Resonant tag and method of manufacturing the same

• US 5,108,822 A
• Filed: 12/27/1990
• Issued: 04/28/1992
• Est. Priority Date: 08/06/1990
• Status: Expired due to Fees

• Current Assignee: Checkpoint Manufacturing Japan Co., Ltd. (CCL Industries Incorporated)
• Original Assignee: Tokyo Electron Limited
• Inventors: Suzuki, Yuji, Matsumoto, Takeshi, Imaichi, Hideaki, Haneda, Tadayoshi, Himura, Koichi
• Primary Examiner(s): Ryan, Patrick J.
• Application Number:
  US07/634,529
• Time in Patent Office: 488 Days
• Field of Search: 343/895, 29/848, 29/592.1, 340/572, 428/209, 428/457, 428/461, 428/515, 428/901
• US Class Current: 428/209
• CPC Class Codes: B32B 2519/02 RFID tags
• CPC Class Codes: G01S 13/753 using frequency selective elements, e.g. resonator
• CPC Class Codes: G08B 13/2414 using inductive tags
• CPC Class Codes: G08B 13/242 Tag deactivation
• CPC Class Codes: G08B 13/2437 Tag layered structure, processes for making layered tags
• CPC Class Codes: G08B 13/244 Tag manufacturing, e.g. continuous manufacturing processes
• CPC Class Codes: G08B 13/2442 Tag materials and material properties thereof, e.g. magnetic material details
• CPC Class Codes: H03H 3/00 Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
• CPC Class Codes: H03H 5/003 comprising distributed impedance elements together with lumped impedance elements
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2201/0191 wherein the thickness of the dielectric plays an important role
• CPC Class Codes: H05K 2201/09036 Recesses or grooves in insulating substrate recess in metallic substrate H05K2201/09745
• CPC Class Codes: H05K 2201/09672 Superposed layout, i.e. in different planes parallel traces in one plane H05K2201/09236
• CPC Class Codes: H05K 2203/0108 Male die used for patterning, punching or transferring
• CPC Class Codes: H05K 3/0014 Shaping of the substrate, e.g. by moulding
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49636 Process for making bearing or component thereof
• CPC Class Codes: Y10T 428/24917 : including metal layer
• CPC Class Codes: Y10T 428/31678 : Of metal
• CPC Class Codes: Y10T 428/31692 : Next to addition polymer from unsaturated monomers
• CPC Class Codes: Y10T 428/31909 : Next to second addition polymer from unsaturated monomers

Abstract

A resonant tag is manufactured in the manner described below: a conductive thin film is formed to a predetermined thickness on two surfaces of an insulating thin film. Thereafter, a conductive pattern, composed of an inductor element and a capacitor element corresponding to a resonant frequency of a resonant circuit, is printed on a surface of one of the conductive thin films, and a conductive pattern, composed of a capacitor element corresponding to the resonant frequency of the resonant circuit, is printed on a surface of the other insulating thin film at a position which faces the capacitor element formed on one of the conductive thin films using an ink which resists etching. A non-printed portion of the conductive thin films is removed by etching to form a resonant circuit pattern. Thereafter, a portion of the insulating thin film, which corresonds to the capacitor element pattern, is thinned to a desired thickness by pressing a heating/pressing member heated to a predetermined temperature against that portion under a predetermined pressure for a predetermined period of time.

Claims

1. A resonant tag comprising:

a single insulating thin film;

a conductive capacitor element pattern and a conductive inductor element pattern formed on one surface of said insulating thin film, said conductive capacitor element pattern corresponding to a resonant frequency and said conductive inductor element pattern being located circumferentially around the conductive capacitor element pattern; and

a conductive capacitor element pattern formed on the other surface of said insulating thin film at a position which faces said conductive capacitor element pattern formed on said one surface, said conductive capacitor element pattern corresponding to said resonant frequency,

wherein at least a portion of said insulating thin film on which said two conductive capacitor element patterns are formed is reduced in thickness to space said capacitor elements to enable deactivation of the tag by placement in an electromagnetic field and also to space said capacitor elements to produce said resonant frequency, and wherein said conductive capacitor and inducator patterns form LC resonant circuit having an inherent resonant frequency.

2. A resonant tag according to claim 1, wherein said resonant circuit is formed by electrically connecting, via a throughole in said film, said conductive patterns formed on the two surfaces of said insulating thin film.

6. A resonant tag according to claim 1, wherein the portion on which said two conductive capacitor element patterns are formed is reduced in thickness to less than 15 microns.

3. A method of manufacturing a resonant tag comprising the steps of:

forming a conductive thin film on two surfaces of an insulating thin film;

printing, on a surface of one of said conductive thin films, a first conductive pattern composed of an inductor element and a capacitor element corresponding to a resonant frequency of a resonant circuit using an ink which resists etching, as well as a second conductive pattern composed of a capacitor element corresponding to said resonant frequency of said resonant circuit on a surface of the other insulating thin film at a position which faces said capacitor element formed on said one conductive thin film using said ink which resists etching;

removing non-printed portion of said conductive thin films by etching;

thinning at least a portion of said insulating thin film corresponding to said capacitor element pattern in a resonant circuit pattern formed by said etching process to a desired thickness; and

forming a LC resonant circuit in said desired resonant circuit pattern by electrically connecting, via a throughole, in said film said first conductive and second conductive patterns.

4. A method of manufacturing a resonant tag according to claim 3, further comprising a step of detachably adhering the insulating thin film on which said conductive patterns subjected to the etching process or the circuit formation process are formed to a flexible thin film.

5. A method of manufacturing a resonant tag according to either of claims 3 and 4, wherein said thinning step is conducted by pressing a heat-pressing member heated to a temperature against said portion to be thinned under pressure for a period of time.