Method of fabricating high-density interconnect structures having tantalum/tantalum oxide layers

• US 5,098,860 A
• Filed: 05/07/1990
• Issued: 03/24/1992
• Est. Priority Date: 05/07/1990
• Status: Expired due to Fees

• Current Assignee: Yakisami Capital Co LLC (Intellectual Ventures LLC)
• Original Assignee: The Boeing Co.
• Inventors: Tanielian, Minas H., Chakravorty, Kishore K.
• Primary Examiner(s): Hearn, Brian E.
• Assistant Examiner(s): TRINH, MICHAEL MANH
• Application Number:
  US07/520,174
• Time in Patent Office: 687 Days
• Field of Search: 437/195, 437/190, 437/189, 437/187, 437/192, 437/194, 437/198, 148/DIG. 118, 204/38.3, 204/38.4
• US Class Current: 438/628
• CPC Class Codes: H01L 21/288 from a liquid, e.g. electrolytic deposition
• CPC Class Codes: H01L 21/4846 Leads on or in insulating or insulated substrates, e.g. metallisation H01L21/4821 takes precedence; metallisation of ceramics in general C04B41/51; printed circuits H05K3/00
• CPC Class Codes: H01L 21/76879 by selective deposition of conductive material in the vias, e.g. selective C.V.D. on semiconductor material, plating plating on semiconductors in general H01L21/288

Abstract

A method of fabricating a high-density multilayer copper/polyimide interconnect structure utilizing a blanket tantalum/tantalum oxide layer that electrically connects all of the electroplating seed layers to the edge of the substrate; upon completion of the electroplating process, the excess tantalum/tantalum oxide layer is etched off to produce isolated conductor lines. A multilayer copper/polyimide interconnect structure may be fabricated by repeating this fabrication sequence for each layer.

Claims

1. A method for preparing a metal/dielectric high-density interconnect structure, comprising:

(a) providing a substrate coated on its upper surface with patterned electroplating seed layers, and a photosensitive dielectric layer photopatterned thereover, which exposes the electroplating seed layers;

(b) depositing on said dielectric and exposed electroplating seed layers a substantially continuous layer of tantalum;

(c) forming a substantially continuous layer of anodic tantalum oxide on said tantalum layer to produce a tantalum/tantalum oxide layer;

(d) patterning said tantalum/tantalum oxide layer to expose said electroplating seed layers while maintaining electrical connection between said electroplating seed layers and said tantalum layer;

(e) electroplating a metal conductor on said electroplating seed layers; and

(f) removing exposed tantalum/tantalum oxide layers to electrically isolate said metal conductor lines, and to thereby produce a planar interconnect structure.

2. The method of claim 1, wherein said photosensitive dielectric is a polyimide and said metal conductor is copper.

3. The method of claim 1, wherein said tantalum layer is deposited by sputter deposition.

4. The method of claim 1, wherein said tantalum layer is about 1000 to 1500 Å

thick.

5. The method of claim 1, wherein said tantalum oxide layer is about 600 Å

thick.

6. The method of claim 1, wherein said tantalum oxide layer is grown by an anodization technique.

7. The method of claim 1, wherein said tantalum/tantalum oxide layer is patterned by etching with SF₆ :

O₂.

8. The method of claim 1, wherein said electroplating is carried out using an ethylene glycol/ammonium borate bath.

9. A method of producing a multilayer metal/dielectric high-density interconnect structure, which comprises:

(a) providing a substrate coated on its upper surface with patterned electroplating seed layers covered by a photosensitive dielectric layer, and photopatterning trenches in the dielectric layer to thereby expose the electroplating seed layers, followed by baking the substrate to harden the dielectric layer;

(b) depositing on said dielectric and exposed electroplating seed layers a substantially continuous layer of tantalum;

(c) forming a substantially continuous layer of anodic tantalum oxide on said tantalum layer to produce a tantalum/tantalum oxide layer;

(d) patterning said tantalum/tantalum oxide layer to expose said electroplating seed layers while maintaining electrical connection between said electroplating seed layers and said tantalum layer;

(e) electroplating a metal conductor on said electroplating seed layers;

(f) removing exposed tantalum/tantalum oxide layers to electrically isolate said metal conductor lines, thereby producing a planar interconnect structure; and

(g) combining a plurality of said planar interconnect structures to form a multilayer metal/dielectric high-density interconnect structure.