Thin film electrical component

• US 5,108,819 A
• Filed: 02/14/1990
• Issued: 04/28/1992
• Est. Priority Date: 02/14/1990
• Status: Expired due to Term

• Current Assignee: Disetronic Licensing Ag
• Original Assignee: Eli Lilly and Company
• Inventors: Lipson, David, Johnson, Kirk W., Heller, James W.
• Primary Examiner(s): Ryan, Patrick J.
• Assistant Examiner(s): Evans, Elizabeth
• Application Number:
  US07/479,897
• Time in Patent Office: 804 Days
• Field of Search: 428/901, 428/209, 428/40, 428/195, 428/426, 428/433, 428/423.5, 428/457, 428/542.8, 428/435, 501/66, 361/397, 361/398
• US Class Current: 428/195.1
• CPC Class Codes: A61B 2018/00107 Coatings on the energy applicator
• CPC Class Codes: A61B 5/076 Permanent implantations telemetry using implanted circuitry A61B5/0031; implanted stimulators for therapy A61N1/3605, A61N1/362, A61N1/372
• CPC Class Codes: A61M 2205/0244 Micromachined materials, e.g. made from silicon wafers, microelectromechanical systems [MEMS] or comprising nanotechnology
• CPC Class Codes: A61M 2205/3303 Using a biosensor
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2221/68345 used as a support during the manufacture of self supporting substrates
• CPC Class Codes: H01L 2221/68359 used as a support during manufacture of interconnect decals or build up layers
• CPC Class Codes: H01L 23/145 Organic substrates, e.g. plastic
• CPC Class Codes: H01L 23/4985 Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H05K 2201/0154 Polyimide
• CPC Class Codes: H05K 2203/016 Temporary inorganic, non-metallic carrier, e.g. for processing or transferring
• CPC Class Codes: H05K 3/007 Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier H05K1/187, H05K3/20 and H05K3/4682 take precedence
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 428/1414 Ceramic, glass, glasslike, vitreous
• CPC Class Codes: Y10T 428/24802 Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
• CPC Class Codes: Y10T 428/24917 including metal layer
• CPC Class Codes: Y10T 428/31562 : Next to polyamide [nylon, etc.]
• CPC Class Codes: Y10T 428/31623 : Next to polyamide or polyimide
• CPC Class Codes: Y10T 428/31678 : Of metal

Abstract

A biocompatible thin film electrical component is configured for use in a human body or other ionic liquid environment. A polyimide substrate is bonded to a glass carrier plate sized for handling by automatic equipment and a multiple-layer metal conductor is deposited on the substrate and patterned to define an electrical circuit or biosensor. The polyimide and the glass establish a bond therebetween that withstands handling yet is know using biocompatible releasing agents and techniques. The polyimide substrate and glass carrier plate preferably have similar thermal expansion properties to reduce the likelihood of fracture and delamination problems during release of the substrate from the carrier plate. An insulation layer covers the metal conductor and, in one embodiment, is made of polyimide having a cure temperature lower than the temperature at which interediffusion occurrs in the metal layers in the conductor.

Claims

1. A thin film electrical component comprising

a rigid glass carrier plate,

a substrate bonded to the rigid glass carrier plate, the substrate comprising a polymer establishing a bond with the rigid glass carrier plate that is broken upon immersion of the substrate and the rigid glass carrier plate in one of a hot water bath and a warm temperature physiologic saline bath to release the polymer from attachment to the rigid glass carrier plate, and

means for providing an electrical circuit, the providing means being bonded to the substrate and undisrupted during release of the substrate from attachment to the rigid glass carrier plate.

2. The component of claim 1, wherein the rigid glass carrier plate comprises a low-expansion glass having a characteristic coefficient of thermal expansion and the polymer comprises a polyimide having a coefficient of thermal expansion that is substantially equivalent to the coefficient of thermal expansion of the low-expansion glass so that the rigid glass carrier plate and the substrate carrying the means for providing an electrical circuit will expand at about the same rate during exposure to an elevated thermal-expansion temperature sufficient to break the bond between the substrate and the rigid glass carrier plate, thereby avoiding separation of the means for providing an electrical circuit from the substrate during release of the substrate from attachment to the rigid glass carrier plate.

3. The component of claim 2, wherein the polyimide is one of a PMDA-ODA type polyimide and a BPDA-PPD type polyimide, and the low-expansion glass consists essentially of 60% SiO₂, 18% RO, 15% Al₂ O₃, 5% B₂ O₃, 1% Na₂ O, and 1% K₂ O.

4. The component of claim 1, wherein the means for providing an electrical circuit comprises an adhesive metal layer bonded to the substrate and a noble metal layer bonded to the adhesive metal layer, and further comprising insulating means on the substrate for providing an insulating cover on the means for providing an electrical circuit, the insulating means comprising a polyamic acid precursor solution cured at a heat-cure temperature to provide a polyimide coating, the polyamic acid precursor solution having a heat-cure temperature that is less than a characteristic minimum temperature at which interdiffusion of the noble metal layer and the adhesive metal layer occurs so that substantial interdiffusion of the noble metal layer and the adhesive metal layer is avoided during heat curing of the polyamic acid precursor solution.

5. The component of claim 4, wherein the adhesive metal layer is a material selected from the group consisting essentially of titanium and chromium, the noble metal layer is a material selected from the group consisting essentially of gold, platinum, and palladium, and the polyimide coating resulting from heat curing the polyamic acid precursor solution is one of a PMDA-ODA type polyimide and a BTDA-ODA type polyimide.

6. The component of claim 4, wherein the means for providing an electrical circuit further comprises another adhesive metal layer bonded to the noble metal layer to lie between the noble metal layer and the insulating means.

7. The component of claim 6, wherein said another adhesive metal layer is formed to include at least one access opening therein to expose a portion of the underlying noble metal layer to provide a lead-attachment side on the noble metal layer.

8. The component of claim 7, wherein the polyimide coating extends into the access opening formed in said another adhesive metal layer to contact the noble metal layer.

9. A thin film electrical component comprising

a polymer substrate,

a first adhesive metal layer bonded to the polymer substrate,

a noble metal layer bonded to the first adhesive metal layer,

a second adhesive metal layer bonded to the noble metal layer, the noble metal layer being sandwiched between the first and second adhesive metal layers, and

a polymer insulator bonded at least to the first and second adhesive metal layers to cover all exposed surfaces of the first and second adhesive metal layers unbonded to one of the polymer substrate and the noble metal layer.

10. The component of claim 9, wherein the second adhesive metal layer is formed to include at least one access opening therein to expose a portion of the underlying noble metal layer to provide a lead-attachment site on the noble metal layer

11. The component of claim 10, wherein the polymer insulator includes a wall extending through each access opening formed in the second adhesive metal layer to contact the noble metal layer.

12. The component of claim 9, wherein the polymer insulator comprises a polyamic acid precursor solution cured at a heat-cure temperature to provide a polyimide coating, the polyamic acid precursor solution having a heat-cure temperature that is less than a characteristic minimum temperature at which interdiffusion of the noble metal layer and the first and second adhesive metal layers occurs so that substantial interdiffusion of the noble metal layer and the first and second adhesive metal layers is avoided during heat curing of the polyamic acid precursor solution.

13. The component of claim 12, wherein each of the first and second adhesive metal layers is a material selected from the group consisting essentially of titanium and chromium, the noble metal layer is a material selected from the group consisting essentially of gold, platinum, and palladium, and the polyimide coating resulting from heat curing the polyamic acid precursor solution is one of a PMDA-ODA type polyimide and a BTDA-ODA type polyimide.

14. The component of claim 12, wherein the polyamic acid precursor solution is applied directly to at least said exposed surfaces of the first and second adhesive metal layers to create the polymer insulator without providing a separate diffusion barrier layer of material between the polymer insulator and said exposed surfaces.

15. The component of claim 9, further comprising a rigid glass carrier plate, the polymer substrate being bonded to the rigid glass carrier plate to facilitate handling of the polymer substrate by automatic equipment.

16. The component of claim 15, wherein the polymer substrate comprises a PMDA-ODA type polyimide establishing a bond with the rigid glass carrier plate that is broken upon immersion of the polymer substrate and rigid glass carrier plate in one of a hot water bath and a warm temperature physiologic saline bath to release the polymer substrate from attachment to the rigid glass carrier plate without damaging any of the metal layers, the polymer insulator, and the bonds therebetween.

17. The component of claim 15, wherein the rigid glass carrier plate comprises a low-expansion glass having a characteristic coefficient of thermal expansion and the polymer substrate comprises a polyimide having a coefficient of thermal expansion that is substantially equivalent to the coefficient of thermal expansion of the low-expansion glass so that the rigid glass carrier plate and the polymer substrate attached thereto will expand at about the same rate during exposure of said plate and substrate to elevated thermal-expansion temperature sufficient to break the bond between said plate and substrate, thereby avoiding fracture of the metal layers on said polymer substrate during release of the polymer substrate from attachment to the rigid glass carrier plate.

18. The component of claim 17, wherein the polyimide is one of a PMDA-ODA type polyimide and a BPDA-PPD type polyimide, and the low-expansion glass consisting essentially of 60% SiO₂, 18% RO, 15% Al₂ O₃, 5% B₂ O₃, 1% Na₂ O, and 1% K₂ O.

19. An apparatus for preparing a thin film electrical component comprising

a rigid glass carrier plate, and

a substrate bonded to the rigid glass carrier plate, the substrate comprising a polymer establishing a bond with the rigid glass carrier plate that is broken upon immersion of the substrate and the rigid glass carrier plate in one of a hot water bath and a warm temperature physiologic saline bath to release the polymer from attachment to the rigid glass carrier plate.