Inductive structures for semiconductor integrated circuits

• US 5,095,357 A
• Filed: 08/14/1990
• Issued: 03/10/1992
• Est. Priority Date: 08/18/1989
• Status: Expired due to Fees

• Current Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Inventors: Inoue, Akira, Nakahara, Kazuhiko, Nakajima, Yasuharu, Andoh, Naoto
• Primary Examiner(s): CARROLL, JAMES J
• Application Number:
  US07/567,170
• Time in Patent Office: 574 Days
• Field of Search: 357/51, 357/55, 357/65, 357/71, 357/40, 357/27, 336/15, 336/225
• US Class Current: 257/379
• CPC Class Codes: H01F 17/0006 Printed inductances printed coils for dynamo-electric machines H02K3/26; printed circuits H05K
• CPC Class Codes: H01F 17/0033 with the coil helically wound around a magnetic core
• CPC Class Codes: H01F 2017/004 with the coil helically wound around an axis without a core
• CPC Class Codes: H01F 2017/0046 with a conductive path having a bridge
• CPC Class Codes: H01F 2017/0086 on semiconductor substrate
• CPC Class Codes: H01F 21/02 continuously variable, e.g. variometers
• CPC Class Codes: H01F 21/08 by varying the permeability of the core, e.g. by varying magnetic bias
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 28/10 Inductors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance

Abstract

Inductive structures having low parasitic capacitances for direct integration in semiconductor integrated circuits. In one embodiment, a generally planar spiral winding is disposed on the surface of a substrate. An electrical connection to the internal end of the spiral is made through electrically conducting vias passing through the substrate. The spiral may be spaced from a substrate surface by a plurality of spaced apart electrically conductive posts having a staggered arrangement between adjacent windings of the spiral. A transformer includes two windings disposed on top of each other on a semiconductor substrate and separated by an electrically insulating film. The windings have a common central opening in which a magnetic material is disposed to improve the inductive coupling between the windings. The transformer may include two helical windings, one surrounding another, each formed with vias and electrical conductors, the inner winding being formed in and on a semiconductor substrate and the outer winding being formed on insulating films disposed on the substrate and extending through the films and substrate. A variable inductor includes inductively coupled spiral windings separated by an insulating film and a current control for controlling the current through one of the spirals and, thereby, the effective inductance of the other spiral.

Claims

1. An inductive structure integrable with a semiconductor integrated circuit comprising:

an electrically insulating substrate having opposed first and second surfaces;

an electrical conductor disposed in a first spiral on the first surface of the substrate, the spiral including an external end disposed outside the spiral as a first lead and an internal end disposed within the spiral;

first and second electrically conducting vias passing through the substrate from the first to the second surface, the first via intersecting and establishing an electrical connection to the internal end of the first spiral, the second via lying outside the spiral;

an electrically conducting connector disposed on the second surface of the substrate electrically connecting the first and second vias; and

a second lead disposed on the first surface of the substrate outside the first spiral electrically connected to the second via whereby electrical connections to the inductive structure can be made on the first surface of the substrate.

2. The inductive structure of claim 1 wherein the electrically conducting connector disposed on the second surface of the substrate is disposed in a second spiral.

3. The inductive structure of claim 2 wherein the second spiral, when projected onto the first surface of the substrate, is interleaved with the first spiral.

4. The inductive structure of claim 1 wherein the substrate is an electrically insulating semiconductor.

5. The inductive structure of claim 4 wherein the substrate is chosen from the group consisting of gallium arsenide and indium phosphide.

6. An inductive structure integrable with a semiconductor integrated circuit comprising:

an electrically insulating substrate having opposed first and second surfaces;

an electrical conductor disposed in a spiral spaced from the first surface of the substrate, the spiral including an external end disposed outside the spiral as a first lead and an internal end disposed within the spiral, said first spiral including at least two windings adjacent each other; and

a plurality of electrically conducting, spaced apart posts disposed on the first surface of the substrate contacting and supporting the first spiral wherein each post supporting one winding is disposed intermediate two adjacent posts supporting an adjacent winding.

7. The inductive structure of claim 6 including first and second electrically conducting vias passing through the substrate from the first to the second surface, the first via intersecting and establishing an electrical connection to the internal end of the spiral;

the second via lying outside the spiral;

an electrically conducting connector disposed on the second surface of the substrate electrically connecting the first and second vias; and

a second lead disposed on the first surface of the substrate outside the spiral electrically connected to the second via whereby electrical connections to the inductive structure can be made on the first surface of the substrate.

8. The inductive structure of claim 6 wherein the substrate is an electrically insulating semiconductor.

9. The inductive structure of claim 8 wherein the substrate is chosen from the group consisting of gallium arsenide and indium phosphide.

10. A transformer integrable with a semiconductor integrated circuit comprising:

an electrically insulating semiconductor substrate having a first surface;

a first electrical conductor disposed on the first surface of the substrate comprising a first winding having a first pair of leads;

a first electrically insulating film disposed on the first electrical conductor;

a second electrical conductor disposed on the electrically insulating film comprising a second winding having a second pair of leads, the first and second windings and the electrically insulating film including a common central opening wherein the pairs of leads of the first and second windings are oriented in different directions to minimize the coupling between the respective pairs of leads; and

a magnetic material disposed on the surface of the substrate in the common central opening increasing the inductive coupling between the first and second windings.

11. The transformer of claim 10 wherein the magnetic material is a ferrite body.

12. The transformer of claim 10 wherein the electrically insulating film is chosen from the group consisting of SiN and SiON.

13. The transformer of claim 10 wherein the substrate is chosen from the group consisting of gallium arsenide and indium phosphide.

14. The transformer of claim 10 including a second electrically insulating film disposed on the second electrical conductor and a third electrical conductor disposed on the second electrically insulating film opposite the second electrical conductor comprising a third winding and a third pair of leads, the second electrically insulating film and the third electrical conductor having respective central openings aligned with the common central opening of the first and second windings.

15. A transformer integrable with a semiconductor integrated circuit comprising:

an electrically insulating substrate having opposed first and second surfaces;

a plurality of first electrically conducting vias passing through the substrate from the first to the second surface;

at least one first and second electrical conductor respectively disposed on the first and second surfaces of the substrate, each of the first and second conductors electrically connecting two vias to form a first helical winding comprising the first and second electrical conductors and the first vias;

first and second electrically conducting leads disposed on at least one of the first and second surfaces of the substrate respectively electrically connected to one of the first vias;

first and second electrically insulating films disposed on the first and second surfaces of the substrate, respectively, at least partially covering the first and second electrical conductors and first and second leads;

a plurality of second electrically conducting vias passing through the first and second electrically insulating films and the electrically insulating substrate;

at least one third and fourth electrical conductor respectively disposed on the first and second electrically insulating films, each of the third and fourth conductors electrically connecting two of the second vias to form a second helical winding comprising the third and fourth electrical conductors and the second vias; and

third and fourth electrically conducting leads disposed on at least one of the first and second electrically insulating films respectively electrically connected to one of the second vias.

16. The transformer of claim 15 wherein the electrically insulating substrate is an electrically insulating semiconductor.

17. The transformer of claim 15 wherein the substrate is chosen from the group consisting of gallium arsenide and indium phosphide.

18. The transformer of claim 15 wherein the second helical winding surrounds the first helical winding.

19. The transformer of claim 15 including a magnetic material disposed within the first helical winding increasing the inductive coupling between the first and second helical windings.

20. The transformer of claim 19 wherein the magnetic material is a ferrite body.

21. A two terminal variable inductance element integrable with a semiconductor integrated circuit comprising:

an electrically insulating substrate having opposed first and second surfaces;

a first electrical conductor disposed in a first spiral on the first surface of the substrate;

means for producing and controlling a variable electrical current flow through the first conductor;

an electrically insulating film disposed on the first surface and the first spiral; and

a second electrical conductor having first and second terminals, disposed in a second spiral on the electrically insulating film, and inductively coupled to the first spiral, the first and second terminals of the second electrical conductor constituting the terminals of the two terminal variable inductance element whereby the inductance between the first and second terminals is controlled by the electrical current flow through the first electrical conductor.

22. The variable inductance element of claim 21 wherein the substrate is an electrically insulating semiconductor.

23. The variable inductance element of claim 22 wherein the substrate is chosen from the group consisting of gallium arsenide and indium phosphide.

24. A variable inductance element integrable with a semiconductor integrated circuit comprising:

an electrically insulating substrate having opposed first and second surfaces;

an electrical conductor disposed in a first spiral on the first surface of the substrate;

an electrically insulating film disposed on the first surface and the first spiral;

a second electrical conductor disposed in a second spiral on the electrically insulating film and inductively coupled to the first spiral, each of the first and second spirals having respective first and second ends;

an electrically conducting first via penetrating the electrically insulating film electrically connecting the first end of the first spiral to the first end of the second spiral; and

an electrically conducting ground plane disposed on the second surface of the substrate and a second electrically conducting via passing through the substrate from the first to the second surface electrically connecting the second end of the first spiral to the ground plane.

25. The variable inductance element of claim 24 wherein the substrate is an electrically insulating semiconductor.

26. The variable inductance element of claim 25 wherein the substrate is chosen from the group consisting of gallium arsenide and indium phosphide.

27. The variable inductance element of claim 24 including means for controlling the flow of current through the second spiral serially connected to the first end of the second spiral and an electrical termination connected between the second end of the first spiral and the ground plane.

28. The variable inductance element of claim 27 wherein the means for controlling is selected from the group consisting of an attenuator and an amplifier.