Fusible flexible printed circuit and method of making same

• US 5,099,219 A
• Filed: 02/28/1991
• Issued: 03/24/1992
• Est. Priority Date: 02/28/1991
• Status: Expired due to Fees

• Current Assignee: Advanced Circuit Technology, Inc. (Amphenol Corporation)
• Original Assignee: Rock, Ltd. Partnership
• Inventors: Roberts, Joseph A.
• Primary Examiner(s): Broome, Harold
• Application Number:
  US07/662,256
• Time in Patent Office: 390 Days
• Field of Search: 337/297, 337/1, 337/4, 337/142, 337/145, 337/295, 337/290, 29/623, 29/829, 29/832, 29/837, 29/846, 29/847
• US Class Current: 337/297
• CPC Class Codes: H01H 69/022 of printed circuit fuses
• CPC Class Codes: H01H 85/0056 Heat conducting or heat absorbing means associated with the fusible member, e.g. for providing time delay
• CPC Class Codes: H01H 85/046 Fuses formed as printed circuits
• CPC Class Codes: H01H 85/43 Means for exhausting or absorbing gases liberated by fusing arc, or for ventilating excess pressure generated by heating
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/0271 Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
• CPC Class Codes: H05K 1/0293 Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/0305 Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
• CPC Class Codes: H05K 2201/0338 Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer etched tri-metal structure H05K2201/0361
• CPC Class Codes: H05K 2201/09781 Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
• CPC Class Codes: H05K 2201/10181 Fuse
• CPC Class Codes: H05K 3/281 by means of a preformed insulating foil H05K3/284 takes precedence
• CPC Class Codes: Y10T 29/49107 Fuse making

Abstract

A fusible flexible printed circuit includes one or more conductors extending along a flexible dielectric substrate. Each conductor is comprised of a layer of electrically conductive material and a layer of fusible material extending along part or all of said conductive layer. One or more gaps is formed in the conductive layer at location opposite a segment of the fusible layer so that electrical current flowing through each conductor is required to pass in its entirety through the layer of fusible material at the location of each gap in the layer of conductive material. The integral fuses are designed to specific electrical parameters and may be located randomly along circuit runs. Preferably, the circuit is reinforced at the locations of the fuses by metal support strips designed to minimize motion stress on the fuses and the fuses are sealed within bubbles in a protective overlay which capture debris when the fuses are blown. The use of such a circuit to incorporate a variety of fuses having different fuse ratings into the conductive paths of a flexible printed circuit is also disclosed, as is a method of making the fusible circuit.

Claims

1. A fusible flexible circuit comprising a flexible dielectric substrate;

one or more bimetallic electrical circuit paths adhered to said substrate at least one of said paths being a fused path comprised of a layer of electrically conductive material and a layer of fusible material extending along at least part of said layer of conductive material, and means defining a gap in said layer of conductive material at one or more selected locations therealong whereby electrical current flowing along each of said fused paths is conducted primarily through said conductive material layer except at the location of each said gap where it is conducted solely through said fusible material layer.

2. The circuit defined in claim 1 wherein said substrate is laminated to the conductive material layer of each of said fused paths.

3. The circuit defined in claim 2 and further including a dielectric layer laminated to the fusible material layer of each of said fused paths.

4. The circuit defined in claim 3 and further including a window in said dielectric layer directly opposite each said gap in the electrically conductive layer of each of said fused paths.

5. The circuit defined in claim 3 and further including a small noncontacting bubble formed in one of said substrate and said dielectric layer opposite each said gap.

6. The circuit defined in claim 3 and further including a metal reinforcing strip laminated to s id substrate opposite each said gap.

7. A fusible flexible circuit including a flexible electrically insulating sheet substrate;

a plurality of bimetallic electrical conductors mounted to said substrate in spaced-apart relation, each said conductor comprising a layer of electrically conductive material and a layer of fusible material in intimate electrical contact with and extending along at least part of said conductive layer between said conductive layer and said substrate;

means defining one or more gaps in said conductive layer, each said gap being located opposite a segment of said fusible layer so that electrical current flowing through each conductor is conducted primarily through said layer of conductive material except at the location of each said gap in the layer of conductive material where it is conducted solely through said layer of fusible material.

8. The circuit defined in claim 7 and further including electrical insulating material laminated to the exposed surfaces of said substrate and said conductors except at said one or more gaps so that a bubble is present in the electrical insulating material opposite each said gap.

9. The circuit defined in claim 7 and further including a metal reinforcing strip laminated to said substrate opposite each said gap.

10. The circuit defined in claim 7 and further including terminals at the ends of said conductors.

11. The circuit defined in claim 10 wherein at least some of said terminals are raised above said conductors.

12. The method of making a fusible flexible printed circuit comprising the steps of forming a flexible dielectric substrate, and forming at least one flexible conductive path of the printed circuit on the substrate as a bimetallic conductor, said bimetallic conductor having a layer of conductive material and a layer of fusible material extending in a superimposed relation along part or all of said layer of conductive material.

13. The method defined in claim 12 and including the additional step of forming a gap at one or more selected locations along said layer of conductive material, each said gap being located opposite a segment of the layer of fusible material.

14. The method defined in claim 13 and including the additional step of laminating a layer of flexible electrically insulating material to the conductive paths and the substrate except at the areas thereof at each gap so that a nonadherent bubble is present in said layer opposite each gap.

15. The method defined in claim 13 and including the additional step of laminating a metal reinforcing strip to said substrate opposite each said gap.

16. The method defined in claim 15 wherein said strip is shaped to support and stabilize the fusible material layer opposite the corresponding gap during flexing or vibration of the circuit.

17. The method defined in claim 15 wherein each said strip is shaped to provide a heat sink under the fusible material layer at the corresponding gap.

18. The method of making a flexible printed circuit having at least one integral fuse comprising the steps of

applying at least on fusible metal strip to one face of a conductive metal sheet to form a bimetallic structure;

applying resist coatings to said structure to define the locations of a fuse gap at said one face of said sheet which crosses said fusible strip and a conductor pattern on the opposite face of said sheet, a segment of which is aligned with said fusible strip;

etching the structure to form the fuse gap and conductor pattern;

removing the resist coatings;

laminating a flexible dielectric substrate to said fusible strip and the adjacent surfaces of said conductor pattern;

chemically milling said conductor pattern to define terminal areas of said conductor pattern and to deepen said fuse gap to the level of each said fusible strip to form a fuse thereat.

19. The method defined in claim 18 and including the additional step of applying a metal layer to the underside of said substrate to stabilize each said fusible strip during manufacture of the circuit.

20. The method defined in claim 19 wherein said metal layer is applied prior to said chemical milling step.

21. The method defined in claim 20 and including the additional step of removing selected portions of said metal layer so as to define a selectively shaped metal support strip under each said fusible strip.

22. The method defined in claim 21 and including the additional step of removing the support strip under at least one fusible strip.

23. The method defined in claim 20 and including the additional step of adhering a dielectric covering to the exposed surfaces of said conductors except in the terminal areas thereof.

24. The method defined in claim 23 and including the step of forming a nonadhering bubble in said covering over each said fuse.