Direct patterning of metals over a thermally inefficient surface using a laser

• US 5,104,480 A
• Filed: 10/12/1990
• Issued: 04/14/1992
• Est. Priority Date: 10/12/1990
• Status: Expired due to Term

• Current Assignee: Lockheed Martin Corporation (Martin Marietta Corporation)
• Original Assignee: General Electric Company
• Inventors: Eichelberger, Charles W., Wojnarowski, Robert J.
• Primary Examiner(s): Powell, William A.
• Application Number:
  US07/597,255
• Time in Patent Office: 550 Days
• Field of Search: 156/643, 156/646, 156/656, 156/664, 156/665, 156/666, 156/668, 219/121.68, 219/121.69, 219/121.84, 219/121.85
• US Class Current: 216/65
• CPC Class Codes: B23K 2103/05 Stainless steel
• CPC Class Codes: B23K 2103/08 Non-ferrous metals or alloys
• CPC Class Codes: B23K 2103/12 Copper or alloys thereof
• CPC Class Codes: B23K 2103/14 Titanium or alloys thereof
• CPC Class Codes: B23K 2103/15 Magnesium or alloys thereof
• CPC Class Codes: B23K 2103/16 Composite materials , e.g. fibre reinforced
• CPC Class Codes: B23K 2103/172 wherein at least one of the layers is non-metallic
• CPC Class Codes: B23K 2103/26 Alloys of Nickel and Cobalt and Chromium
• CPC Class Codes: B23K 2103/42 Plastics B23K2103/16 takes precedence
• CPC Class Codes: B23K 2103/50 Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
• CPC Class Codes: B23K 2103/54 Glass
• CPC Class Codes: B23K 26/40 taking account of the properties of the material involved
• CPC Class Codes: H01C 17/242 by laser trimming by laser in general B23K26/351
• CPC Class Codes: H01L 21/4846 Leads on or in insulating or insulated substrates, e.g. metallisation H01L21/4821 takes precedence; metallisation of ceramics in general C04B41/51; printed circuits H05K3/00
• CPC Class Codes: H05K 2201/0112 Absorbing light, e.g. dielectric layer with carbon filler for laser processing
• CPC Class Codes: H05K 2201/0338 Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
• CPC Class Codes: H05K 2201/2081 Compound repelling a metal, e.g. solder
• CPC Class Codes: H05K 2203/0361 Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
• CPC Class Codes: H05K 2203/0384 Etch stop layer, i.e. a buried barrier layer for preventing etching of layers under the etch stop layer
• CPC Class Codes: H05K 2203/173 Adding connections between adjacent pads or conductors, e.g. for modifying or repairing
• CPC Class Codes: H05K 2203/175 : Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
• CPC Class Codes: H05K 3/027 : the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
• CPC Class Codes: H05K 3/062 : consisting of metals or alloys or metallic inorganic compounds H05K3/065 takes precedence
• CPC Class Codes: H05K 3/108 : by semi-additive methods; masks therefor characterised by metallic etch mask H05K3/062; electroplating methods or apparatus H05K3/241
• CPC Class Codes: H05K 3/143 : Masks therefor H05K3/048 takes precedence
• CPC Class Codes: H05K 3/225 : Correcting or repairing of printed circuits H05K1/0292, H05K3/222, H05K3/288, H05K3/4685 take precedence
• CPC Class Codes: H05K 3/381 : by special treatment of the substrate
• CPC Class Codes: H05K 3/388 : by the use of a metallic or inorganic thin film adhesion layer

Abstract

Conductive patterns may be formed on the surface of thermally inefficient substrates by depositing a uniform layer of metal thereover whose upper surface is substantially UV light absorbing followed by laser ablation of the deposited metal to leave the deposited metal only in the desired metal pattern. Thermally efficient substrates may be rendered thermally inefficient by the deposition of a thermally inefficient material thereon. That thermally inefficient material may be either electrically insulating or a metal. A two layer metallization comprising a first, thermally inefficient reactive metal and a second UV light absorbing metal is preferred. When disposed on a thermally inefficient substrate, this two layer metallization ablates reactively as the two layers burn off together. This laser ablation process substantially roughens the surface of polymer dielectrics and may be used to repair open traces in printed circuit structures.

Claims

1. A method of producing a desired metal pattern on a surface of a thermally inefficient substrate comprising:

depositing a layer of a first metal on said substrate;

depositing a layer of a second, ultraviolet light absorbing metal on said first metal;

exposing said second metal to intense ultraviolet light in accordance with said desired pattern to reactively ablate said first and second metals from said substrate together.

2. The method recited in claim 1 wherein:

said first metal is selected from the group consisting of titanium, chromium, magnesium, manganese, nichrome and stainless steel and alloys and mixtures thereof; and

said second metal is selected from the group consisting of copper and gold and alloys and mixtures thereof.

3. The method recited in claim 2 wherein:

said substrate is disposed in an oxidizing atmosphere during said exposing step.

4. The method recited in claim 3 wherein:

said first and second metals burn off said substrate together during said exposing step.

5. The method recited in claim 4 wherein:

said oxidizing atmosphere comprises air.

6. The method recited in claim 3 wherein the step of exposing comprises:

scanning an ultraviolet laser beam across said substrate.

7. The method recited in claim 3 wherein:

said oxidizing atmosphere comprises air.

8. The method recited in claim 1 further comprising:

etching those portions of said substrate from which said first and second metals were ablated.

9. The method recited in claim 1 wherein said substrate is electrically conducting, said first metal is titanium and said method further comprises, after the exposing step, the steps of:

removing said second metal from said titanium;

allowing the then exposed titanium to form a surface coating of titanium oxide; and

electroplating said substrate to build up electroplated metal in those areas from which said metals were ablated without building up electroplated metal on said titanium.

10. The method recited in claim 1 wherein the step of exposing comprises:

scanning an ultraviolet laser beam across said substrate.

11. A method of increasing the surface area of a polymer comprising:

depositing a first layer of metal selected from the group consisting of titanium, chromium, nichrome, stainless steel, magnesium and manganese and alloys and mixtures thereof on said polymer;

depositing a second layer of metal selected from the group consisting of copper and gold and alloys and mixtures thereof on said first layer of metal;

laser ablating said second and first metal layers together in an oxidizing atmosphere under conditions in which said first layer of metal burns off to leave said polymer with a structured surface.

12. A method of repairing a broken trace in a printed circuit comprising:

depositing a layer of a first metal on said printed circuit, in ohmic contact with both pieces of said trace and across the gap between them;

depositing a layer of a second, ultraviolet light absorbing metal on said first metal;

laser albating said first and second metals from said printed circuit while leaving said metals in ohmic contact with both pieces of said broken circuit trace and continuous therebetween to leave said first and second metals as a conducting bridge connecting the two pieces of said broken trace.

13. A method of trimming a resistor comprising:

depositing a layer of a first metal on said resistor;

depositing a layer of a second, ultraviolet light absorbing, metal on said first metal;

laser ablating said first and second metals together from said resistor in a pattern to provide said resistor with a desired resistance.

14. A method of producing a metal pattern on a surface of a high thermal conductivity substrate comprising:

depositing a layer of a first thermally inefficient metal on said substrate, said layer being thick enough to render the resulting surface thermally inefficient;

depositing a layer of a second, ultraviolet light absorbing metal on said first metal;

exposing said second metal to intense ultraviolet light in the inverse of said pattern to ablate said second metal from said first metal.

15. The method recited in claim 14 wherein:

said first metal is selected from the group consisting of titanium, chromium, magnesium, manganese, nichrome and stainless steel; and

said second metal is selected from the group consisting of copper and gold.

16. The method recited in claim 15 wherein:

said substrate is disposed in an oxidizing atmosphere during said exposing step.

17. The method recited in claim 16 wherein:

said oxidizing atmosphere comprises oxygen.

18. The method recited in claim 17 wherein the step of exposing comprises:

scanning an ultraviolet laser beam across said substrate.

19. The method recited in claim 15 further comprising:

etching exposed portions of said first metal with an etchant which does not attack said second metal.

20. The method recited in claim 14 wherein said substrate is electrically conducting, said first metal is titanium and said method further comprises, after the step of exposing, the steps of:

selectively removing said second metal from said titanium;

allowing the then exposed titanium to form a surface coating of titanium oxide; and

electroplating said substrate to build up electroplated metal in those areas from which said metals were ablated without building up electroplated metal on said

21. The method recited in claim 14 wherein the step of exposing comprises:

scanning an ultraviolet laser beam across said substrate.

22. A method of producing a metal pattern on a surface of a high thermal conductivity substrate comprising:

depositing a first layer of a metal on said substrate,

depositing a second layer of a metal on said first layer of metal;

depositing a third layer of a thermally inefficient metal on said second layer of metal, said third thick enough to render the resulting surface thermally inefficient;

depositing a fourth layer of an ultraviolet light absorbing metal on said third layer of metal;

exposing said fourth layer of metal to intense ultraviolet light in the inverse of said pattern to ablate said fourth layer of metal from the surface of said third layer of metal.

23. The method recited in claim 22 further comprising the step of:

etching exposed portions of said third layer of metal with an etchant to which said fourth layer of metal is substantially immune to pattern said third layer of metal.

24. The method recited in claim 23 further comprising the step of:

etching exposed portions of said second layer of metal with an etchant to which said third layer of metal is substantially immune.

25. The method recited in claim 24 further comprising the step of:

etching exposed portions of said first layer of metal with an etchant to which said second layer of metal is substantially immune.

26. The method recited in claim 22 wherein:

said first and third layers comprise titanium; and

said second and fourth layers comprise copper.