Double-sided memory board

• US 5,095,407 A
• Filed: 08/23/1989
• Issued: 03/10/1992
• Est. Priority Date: 02/27/1987
• Status: Expired due to Fees

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Kanezawa, Yukio, Sugano, Toshio, Watanabe, Masayuki
• Primary Examiner(s): Thompson, Gregory D.
• Application Number:
  US07/397,352
• Time in Patent Office: 930 Days
• Field of Search: 174/52 FP, 174/52 PE, 174/68.5, 357/75, 357/80, 361/400, 361/403, 361/406, 361/409, 361/414
• US Class Current: 361/794
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H05K 1/0216 Reduction of cross-talk, noise or electromagnetic interference grounding H05K1/0215
• CPC Class Codes: H05K 1/0224 Patterned shielding planes, ground planes or power planes H05K1/0253 takes precedence
• CPC Class Codes: H05K 1/0253 Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings H05K1/0251 takes precedence
• CPC Class Codes: H05K 1/0271 Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
• CPC Class Codes: H05K 1/0289 having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 2201/09336 Signal conductors in same plane as power plane
• CPC Class Codes: H05K 2201/09345 Power and ground in the same plane; Power planes for two voltages in one plane
• CPC Class Codes: H05K 2201/09681 : Mesh conductors, e.g. as a ground plane
• CPC Class Codes: H05K 2201/10159 : Memory
• CPC Class Codes: H05K 2201/10689 : Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
• CPC Class Codes: H05K 3/28 : Applying non-metallic protective coatings H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673
• CPC Class Codes: H05K 3/427 : initial plating of through-holes in metal-clad substrates

Abstract

A face-mounting type memory module board wherein the number of through-holes is reduced by a large margin in order to improve the reliability of the board. V_CC and V_SS plates which have heretofore been provided inside a multi-layer wiring board are disposed on the reverse surface of a single-layer wiring board, and other wirings are disposed on its obverse surface by making use of a fine process, thereby greatly reducing the number of through-holes required.

Claims

1. A double-sided printed circuit board comprising:

(a) a layer of substantially rectangular insulating board without inner layer wiring and with through-holes;

(b) a plurality of soldering copper pads provided on the first principal surface of said board to which components may be mounted;

(c) first thin copper wires provided on the first principal surface of said board for defining a plurality of signal lines,

said first thin wires being disposed so as to extend in the longitudinal direction of said board while passing through the areas between said plurality of soldering pads;

(d) a first copper voltage supply plate and a second copper voltage supply plate are provided on a second principal surface of said board,

these two plates being disposed so as to cover substantially the whole of said second principal surface;

(e) a multiplicity of pads for external connection provided on at least said second principal surface at first longer side edge portion of said board; and

(f) second thin copper wires provided on the second principal surface of said board for defining data input/output lines,

said second thin wires extending over said second principal surface laterally, that is, in a direction parallel to the shorter sides of said board, while passing through the areas defined between said first voltage supply plate and second voltage supply plate, so as to be connected respectively to said pads for external connection.

2. A double-sided printed circuit board according to claim 1 which further comprises:

g) a solder resist film formed so as to cover substantially the whole of said first principal surface of said board except for said soldering pads and said through-holes.

3. A double-sided printed circuit board according to claim 2 which further comprises:

(h) a copper pad oxidation preventing solder coat layer formed at least on said soldering pads.

4. A double-sided printed circuit board according to claim 1, wherein either of said power plates on said second principal surface has a multiplicity of openings provided over the entire plate surface.

5. A double-sided printed circuit board comprising:

(a) a layer of substantially rectangular insulating board without inner layer wiring;

(b) a plurality of soldering copper pads provided on the first principal surface of said board to which components may be mounted;

(c) first thin copper wires provided on the first principal surface of said board for defining a plurality of signal lines,

said first thin wires being disposed so as to extend in the longitudinal direction of said board while passing through the areas between said plurality of soldering pads;

(d) a first copper voltage supply plate and a second copper voltage supply plate are provided on a second principal surface of said board,

these two plates being disposed so as to cover substantially the whole of said second principal surface;

(e) a multiplicity of pads for external connection provided on at least said second principal surface at first longer side edge portion of said board; and

(f) second thin copper wires provided on the second principal surface of said board for defining data input/output lines,

said second thin wires extending over said second principal surface laterally, that is, in a direction parallel to the shorter sides of said board, while passing through the areas defined between said first voltage supply plate and second voltage supply plate, so as to be connected respectively to said pads for external connection.

6. A double-sided printed circuit board for mounting memory integrated circuits which comprises:

(a) a single layer, substantially rectangular insulating board without inner layer wiring;

a plurality of face mounting memory integrated circuit packages soldered to a first surface of said board,

each of said memory integrated circuit packages having similar pin arrangements and a box-shaped configuration the upper surface of which is substantially rectangular, said packages being soldered to said board through a plurality of leads projecting from a pair of longer sides thereof,

said plurality of packages having their longer sides juxtaposed along the length of the board to cover substantially the whole first surface of said board,

(b) a multiplicity of copper pads provided on the first surface of said board to which said packages are soldered,

(c) first thin copper wiring provided on the first surface of said board for defining a multiplicity of signal lines,

said first thin copper wiring being disposed so as to extend in the longitudinal direction of said board while passing through the areas between said multiplicity of soldering pads;

said pins of said packages connected with each other by means of said first thin copper wiring;

(d) a first copper island-shaped plate for supplying a first power signal and a second copper island-shaped plate for supplying a second power signal, said plates being formed on a second surface of said board,

said two plates being disposed so as to cover substantially the whole of said second surface;

(e) a multiplicity of external connection pads provided on at least said second surface along a first longer side edge portion of said board; and

(f) second thin copper wirings provided on the second surface of said board for defining data input/output lines,

said second thin copper wirings extending over said second surface laterally, that is, in a direction parallel to the shorter sides of said board, while passing through the areas defined between said power signal plates, so as to be connected respectively to said pads for external connection.

7. A double-sided printed circuit board according to claim 6 which further comprises:

(g) thin copper wiring to conduct said power signals are provided along the center area of said first surface in a direction parallel to the long sides of said board.

8. A double-sided printed circuit board having first and second principle surfaces comprising:

a) a layer of substantially rectangular insulating board without inner layer wiring;

b) a plurality of soldering pads provided on said first principal surface to which components may be mounted;

c) first thin wires provided on said first principal surface for defining a plurality of signal lines, said first thin wires being disposed so as to extend in the longitudinal direction of said board while passing through the areas between said plurality of soldering pads;

d) first and second power supply plates provided on said first and second principal surfaces, said plates on said second principal surface disposed so as to cover substantially the entire said second principal surface, and said plates on said first principal surface disposed along the central area of said first surface in a direction parallel to the longer sides of said board;

e) a plurality of pads for external connection provided on at least said second principal surface along the longer side edge portion of said board;

f) second thin wires provided on the second principal surface of said board for defining data input/output lines, said second thin wires extending over said second principal surface laterally, that is, in a direction parallel to the shorter sides of said board, while passing through the areas defined between said first and second power supply plates, said second thin wires connected respectively to said pads for external connection; and

g) through-holes connecting some of said first thin wires to some of said second thin wires,

wherein said plates on said first principal surface include footprint portions, at least one capacitor connecting said footprint portions.

9. A double-sided printed circuit board according to claim 8 further comprising:

h) a solder resist film formed so as to cover substantially the whole of said first principal surface of said board except for said soldering pads, said through-holes, and said footprint portions.

10. A double-sided printed circuit board according to claim 9 further comprising:

i) a copper pad oxidation preventing solder coat layer formed at least on said soldering pads.

11. A double-sided printed circuit board according to claim 8, wherein said power plates on said second principal surface include a plurality of openings provided over the surface of said plates.

12. A double-sided printed circuit board having first and second principle surfaces comprising:

a) a layer of substantially rectangular insulating board without inner layer wiring;

b) a plurality of soldering pads provided on said first principal surface to which components may be mounted;

c) first thin wires provided on said first principal surface for defining a plurality of signal lines, said first thin wires disposed so as to extend in the longitudinal direction of said board while passing through the areas between said plurality of soldering pads;

d) first and second power supply plates provided on said second principal surface, said plates on said second principal surface disposed so as to cover substantially the entire said second principal surface;

e) a plurality of pads for external connection provided on at least said second principal surface along the longer side edge portion of said board;

f) second thin wires provided on said second principal surface for defining data input/output lines, said second thin wires extending over said second principal surface laterally, that is, in a direction parallel to the shorter sides of said board, while passing through the areas defined between said first and second power supply plate, said second thin wires connected respectively to said pads for external connection; and

g) a pair of power supply wirings formed on said first principal surface, at least one capacitor connecting said pair of power supply wirings, said power supply wirings provided along the central area of the board in a direction parallel to the longer sides of said board.

13. A double-sided printed circuit board having first and second surfaces for mounting memory integrated circuits comprising:

a) a single layer, substantially rectangular insulating board without inner layer wiring;

b) a plurality of face mounting memory integrated circuit packages mounted to said first surface,

each of said memory integrated circuit packages having similar pin arrangements and a box-shaped configuration, the upper surface of which is substantially rectangular, said packages mounted to said board through a plurality of leads projecting from a pair of longer sides thereof,

said plurality of packages having their longer sides juxtaposed side-by-side along the length of the board to cover substantially the entire first surface of said board;

c) a plurality of soldering pads provided on said first surface to which said packages are mounted;

d) first thin wiring provided on the first surface of said board for defining a plurality of signal lines,

said first thin wiring disposed so as to extend in the longitudinal direction of said board while passing through the areas between said plurality of soldering pads,

said pins of said packages connected to said first thin wiring;

e) first and second island-shaped plates for supplying a first power signal and for supplying a second power signal, respectively, said plates formed on said second surface,

said plates disposed so as to cover substantially the entire said second surface;

f) a plurality of external connection pads provided on at least said second surface along the longer side edge portion of said board;

g) second thin wiring provided on the second surface for defining data input/output lines,

said second thin wiring extending over said second surface laterally, that is, in a direction parallel to the shorter sides of said board, while passing through the areas defined between said power signal plates, said second wiring connected respectively to said pads for external connection; and

h) a pair of power supply wirings formed on said first surface, at least one capacitor connecting said pair of power supply wirings, and said power supply wirings provided along the central area of said board in a direction parallel to the longer sides of said board,

wherein said power supply wirings are provided under the central area of said packages so as to avoid short circuiting between said first thin wiring and said power supply wirings.

14. A double-sided printed circuit board for mounting memory integrated circuits according to claim 13 further comprising:

i) a plurality of capacitors disposed under said plurality of face mounting memory integrated circuit packages, said capacitors connecting said pair of power supply wirings.

15. A double-sided printed circuit board for mounting memory integrated circuits according to claim 13 further comprising:

j) solder resist film formed so as to cover substantially the entire said first surface except for said soldering pads.

16. A double-sided printed circuit board for mounting memory integrated circuits according to claim 15 further comprising:

k) a pad oxidation preventing solder coat layer formed at least on said soldering pads.

17. A double-sided printed circuit board for mounting memory integrated circuits according to claim 13, wherein said power plates on said second surface has a plurality of openings provided over the surface of said power plates.

18. A printed circuit board comprising:

a) a substantially rectangular insulating board;

b) a plurality of soldering pads provided on one surface of said board to which components may be mounted thereon;

c) a plurality of thin wires provided on said one surface for defining a plurality of signal lines, said thin wires disposed so as to extend in the longitudinal direction of said board while passing through the areas between said plurality of soldering pads;

d) first and second power supply plates provided on said one surface of said board, said plates on said one surface disposed along the central area of said one surface in a direction parallel to the longer sides of said board.

wherein said plates on said one surface include footprint portions for mounting at least one capacitor, said capacitor connecting said plates.

19. A printed circuit board according to claim 18 further comprising:

e) a solder resist film formed so as to cover substantially the entire said one surface except for said soldering pads and footprint portions.

20. A printed circuit board according to claim 19 further comprising:

f) a pad oxidation preventing solder coat layer formed at least on said soldering pads.

21. A printed circuit board comprising:

a) a substantially rectangular insulating board having a pair of surfaces;

b) a plurality of soldering pads provided on one surface of said board to which components may be mounted thereon;

c) a plurality of thin wires provided on said one surface for defining a plurality of signal lines, said thin wires disposed so as to extend in the longitudinal direction of said board while passing through the area between said plurality of soldering pads;

d) first and second power supply plates provided on the other surface;

e) a pair of power supply wirings, said wirings being formed on said one surface, at least one capacitor connecting said power supply wirings to each other, and said power supply wirings provided along the central area of said board in a direction parallel to the longer sides of said board.

22. A printed circuit board for mounting memory integrated circuits comprising:

a) a substantially rectangular insulating board;

b) a plurality of face mounting memory integrated circuit packages soldered to a surface of said board,

each of said memory integrated circuit packages having similar pin arrangements and a box-shaped configuration, the upper surface of which is substantially rectangular, said packages soldered to said board through a plurality of leads projecting from a pair of longer sides thereof,

said plurality of packages having their longer sides juxtaposed side-by-side along the length of the board to cover substantially the entire said surface;

c) a plurality of soldering pads provided on said surface to which said packages are soldered;

d) first thin wiring provided on said one surface of said board for defining a plurality of signal lines,

said first thin writing disposed so as to extend in the longitudinal direction of said board while passing through the areas between said plurality of soldering pads,

said pins of said packages connected to said first thin wiring;

e) a pair of power supply wirings formed on said one surface, at least one capacitor connecting said power supply wirings to each other, and said power supply wirings provided along the central area of said board in a direction parallel to the long sides of said board,

wherein said pair of power supply wirings are provided under the central area of said packages so as to avoid short circuiting between said first thin wiring and said pair of power supply wirings.

23. A printed circuit board for mounting memory integrated circuits according to claim 22 further comprising:

f) a plurality of capacitors disposed under the plurality of face mounting memory integrated circuit packages, said capacitors connecting said pair of power supply wirings.

24. A printed circuit board for mounting memory integrated circuits according to claim 22 further comprising:

g) a solder resist film formed so as to cover substantially the entire said surface of said board except for said soldering pads.

25. A printed circuit board for mounting memory integrated circuits according to claim 24 further comprising:

h) a copper pad oxidation preventing solder coat layer formed at least on said soldering pads.