Apparatus for inspecting solder portion of a circuit board

• US 5,103,105 A
• Filed: 10/24/1990
• Issued: 04/07/1992
• Est. Priority Date: 11/02/1989
• Status: Expired due to Term

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Ikegaya, Kazutoshi, Maruyama, Yuji, Toba, Hiroto, Tsuda, Yukifumi, Sannomiya, Kunio
• Primary Examiner(s): Nelms, David C.
• Assistant Examiner(s): Messinger, Michael
• Application Number:
  US07/602,573
• Time in Patent Office: 531 Days
• Field of Search: 250/563, 250/561, 250/562, 250/571, 250/572, 250/234, 250/235, 250/236, 356/376, 356/394, 382/8, 364/560-564
• US Class Current: 250/559.23
• CPC Class Codes: G01R 31/309 of printed or hybrid circuits or circuit substrates

Abstract

A beam of light is applied to a surface of a circuit board provided with at least one solder portion. The light beam scans the surface of the circuit board. Height data are derived from a portion of the light beam which is scattered at the surface of the circuit board. The height data represent a height of a currently-scanned point of the surface of the circuit board. The height data are accumulatively added for the solder portion. A variation in the height data is calculated. The accumulative addition of the height data is executed and suspended in response to the calculated variation in the height data. A decision is made as to whether the solder portion is acceptable or unacceptable on the basis of a result of the accumulative addition.

Claims

1. An apparatus for inspecting a circuit board provided with at least one solder portion, the apparatus comprising:

means for emitting a beam of light;

means for applying the light beam to a surface of the circuit board;

means for allowing the light beam to scan the surface of the circuit board;

means for deriving height data from a portion of the light beam which is scattered at the surface of the circuit board, the height data representing a height of a currently-scanned point of the surface of the circuit board;

means for accumulatively adding the height data for the solder portion;

means for calculating a variation in the height data;

means for executing and suspending the accumulatively adding by the adding means in response to the calculated variation in the height data; and

means for deciding whether the solder portion is acceptable or unacceptable on the basis of a result of the accumulatively adding by the adding means.

2. The apparatus of claim 1 further comprising means for averaging the height data to generate average height data, and means for feeding the average height data to the adding means and the variation calculating means.

3. An apparatus for inspecting a circuit board provided with at least one solder portion, the apparatus comprising:

means for emitting a beam of light;

means for applying the light beam to a surface of the circuit board;

means for allowing the light beam to scan the surface of the circuit board;

means for deriving height data from a portion of the light beam which is scattered at the surface of the circuit board, the height data representing a height of a currently-scanned point of the surface of the circuit board;

means for calculating a differential of the height data for the solder portion; and

means for deciding whether the solder portion is acceptable or unacceptable on the basis of the calculated differential of the height data.

4. The apparatus of claim 3 wherein the deciding means comprises means for accumulatively adding the calculated differential of the height data, and means for deciding whether or not the solder portion is acceptable or unacceptable on the basis of a result of the accumulative adding by the adding means.

5. The apparatus of claim 3 wherein the deciding means comprises means for detecting a maximum and a minimum of the calculated differential of the height data, means for comparing the calculated differential of the height data with a predetermined reference region, means responsive to a result of the comparing for generating count data representing a number of times the calculated differential lies in the predetermined reference region, and means for deciding whether or not the solder portion is acceptable or unacceptable on the basis of the detected maximum, the detected minimum, and the count data.

6. An apparatus for inspecting a circuit board provided with at least one solder portion, the apparatus comprising:

means for emitting a beam of light;

means for applying the light beam to a surface of the circuit board;

means for allowing the light beam to scan the surface of the circuit board;

means for deriving height data from a portion of the light beam which is scattered at the surface of the circuit board, the height data representing a height of a currently-scanned point of the surface of the circuit board;

means for calculating a differential of the height data, and generating differential data representing the calculated differential of the height data, wherein differential data and corresponding height data compose general data;

means for calculating a first number of the general data lying in a predetermined acceptable two-dimensional region for the solder portion, the acceptable region being defined by a first predetermined height range and a first predetermined differential range;

means for calculating a second number of the general data lying in a predetermined unacceptable two-dimensional region for the solder portion, the unacceptable region being defined by a second predetermined height range and a second predetermined differential range; and

means for deciding whether the solder portion is acceptable or unacceptable on the basis of the calculated first and second numbers.

7. An apparatus for inspecting a circuit board provided with at least one solder portion, the apparatus comprising:

means for emitting a beam of light;

means for applying the light beam to a surface of the circuit board;

means for allowing the light beam to scan the surface of the circuit board;

means for deriving height data from a portion of the light beam which is scattered at the surface of the circuit board, the height data representing a height of a currently-scanned point of the surface of the circuit board;

means for calculating a differential of the height data, and generating differential data representing the calculated differential of the height data, wherein differential data and corresponding height data compose general data;

means for calculating a first number of the general data lying in a predetermined acceptable two-dimensional region for the solder portion, the acceptable region being defined by a first predetermined height range and a first predetermined differential range;

means for calculating a second number of the general data lying in a predetermined unacceptable two-dimensional region for the solder portion, the unacceptable region being defined by a second predetermined height range and a second predetermined differential range;

first adding means for accumulatively adding the height data corresponding to general data lying in the acceptable region;

second adding means for accumulatively adding the height data corresponding to general data lying in the unacceptable region; and

means for deciding whether the solder portion is acceptable or unacceptable on the basis of the calculated first and second numbers, and results of the accumulatively adding by the first and second adding means.

8. An apparatus for inspecting a circuit board provided with at least one solder portion, the apparatus comprising:

means for emitting a beam of light;

means for applying the light beam to a surface of the circuit board;

means for allowing the light beam to scan the surface of the circuit board;

means for deriving height data from a portion of the light beam which is scattered at the surface of the circuit board, the height data representing a height of a currently-scanned point of the surface of the circuit board;

means for deriving luminance data from a portion of the light beam which is scattered at the surface of the circuit board, the luminance data representing a luminance of a currently-scanned point of the surface of the circuit board;

means for accumulatively adding the luminance data for the solder portion;

means for calculating a variation in the height data;

means for executing and suspending the accumulatively adding by the adding means in response to the calculated variation in the height data; and

means for deciding whether the solder portion is acceptable or unacceptable on the basis of a result of the accumulatively adding by the adding means.

9. An apparatus for inspecting a circuit board provided with at least one solder portion, the apparatus comprising:

means for emitting a beam of light;

means for applying the light beam to a surface of the circuit board;

means for allowing the light beam to scan the surface of the circuit board;

means for deriving height data from a portion of the light beam which is scattered at the surface of the circuit board, the height data representing a height of a currently-scanned point of the surface of the circuit board;

means for calculating a differential of the height data, and generating differential data representing the calculated differential of the height data, wherein differential data and corresponding height data compose general data;

first detecting means for detecting the general data which lies in a predetermined acceptable two-dimensional region, the acceptable region being defined by a first predetermined height range and a first predetermined differential range;

second detecting means for detecting the general data which lies in a predetermined unacceptable two-dimensional region, the unacceptable region being defined by a second predetermined height range and a second predetermined differential range;

first adding means responsive to the first detecting means for accumulatively adding the luminance data corresponding to general data lying in the acceptable region for the solder portion;

second adding means responsive to the second detecting means for accumulatively adding the luminance data corresponding to general data lying in the unacceptable region for the solder portion; and

means for deciding whether the solder portion is acceptable or unacceptable on the basis of results of the accumulatively adding by the first adding means and the second adding means.