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Soldering tip for magnetic wire hookup

  • US 5,109,147 A
  • Filed: 05/09/1990
  • Issued: 04/28/1992
  • Est. Priority Date: 05/09/1990
  • Status: Expired due to Fees
First Claim
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1. A device for use with a reflow power supply for soldering a conductive lead to a solder pad, comprising:

  • a soldering tip;

    a passage extending through said soldering tip, said passage allowing expanding gases to escape to prevent pressure build up resulting in solder squeeze-out;

    a stepped surface at a base extremity of said soldering tip, said stepped surface having at least one opening and at least one projecting leg; and

    a counter bore room at said base extremity of said soldering tip, said counter bore room providing space for excess solder, said counter bore room allowing said soldering tip to accommodate a wide variation in the amount of solder applied to said solder pad, said counter bore room being in direct connection with said passage.

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