Heat actuated fuse apparatus with solder link
First Claim
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1. A heat actuated fuse for opening at a predetermined actuation temperature, said fuse comprising:
- a. an electrically insulating substrate;
b. first and second electrodes disposed on a surface of the substrate in a spaced apart relationship to define a gap therebetween, each of said electrodes comprising a layer of electrically conductive material;
c. a layer of a first solder material disposed on each of the first and second electrodes, said first solder material having a melting temperature which is substantially higher than the predetermined actuation temperature;
d. a conductive link extending across the gap and disposed on at least a portion of each of said first and second electrodes and on the surface of the substrate between said electrodes, said conductive link comprising a predetermined quantity of a second solder material which is in contact with the layer of solder on each of the first and second electrodes, said second solder material having a melting temperature which substantially corresponds to the predetermined actuation temperature, and said predetermined quantity of said second solder material being containable on the first and second electrodes after melting; and
e. a quantity of flux containing material disposed in contact with at least a portion of the conductive link.
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Abstract
An apparatus for protecting circuitry includes a heat actuated fuse which opens at a predetermined temperature and a resistive device disposed proximate the fuse for heating the fuse in response to an electrical current passed through the device. The fuse includes first and second electrodes bridged by a solder link which melts at the predetermined temperature and retreats to the electrodes. A quantity of flux-containing material is disposed on the link to promote rapid and complete retreat of the solder when the fuse is actuated.
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Citations
20 Claims
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1. A heat actuated fuse for opening at a predetermined actuation temperature, said fuse comprising:
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a. an electrically insulating substrate; b. first and second electrodes disposed on a surface of the substrate in a spaced apart relationship to define a gap therebetween, each of said electrodes comprising a layer of electrically conductive material; c. a layer of a first solder material disposed on each of the first and second electrodes, said first solder material having a melting temperature which is substantially higher than the predetermined actuation temperature; d. a conductive link extending across the gap and disposed on at least a portion of each of said first and second electrodes and on the surface of the substrate between said electrodes, said conductive link comprising a predetermined quantity of a second solder material which is in contact with the layer of solder on each of the first and second electrodes, said second solder material having a melting temperature which substantially corresponds to the predetermined actuation temperature, and said predetermined quantity of said second solder material being containable on the first and second electrodes after melting; and e. a quantity of flux containing material disposed in contact with at least a portion of the conductive link. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. An apparatus for protecting circuitry including at least one circuit element, said apparatus comprising a heat actuated fuse, which opens at a predetermined temperature, for carrying electrical current to the protected circuitry, a resistive device disposed for effecting heating of said fuse in response to an electrical current passed through said device, and means for applying said current to said resistive device, said fuse comprising:
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a. an electrically insulating substrate; b. first and second electrodes disposed on a surface of the substrate in a spaced apart relationship to define a gap therebetween, each of said electrodes comprising a layer of electrically conductive material; c. a layer of a first solder material disposed on each of the first and second electrodes, said first solder material having a melting temperature which is substantially higher than the predetermined actuation temperature; d. a conductive link extending across the gap and disposed on at least a portion of each of said first and second electrodes and on the surface of the substrate between said electrodes, said conductive link comprising a predetermined quantity of a second solder material which is in contact with the layer of solder on each of the first and second electrodes, said second solder material having a melting temperature which substantially corresponds to the predetermined actuation temperature, and said predetermined quantity of said second solder material being containable on the first and second electrodes after melting; and e. a quantity of flux containing material disposed in contact with at least a portion of the conductive link. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
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Specification