Method of molding a solid state image pickup device

• US 5,098,630 A
• Filed: 08/21/1989
• Issued: 03/24/1992
• Est. Priority Date: 03/08/1985
• Status: Expired due to Term

• Current Assignee: Olympus Optical Company Ltd. (Olympus Corporation)
• Original Assignee: Olympus Optical Company Ltd. (Olympus Corporation)
• Inventors: Tanaka, Toshio, Ogiu, Hisao, Takagi, Takeji
• Primary Examiner(s): Lowe, James
• Application Number:
  US07/397,376
• Time in Patent Office: 946 Days
• Field of Search: 264/272.16, 264/272.17, 264/272.15, 264/1.7, 425/116, 425/125, 425/117, 357/72, 357/30 G, 357/30 M
• US Class Current: 264/272.15
• CPC Class Codes: B29C 39/00 Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor B29C41/00 takes precedence
• CPC Class Codes: B29C 70/78 Moulding material on one side only of the preformed part
• CPC Class Codes: B29K 2995/0026 Transparent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H04N 23/555 for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes

Abstract

A solid-state image pickup device comprises a semiconductor chip, a package with a recess in which said semiconductor chip is fixed, and a transparent protective member for protecting an image pickup surface of the semiconductor chip and guiding a light image onto the image pickup surface. The transparent protective member includes a transparent resin layer for covering the image pickup surface and the upper surface of the package without forming a space therebetween, and an incident surface formed on the resin layer in parallel to the image pickup surface. A method manufactures a solid-state image pickup device having a construction described above by using a mold.

Claims

1. A method of manufacturing a solid-state image pickup device, comprising the following steps are performed in the same sequence as stated:

placing a package in a molding cavity of a mold member so that the package is mounted on the bottom surface of the cavity, said package having a semiconductor chip mounted on the upper surface thereof and lead legs downwardly extended therefrom, with the lead legs being inserted in holes formed in the bottom surface of the cavity, and an image pickup surface of the semiconductor chip being directed toward an opening formed in a top surface of the mold member and being parallel with the top surface;

pouring a transparent resin in a fluid state into the molding cavity so that substantially the entire upper surface of the resin extends upward from the top surface of the mold member through said opening;

mounting a forming member onto the top surface of the mold member so that a flat under surface of the forming member removes the upwardly extended portion of the resin and contacts the top surface of the mold member to cover the opening, whereby the under surface of the forming member contacts the resin and is parallel to the image pickup surface of said semiconductor chip placed in the molding cavity;

curing the transparent resin in the fluid state; and

releasing said forming member and package from the mold member, and said forming member from the cured transparent resin, after the curing step.

2. The method according to claim 1, wherein said mold member comprises a base having an upper surface constituting said bottom surface of the mold cavity, a pair of mold halves removably mounted on the upper surface of the base, each mold half including an end face and a recess formed in the end face so that when the mold halves are combined with each other and with the base, the end faces of the mold halves contact each other so that the recesses of the mold halves form said mold cavity together with the upper surface of the base, and fixing means for fixing the mold halves to the base thereon.

3. The method according to claim 2 wherein said releasing step includes a step of moving the mold halves along the upper surface of the base so that they are removed from the cured synthetic resin and package, and a step of removing the forming means from the cured synthetic resin.