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Device and method of manufacturing a device

  • US 5,104,848 A
  • Filed: 04/14/1989
  • Issued: 04/14/1992
  • Est. Priority Date: 04/21/1988
  • Status: Expired due to Fees
First Claim
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1. A device comprising semiconductor elements and elements of an oxidic material, electrically conductive connections being provided between said semiconductor elements and said elements of oxidic material, said electrically conductive connections comprising at least one antidiffusion layer composed of an amorphous alloy of the composition Ax E1-x, wherein A is at least one element selected from the group consisting of Zn, Nb, Mo, Ru, Rh, Pd, Hb, Ta, W, Re, Os, Ir and Pt, wherein E is B or a mixture of B and Si and wherein X has a value of 0.7 to 0.95.

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