Process for multilayer printed circuit board manufacture
First Claim
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1. A process for treating a copper layer having a copper oxide surface layer thereon, comprising the steps of:
- (a) at least partially dissolving the copper oxide surface layer by contacting the surface layer with one or more copper oxide dissolving compounds, and(b) laminating the treated copper layer.
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Abstract
Process for at least partially dissolving a copper oxide surface layer by contacting the surface layer with one or more copper oxide dissolving compounds. When used in the manufacture of a multilayer printed circuit board, the process improves adhesion between board layers, reduces or eliminates localized delamination of a multilayer board that occurs during through-hole drilling, and eliminates or substantially reduces the occurrence of pink ring.
95 Citations
39 Claims
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1. A process for treating a copper layer having a copper oxide surface layer thereon, comprising the steps of:
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(a) at least partially dissolving the copper oxide surface layer by contacting the surface layer with one or more copper oxide dissolving compounds, and (b) laminating the treated copper layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 29, 31, 32, 35, 36)
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19. A process for the manufacture of a multilayer printed circuit board, the process comprising the steps of:
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(a) providing a substrate having a copper circuit pattern thereon, the copper circuit pattern having a surface coating of copper oxide; (b) at least partially dissolving the surface coating of copper oxide by contacting the surface coating with one or more copper oxide dissolving compounds; and (c) laminating together the substrate resulting from step (b) with other layers needed to form the multilayer printed circuit board. - View Dependent Claims (20, 21, 22, 23, 24, 25, 26, 27, 28, 30, 33, 34, 37, 38, 39)
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Specification