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Eutectic bonding of metal to ceramic

  • US 5,108,026 A
  • Filed: 05/14/1991
  • Issued: 04/28/1992
  • Est. Priority Date: 05/14/1991
  • Status: Expired due to Fees
First Claim
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1. A method for bonding a metal foil to a nonmetallic substrate, said foil being formed of a metal reactable to produce an oxide compound and further suitable for producing in combination with said oxide compound a low melting eutectic oxide composition, said method comprisingdepositing a thin film of said metal onto the substrate,oxidizing the metal film to form said metal oxide compound,arranging the metal foil and the substrate such that the foil lies in contact with the oxidized deposit,heating the arrangement at a temperature above the eutectic melting point and below the metal melting point, whereupon a liquid phase forms at the interface between the metal foil and the oxidized film,continuing to heat the arrangement at a temperature above the eutectic melting point for a time sufficient to dissolve the metal oxide compound into the liquid phase, whereupon the liquid phase wets the substrate, andcooling the arrangement, whereby the liquid phase solidifies and bonds the metal foil to the substrate.

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