Distributed infrared communication system

• US 5,103,108 A
• Filed: 09/18/1990
• Issued: 04/07/1992
• Est. Priority Date: 10/17/1985
• Status: Expired due to Fees

• Current Assignee: K and M Electronics Incorporated, WIRELESS COMMUNICATIONS PRODUCTS LLC
• Original Assignee: James W. Crimmins
• Inventors: Crimmins, James W.
• Primary Examiner(s): Howell, Janice A.
• Assistant Examiner(s): HANIG, RICHARD E
• Application Number:
  US07/584,804
• Time in Patent Office: 567 Days
• Field of Search: 250/338.4, 250/338.1, 250/353, 250/338.3, 250/338.2
• US Class Current: 250/338.1
• CPC Class Codes: G03G 5/08221 comprising one or two silicon based layers
• CPC Class Codes: G03G 5/08228 at least one with varying composition
• CPC Class Codes: G03G 5/08235 comprising three or four silicon-based layers
• CPC Class Codes: G03G 5/08242 at least one with varying composition
• CPC Class Codes: G03G 5/0825 comprising five or six silicon-based layers
• CPC Class Codes: G03G 5/08257 at least one with varying composition
• CPC Class Codes: G03G 5/10 Bases for charge-receiving or other layers

Abstract

A two way communication system is described wherein a base unit can transfer information with remotely-located unit such as a portable infrared communicator. The base unit produces carrier frequency signals to a plurality of distributed transmitter modules which expose different areas to infrared transmissions. A plurality of down-link or base unit associated infrared detection modules are distributed to receive infrared carrier frequency communications from one or more remote or portable units and convert these to electrical signals at the same carrier frequencies. The latter electrical signals are delivered to the base unit through a common cable. This cable also serves to deliver electrical power to the base unit to the latter modules. The electrical carrier frequency signals are combined at the base unit which uses this to provide the base unit with the information detected from the remote unit and produce a signal representative of the detected infrared energy. The latter signal may then be used to control the output power from the remote or portable units.

Claims

1. An infrared communication sensor for detecting modulated infrared carrier radiation, comprising:

infrared detecting means for generating an electrical signal in response to modulated incident infrared radiation and representative of the modulation thereof;

an infrared transparent cover located over the infrared detecting means, and

an infrared transparent Faraday shield located between the incident infrared radiation and the infrared detecting means and spaced therefrom to shield the latter against extraneous electric fields.

2. The infrared sensor as claimed in claim 1 wherein the faraday shield comprises a grid of electrical conductors.

3. The infrared sensor as claimed in claim 1 wherein the grid of electrical conductors are spaced and sized so as to obscure less than about twenty percent of the incident infrared radiation.

4. The infrared sensor as claimed in claim 1 wherein the faraday shield is located between the cover and the infrared detection means.

5. The infrared sensor as claimed in claim 2 and further including:

a conductive housing surrounding the infrared detecting means and having an open port through which incident infrared radiation arrives, said grid of electrical conductors being located between the infrared detecting means and the open port and being electrically grounded.

6. The infrared sensor as claimed in claim 5 wherein the infrared detecting means is located in a recessed position within the housing with the infrared transparent cover also being in a recessed position inside the housing to sealingly protect the infrared detecting means from dust and particles.

7. The infrared sensor as claimed in claim 5 wherein the housing on the inside thereof has an infrared radiation reflecting surface.

8. The infrared sensor as claimed in claim 7 wherein the infrared detecting means includes a plurality of photo detectors and an infrared transparent spherically-shaped lens element interposed between the photodetectors and the cover and means for optically coupling the element to the photodetectors without air/surface interfaces.

9. The infrared sensor as claimed in claim 8 wherein the element is a hemispherically-shaped lens.

10. An infrared communication sensor for detecting modulated infrared carrier radiation, comprising:

a plurality of photodetectors;

an infrared transparent lens element having an externally curved surface to gather infrared light, said lens element being positioned to overly the photodetectors so as to effectively enlarge their optical viewing angle; and

an infrared coupling material interposed between the photodetectors and the lens element to couple infrared light passing therethrough to the photodetectors and affix to the lens element.

11. The infrared sensor as claimed in claim 10 and further including a rim extending above the photodetectors and surrounding the photodetectors, said infrared coupling material being placed within the rim to a height sufficient to cover the photodetectors and enable adherence to the lens element.

12. The infrared sensor as claimed in claim 10 and further including an infrared transparent faraday shield over the lens element.

13. The infrared sensor as claimed in claim 10 wherein the lens element has a spherically shaped surface facing the faraday shield.

14. The infrared sensor as claimed in claim 13 wherein the lens element is a hemispherically shaped lens.

15. The infrared sensor as claimed in claim 13 wherein the lens element is a sphere.

16. The infrared sensor as claimed in claim 12 and further including an infrared reflective material surrounding said lens element to enlarge the viewing angle of the photodetectors.