Lead cut and tape attach apparatus
First Claim
1. A lead cut and tape attach apparatus for automatically cutting leads on one side of a semiconductor I.C. quad device and subsequently cutting and attaching a piece of tape over the gaps formed between the cut leads and for sequentially cutting the leads and attaching the tape thereover on the remaining sides of the quad device, said apparatus comprising:
- means (32) for holding a semiconductor I.C. quad device having a plurality of leads extending from its four sides and for sequentially rotating the same 90 degrees;
double-acting punch assembly means (34) for cutting the leads on one side of the quad device on a first downward stroke and for subsequently cutting and attaching a piece of tape over gaps formed between the cut leads on a second downward stroke;
means (30) for feeding a continuous roll of tape between said holding means and said double-acting punching assembly means;
said punch assembly means (30) including an inner punch blade (58) for cutting the leads and outer punch (56) for cutting the tape and attaching the same, said inner punch blade being disposed coaxially within said outer punch for slidable movement relative to one another;
cam means (68,
78) for actuating said inner punch blade relative to said outer punch so that on the first downward stroke of said punch assembly means said inner punch blade is extended to cut the leads of the quad device and so that on the second downward stroke of said punch assembly means said inner punch blade is retracted and said outer punch cuts and attaches the tape;
means (54) for reciprocating and returning said punch assembly means so that said inner punch and said outer punch move together as a mated assembly along a longitudinal axis;
first sensor means (72) for generating a first signal to indicate when said first downward stroke has been completed;
said feeding means being responsive to said first signal to cause said tape to be advanced a predetermined length;
second sensor means (74) for generating a second signal to indicate when said second downward stroke has been completed; and
said holding means being responsive to said second signal to cause the sequential 90 degree rotation of said quad device.
1 Assignment
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Accused Products
Abstract
A lead cut and tape attach apparatus (10) for automatically cutting leads on one side of a semiconductor I.C. quad device and subsequently cutting and attaching a piece of tape over the gaps formed between the cut leads and for sequentially cutting the leads and attaching tape thereover on the remaining sides of the quad device includes a double-acting punch assembly (34) formed of an inner punch blade (58) and an outer punch (56). There is provided upper and lower cams (68, 78) for actuating the inner punch blade relative to the outer punch so that on a first downward stroke the inner punch blade is extended to cut the leads of the quad device. On a second downward stroke of the punch assembly, the inner punch blade is retracted and the outer punch cuts and attaches the tape.
12 Citations
20 Claims
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1. A lead cut and tape attach apparatus for automatically cutting leads on one side of a semiconductor I.C. quad device and subsequently cutting and attaching a piece of tape over the gaps formed between the cut leads and for sequentially cutting the leads and attaching the tape thereover on the remaining sides of the quad device, said apparatus comprising:
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means (32) for holding a semiconductor I.C. quad device having a plurality of leads extending from its four sides and for sequentially rotating the same 90 degrees; double-acting punch assembly means (34) for cutting the leads on one side of the quad device on a first downward stroke and for subsequently cutting and attaching a piece of tape over gaps formed between the cut leads on a second downward stroke; means (30) for feeding a continuous roll of tape between said holding means and said double-acting punching assembly means; said punch assembly means (30) including an inner punch blade (58) for cutting the leads and outer punch (56) for cutting the tape and attaching the same, said inner punch blade being disposed coaxially within said outer punch for slidable movement relative to one another; cam means (68,
78) for actuating said inner punch blade relative to said outer punch so that on the first downward stroke of said punch assembly means said inner punch blade is extended to cut the leads of the quad device and so that on the second downward stroke of said punch assembly means said inner punch blade is retracted and said outer punch cuts and attaches the tape;means (54) for reciprocating and returning said punch assembly means so that said inner punch and said outer punch move together as a mated assembly along a longitudinal axis; first sensor means (72) for generating a first signal to indicate when said first downward stroke has been completed; said feeding means being responsive to said first signal to cause said tape to be advanced a predetermined length; second sensor means (74) for generating a second signal to indicate when said second downward stroke has been completed; and said holding means being responsive to said second signal to cause the sequential 90 degree rotation of said quad device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A lead cut and tape attach apparatus for automatically cutting leads on one side of a semiconductor I.C. quad device and subsequently cutting and attaching a piece of tape over the gaps formed between the cut leads and for sequentially cutting the leads and attaching the tape thereover on the remaining sides of the quad device, said apparatus comprising:
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means (32) for holding a semiconductor I.C. quad device having a plurality of leads extending from its four sides and for sequentially rotating the same 90 degrees; double-acting punch assembly means (34) for cutting the leads on one side of the quad device on a first downward stroke and for subsequently cutting and attaching a piece of tape over gaps formed between the cut leads on a second downward stroke; means (30) for feeding a continuous roll of tape between said holding means and said double-acting punching assembly means; said punch assembly means (30) including an inner punch blade (58) for cutting the leads and outer punch (56) for cutting the tape and attaching the same, said inner punch blade being disposed coaxially within said outer punch for slidable movement relative to one another; cam means (68,
78) for actuating said inner punch blade relative to said outer punch so that on the first downward stroke of said punch assembly means said inner punch blade is extended to cut the leads of the quad device and so that on the second downward stroke of said punch assembly means said inner punch blade is retracted and said outer punch cuts and attaches the tape; andsaid holding means (32) sequentially rotating said quad device 90 degrees after the second downward stroke. - View Dependent Claims (11)
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- 12. A lead cut and tape attach apparatus as claimed in claim further comprising pusher pin means including dowel pins (180, 182) for moving alternately in and out of said cavities in said lower cam so as to cause said inner punch blade to be extended when said dowel pins are out of engagement with said cavities and so as to cause said inner punch blade to be retracted when said dowel pins are in engagement with said cavities.
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19. A lead cut and tape attach apparatus comprising:
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an inner punch blade (58) for cutting leads on one side of a semiconductor I.C. quad device; an outer punch (56) for cutting and attaching a piece of tape over gaps formed between the cut leads; said inner punch blade being disposed coaxially within said outer punch for slidable movement relative to one another; cam means (68,
78) for actuating said inner punch blade relative to said outer punch so that on a first downward stroke said inner punch blade is extended to cut the leads of the quad device and so that on a second downward stroke said inner punch blade is retracted and said outer punch cuts and attaches the tape; andindexing means (32) for sequentially rotating said I.C. quad device 90 degrees after the second downward stroke. - View Dependent Claims (20)
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Specification