Method of forming a conductive contact bump on a flexible substrate and a flexible substrate

• US 5,097,101 A
• Filed: 02/05/1991
• Issued: 03/17/1992
• Est. Priority Date: 02/05/1991
• Status: Expired due to Term

• Current Assignee: American Video Graphics LP
• Original Assignee: Tektronix Incorporated (Fortive Corp.)
• Inventors: Trobough, Douglas W.
• Primary Examiner(s): ECHOLS, PERCY W
• Application Number:
  US07/650,549
• Time in Patent Office: 406 Days
• Field of Search: 29/846, 29/852, 361/398, 361/403, 361/406, 361/414, 174/254, 174/261, 439/67
• US Class Current: 174/254
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 2201/0367 Metallic bump or raised conductor not used as solder bump
• CPC Class Codes: H05K 2201/0382 Continuously deformed conductors
• CPC Class Codes: H05K 2201/091 Locally and permanently deformed areas including dielectric material
• CPC Class Codes: H05K 2203/0108 Male die used for patterning, punching or transferring
• CPC Class Codes: H05K 2203/0113 Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
• CPC Class Codes: H05K 3/4007 Surface contacts, e.g. bumps H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3457
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base

Abstract

A flexible circuit board is formed from a sheet of polyimide having a contact pad on its first side and a continuous layer of copper on its second side by removing copper from the second side so as to leave at least one discrete island that confronts the pad through the sheet of insulating material, and applying force to the island in the direction from the second side toward the first side, whereby the island is deformed plastically to form a dimple and the pad is deformed plastically to form a bump.

Claims

1. A method of processing a sheet of flexible insulating material having first and second opposite sides and first and second layers of metal on the first and second sides respectively, said method comprising:

(a) removing metal of the first and second layers so as to leave at least one contact pad on the first side and at least one discrete island on the second side, the island confronting the contact pad through the sheet of insulating material, and

(b) applying force to the island in the direction from the second side toward the first side, whereby the island is deformed plastically to form a dimple and the contact pad is deformed plastically to form a contact bump.

2. A method in accordance with claim 1, wherein the flexible insulating material is polyimide, the metal of the first layer contains copper and the metal of the second layer contains copper.

3. A method in accordance with claim 1, further comprising:

(c) applying a layer of flexible conductive material to the second side of the sheet of flexible material.

4. A flexible circuit board manufactured by a method in accordance with claim 1.

5. A method of forming a flexible circuit board from a sheet of insulating material having first and second opposite sides, said method comprising:

(a) depositing first and second layers of metal on the first and second sides respectively of the sheet of insulating material,

(b) removing metal of the first and second layers so as to define at least one discrete contact pad on the first side of the sheet of insulating material and at least one discrete island on the second side, the island confronting the pad through the sheet of insulating material, and

(c) applying force to the island in the direction from the second side toward the first side, whereby the island is deformed plastically to form a dimple and the pad is deformed plastically to form a bump.

6. A method in accordance with claim 5, wherein the flexible insulating material is polyimide, the metal of the first layer contains copper and the metal of the second layer contains copper.

7. A method in accordance with claim 5, further comprising:

(d) applying a layer of flexible conductive material to the second side of the sheet of flexible material.

8. A flexible circuit board manufactured by a method in accordance with claim 5.

9. A method of processing a sheet of insulating material having first and second opposite sides, at least one discrete contact pad on the first side, and a continuous layer of metal on the second side, comprising:

(a) removing metal from the second side so as to leave at least one discrete island that confronts the pad through the sheet of insulating material, and

(b) applying force to the island in the direction from the second side toward the first side, whereby the island is deformed plastically to form a dimple and the pad is deformed plastically to form a bump.

10. A method in accordance with claim 9, wherein the flexible insulating material is polyimide, the metal of the first layer contains copper and the metal of the second layer contains copper.

11. A method in accordance with claim 9, further comprising:

(c) applying a layer of flexible conductive material to the second side of the sheet of flexible material.

12. A flexible circuit board manufactured by a method in accordance with claim 9.