Substrate heater and heating element
First Claim
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1. A method for providing uniform heat to substrates at a step of a process, said method comprisingproviding separate movable heating devices, one for each substrate;
- placing each said substrate onto one of said devices;
sequentially moving each said device into a position where said step of said process can be performed on said substrate; and
causing each of said devices alone to provide heat to said substrate at said step of said process.
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Abstract
Heat is provided to substrates at a step of a process by providing identical movable heating devices, one for each substrate, placing each substrate onto one of the heating devices, sequentially moving each device into a position where the step of the process can be performed on the substrate, and causing each of the devices to provide heat to the substrate at each step of the process.
48 Citations
23 Claims
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1. A method for providing uniform heat to substrates at a step of a process, said method comprising
providing separate movable heating devices, one for each substrate; -
placing each said substrate onto one of said devices; sequentially moving each said device into a position where said step of said process can be performed on said substrate; and causing each of said devices alone to provide heat to said substrate at said step of said process. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A movable apparatus for resistive heating a substrate, said apparatus comprising
a pair of holes, each hole being positioned to receive a separate prong of a fork support, and sides configured to receive a second alterative support, said holes and said sides being configured to enable movement of said apparatus from a first position to a second position.
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12. A movable apparatus for resistive heating a substrate, said apparatus comprising
a pair of holes, each hole being positioned to receive a separate prong of a fork support, and pins downwardly directed for resting within holes of a second support, said holes and said pins being configured to enable movement of said apparatus from a first position to a second position.
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18. A movable apparatus for resistive heating a substrate, said apparatus comprising
holes for receiving a fork support, wherein said holes comprise electrically conductive walls, electrically conductive sides configured to receive a second alternative support, said holes and said sides being configured to enable movement of said apparatus from a first position to a second position, a conductive oxidation-resistant wire heating alloy, nonconductive means separating said alloy from said substrate, wherein said wire alloy, having a first and a second end, is wrapper around said nonconductive means.
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23. A movable apparatus for resistive heating a substrate, said apparatus comprising
holes for receiving a fork support, wherein said holes comprise electrically conductive walls, electrically conductive pins downwardly directed for resting within holes of a second support, said holes and said pins being configured to enable movement of said apparatus from a first position to a second position, a conductive oxidation-resistant wire heating alloy, and nonconductive means separating said alloy from said substrate, wherein said wire alloy, having a first and a second end, is wrapped around said nonconductive means.
Specification