected in heat conducting relation to said cold plate such that the heat generating electronic components are located adjacent respective ones of said cooling zones for dissipating the heat generated thereby.

12. A cold plate according to claim 11, wherein a printed circuit board with a plurality of electronic components is connected in heat conducting relation on each of two opposite sides of said cold plate.

13. A cold plate according to claim 11, wherein said cold plate is capable of effectively dissipating heat fluxes from electronic components of greater than or equal to five hundred watts per printed circuit board attached to said cold plate.

14. A cold plate according to claim 1, wherein said heat exchanger layer is a composite structure formed of a plurality of plates.

15. A cold plate according to claim 1, wherein said cold plate is dimensioned to fit in a standard printed circuit board rack for supporting and cooling at least one printed circuit board and the electronic components thereof when the circuit board is attached to said cold plate.

16. A cold plate according to claim 1, wherein the plurality of stacked layers are bonded to one another.

5. A cold plate according to claim wherein said plurality of layers include first and second layers arranged on opposite sides of said heat exchanger layer, said flow path in said cooling zones circulating cooling liquid through said heat exchanger layer from one of said first and second layers to the other.

6. A cold plate according to claim 5, wherein said liquid coolant flows through said heat exchanger layer in opposite directions in successive cooling zones along said flow path.

17. A method of customizing a multi-layered cold plate through which a cooling liquid is to be flowed for cooling a plurality of electronic components which produce different amounts of heat and which are to be placed in a particular arrangement in thermal communication with a cold plate, said method comprising dividing the cold plate into a plurality of hypothetical cooling zones, determining the cooling needed for the respective cooling zones for cooling the electronic components to be located adjacent said zones, and tailoring a heat exchanger layer which is to form a part of the multi-layered cold plate by providing at respective portions of the heat exchanger layer at least two different heat exchanger structures having different cooling efficiencies and located in different cooling zones in accordance with the determined needs of the cooling zones.

18. A method according to claim 17, wherein said heat exchanger structures include a first heat exchanger structures comprising a plurality of alternately stacked orifice plates and spacer plates for the removal of relatively high heat fluxes.

19. A method according to claim 18, wherein said heat exchanger structures further comprise a second heat exchanger structure wherein said stacked plates each have a relatively large aperture therethrough with the apertures of the respective plates at a given cooling zone being aligned with one another for free flow of the coolant therethrough from the one side of the heat exchanger layer to the opposite side in a direction along the flow path.

20. A method of making a cold plate which is customized for cooling electronic components located in a particular arrangement on the cold plate, comprising forming the cold plate of at least three layers arranged in stacked relation with a liquid coolant flow path being formed therein which extends back and forth through an intermediate layer of said layers at a plurality of spaced located in the cold plate to define respective cooling zones, and wherein said intermediate layer is provided with at least one first heat exchanger structure for relatively high efficiency cooling and at least one second heat exchanger structure for relatively lower efficiency cooling in different cooling zones whereby for heat removal efficiency a relatively high heat producing electronic component can be located adjacent one of said cooling zones with a first heat exchanger structure associated therewith and a relatively lower heat producing electronic component can be located adjacent one of said cooling zones with a second heat exchanger structure associated therewith.