Highly conductive polymer thick film compositions

• US 5,089,173 A
• Filed: 05/02/1990
• Issued: 02/18/1992
• Est. Priority Date: 05/02/1990
• Status: Expired due to Term

• Current Assignee: Acheson Industries, Inc. (Nouryon BV)
• Original Assignee: Advanced Products Co. (Parker-Hannifin Corporation)
• Inventors: Chen, Andrew, Frentzel, Richard L.
• Primary Examiner(s): Barr, Josephine
• Application Number:
  US07/518,052
• Time in Patent Office: 657 Days
• Field of Search: 252/514, 252/511, 524/439, 524/186, 523/503, 523/512
• US Class Current: 252/514
• CPC Class Codes: C08L 2666/14 Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
• CPC Class Codes: C08L 2666/28 Non-macromolecular organic substances
• CPC Class Codes: C08L 2666/54 Inorganic substances
• CPC Class Codes: C09D 127/06 Homopolymers or copolymers of vinyl chloride
• CPC Class Codes: C09D 5/24 Electrically-conducting paints conductive materials H01B1/00
• CPC Class Codes: H01B 1/22 the conductive material comprising metals or alloys
• CPC Class Codes: H01H 13/702 with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches
• CPC Class Codes: H01H 13/785 characterised by the material of the contacts, e.g. conductive polymers
• CPC Class Codes: H01H 2201/032 Conductive polymer; Rubber
• CPC Class Codes: H05K 1/095 for polymer thick films, i.e. having a permanent organic polymeric binder

Abstract

A thermally curable conductive polymer thick film composition comprising, by weight:

(a) about 3-15 parts of at least one thermoplastic vinyl acetate/vinyl chloride/dicarboxylic acid multipolymer resin;

(b) a second thermoplastic resin selected from the group consisting of:

(i) about 1-6 parts of at least one thermoplastic polyurethane resin;

(ii) about 2-10 parts of at least one thermoplastic polyester resin; or

(iii) about 1-10 parts of a mixture of at least one thermoplastic polyurethane and at least one thermoplastic polyester resin;

(c) about 0.05-1 parts of a tertiary amine;

(d) an effective amount of at least one organic solvent capable of substantially dissolving (a), (b), and (c) ingredients; and

(e) about 50-80 parts of silver flake.

Claims

1. A thermally curable conductive polymer thick film composition comprising, by weight:

(a) about 3-15 parts of at least one thermoplastic vinyl acetate/vinyl chloride/dicarboxylic acid multipolymer resin;

(b) a second thermoplastic resin selected from the group consisting of;

(i) about 1-6 parts of at least one thermoplastic polyurethane resin;

(ii) about 2-10 parts of at least one thermoplastic polyester resin; and

(iii) about 1-10 parts of a mixture of at least one thermoplastic polyurethane and at least one thermoplastic polyester resin;

(c) about 0.05-1 parts of a tertiary amine;

(d) an effective dissolving amount of at least one organic solvent capable of dissolving (a), (b), and (c) ingredients; and

(e) about 50-80 parts of silver flake.

2. The thermally curable conductive polymer thick film composition of claim 1, wherein said solvent is at least one nonhydrocarbon polar organic solvent capable of dissolving the resin system, the amount of said solvent being sufficient to dissolve the resin system and to adjust the viscosity of said polymer thick film composition in order to make it applicable to a membrane switch substrate.

3. The thermally curable conductive polymer thick film composition of claim 1 wherein the amount of said solvent is from about 20 parts to about 40 parts by weight of said polymer thick film composition.

4. The thermally curable conductive polymer thick film composition of claim 3, wherein said solvent is selected from the group consisting of carbitol, carbitol acetate, butyl carbitol, butyl carbitol acetate, butyolactone, acetone, methyl ethyl ketone, cyclohexanone, dibasic ester solvent, and diglyme.

5. The thermally curable conductive polymer thick film composition of claim 4 containing about 25 parts to about 35 parts by weight of said solvent.

6. The thermally curable conductive polymer thick film composition of claim 5, wherein said solvent is carbitol acetate.

7. The thermally curable conductive polymer thick film composition of claim 1, wherein said vinyl acetate/vinyl chloride/dicarboxylic acid multipolymer is a terpolymer of vinyl acetate, vinyl chloride, and an ethylenically unsaturated dicarboxylic acid.

8. The thermally curable conductive polymer thick film composition of claim 7, wherein said terpolymer of vinyl acetate, vinyl chloride, and an ethylenically unsaturated carboxylic acid is a vinyl acetate/vinyl chloride/maleic acid terpolymer.

9. The thermally curable conductive polymer thick film composition of claim 7 containing about 4-12 parts by weight of said terpolymer of vinyl acetate/vinyl chloride/ethylenically unsaturated dicarboxylic acid.

10. The thermally curable conductive polymer thick film composition of claim 1, wherein said polyurethane resin is a linear aliphatic polyester polyurethane resin.

11. The thermally curable conductive polymer thick film composition of claim 10, containing 2-5 parts by weight of said thermoplastic polyurethane resin.

12. The thermally curable conductive polymer thick film composition of claim 1, wherein said polyester resin is a linear aromatic polyester resin.

13. The thermally curable conductive polymer thick film composition of claim 12 containing about 3-7 parts by weight of said linear aromatic polyester resin.

14. The thermally curable, conductive polymer thick film composition of claim 1, wherein said tertiary amine is selected from the group consisting of N,N-dimethyl benzylamine, N,N-dimethylaniline, N,N-dimethyltoluidine, N,N-dimethyl-p-anisidine, p-halogen-N,N-dimethylaniline, 2-N-ethylanilino ethanol, tri-n-butylamine, pyridine, quinoline, N-methylvorpholine, triethanolamine, triethylenediamine, N,N,N'"'"',N'"'"'-tetramethylbutanediamine, N-methylpiperidine.

15. The thermally curable conductive polymer thick film composition of claim 14, wherein said tertiary amine is triethanolamine.

16. The thermally curable conductive polymer thick film composition of claim 14 containing about 0.1-0.75 parts by weight of at least one of the said tertiary amines.

17. The thermally curable conductive polymer thick film composition of claim 1 containing about 52-75 parts by weight of said silver flake.

18. The thermally curable conductive polymer thick film composition of claim 1, wherein said polymer thick film composition comprises, by weight:

(a) about 4.5-10 parts of a thermoplastic vinyl acetate/vinyl chloride/maleic acid tripolymer;

(b) a second thermoplastic resin selected from the group consisting of;

(1) about 2.5-3.5 parts of a linear aliphatic polyester polyurethane resin; and

(2) about 3.5-6 parts of a linear aromatic polyester resin;

(c) about 0.1-0.5 parts of triethanolamine;

(d) about 25-35 parts of carbitol acetate; and

(e) about 55-70 parts of silver flake.

19. A thermally cured conductive polymer thick film composition comprising, by weight, a cured admixture of:

(a) about 3-15 parts of at least one thermoplastic vinyl acetate/vinyl chloride/dicarboxylic acid multipolymer;

(b) a second thermoplastic resin selected from the group consisting of;

(i) about 1-6 parts of at least one thermoplastic polyurethane resin;

(ii) about 2-10 parts of at least one thermoplastic polyester resin; and

(iii) about 1-10 arts of a mixture of at least one thermoplastic polyurethane and at least one thermoplastic polyester resin;

(c) about 0.05-1 parts of a tertiary amine; and

(d) about 50-80 parts of silver flake.