Soldering tip for magnetic wire hookup

• US 5,109,147 A
• Filed: 05/09/1990
• Issued: 04/28/1992
• Est. Priority Date: 05/09/1990
• Status: Expired due to Fees

• Current Assignee: Applied Magnetics Corporation (Innovative Micro Technology Incorporated)
• Original Assignee: Applied Magnetics Corporation (Innovative Micro Technology Incorporated)
• Inventors: Erlach, David M.
• Primary Examiner(s): Evans, Geoffrey S.
• Application Number:
  US07/521,239
• Time in Patent Office: 720 Days
• Field of Search: 228/51-54, 228/179, 228/180.2, 228/44.7, 228/55, 228/19-21, 228/4.5, 219/85.16, 219/85.22, 219/85.18, 219/228-233, 219/56.1, 219/56.21, 219/56.22, 219/91.21, 219/137.41, 219/85.15
• US Class Current: 219/85.16
• CPC Class Codes: B23K 3/025 Bits or tips
• CPC Class Codes: B23K 3/0471 using resistance rod or bar, e.g. carbon silica
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45169 Platinum (Pt) as principal constituent
• CPC Class Codes: H01L 2224/48 of an individual wire connector
• CPC Class Codes: H01L 2224/78302 Shape
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 24/78 Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01039 Yttrium [Y]
• CPC Class Codes: H01L 2924/01043 Technetium [Tc]
• CPC Class Codes: H01L 2924/01074 Tungsten [W]
• CPC Class Codes: H01L 2924/01075 Rhenium [Re]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

A small solder tip, which advantageously allows for the rapid production of reliable solder joints without the addition of extra solder, flux or striping the insulation on the wire. The solder tip is preferably formed of tungsten carbide and is used in conjunction with a reflow power supply. In a specific application, the solder tip is utilized for hook-up of magnetic head wires to solder pads. The solder tip comprises a center shaft which allows expanding gases to escape in order to prevent solder from being squeezed out by the pressure build up. The base extremity of the solder tip which contacts the wire is structured with a stepped surface having an opening for accepting the wire therethrough and a projecting leg for contacting the wire and immersing the wire in molten solder. The solder tip additionally comprises a room which provides space for excess solder, enabling the solder tip to accommodate larger variation in solder volume on the pads.

Claims

1. A device for use with a reflow power supply for soldering a conductive lead to a solder pad, comprising:

a soldering tip;

a passage extending through said soldering tip, said passage allowing expanding gases to escape to prevent pressure build up resulting in solder squeeze-out;

a stepped surface at a base extremity of said soldering tip, said stepped surface having at least one opening and at least one projecting leg; and

a counter bore room at said base extremity of said soldering tip, said counter bore room providing space for excess solder, said counter bore room allowing said soldering tip to accommodate a wide variation in the amount of solder applied to said solder pad, said counter bore room being in direct connection with said passage.

2. A device for use with a reflow power supply for soldering a conductive lead to a solder pad as defined in claim 1, wherein a portion of said stepped surface which forms said at least one opening positions a conductive lead and said projecting leg contacts said conductive lead and immerses said conductive lead in molten solder, wherein said at least one opening and said projecting leg are on opposing sides of said base extremity of said soldering tip.

3. A device for use with a reflow power supply for soldering a conductive lead to a solder pad, as defined in claim 1, wherein said counter bore room comprises a cylindrical section having a first diameter length.

4. A device for use with a reflow power supply for soldering a conductive lead to a solder pad, comprising:

a soldering tip;

a passage extending through said soldering tip, said passage allowing expanding gases to escape to prevent pressure build up resulting in solder squeeze-out;

a stepped surface at a base extremity of said soldering tip, said stepped surface having two projecting legs forming two openings therebetween, a first opening for accepting a conductive lead and a second opening for allowing said conductive lead to exit; and

a counter bore room at said base extremity of said soldering tip, said counter bore room providing space for excess solder, said counter bore room allowing said soldering tip to accommodate a wide variation in the amount of solder applied to said solder pad.

5. A device for use with a reflow power supply for soldering a conductive lead to a solder pad, comprising:

a soldering tip;

a passage extending through said soldering tip, said passage allowing expanding gases to escape to prevent pressure build up resulting in solder squeeze-out;

a stepped surface at a base extremity of said soldering tip, said stepped surface having at least one opening and at least one projecting leg; and

a counter bore room at said base extremity of said soldering tip, said counter bore room providing space for excess solder, said counter bore room allowing said soldering tip to accommodate a wide variation in the amount of solder applied to said solder pad, wherein said counter bore room comprises a cylindrical section having a first diameter length and wherein said shaft has a second diameter less than said first diameter length of said cylindrical section.

6. A soldering tip for use with a reflow power supply for forming a reliable solder joint when soldering a conductive lead to a solder pad, comprising:

a body portion having a semi-cylindrical surface adjoining a flat surface, said semi-cylindrical surface gradually tapering and terminating at one end in an opening, said body portion further comprising;

a passage extending through said body portion, said passage allowing expanding gases to escape to prevent pressure build up resulting in solder squeeze-out;

a stepped surface at a base extremity of said soldering tip, said stepped surface having at least one opening and at least one projecting leg, a portion of said stepped surface which forms said opening positioning a conductive lead and said projecting leg contacting said conductive lead and immersing it into molten solder on the solder pad; and

a counter bore room at said base extremity of said soldering tip, said counter bore room providing space for excess solder, said counter bore room allowing said soldering tip to accommodate a wide variation in the amount of solder applied to said solder pad, said counter bore room being in direct connection with said passage.

7. A method for forming a reliable solder joint when soldering a fine conductive lead to a solder pad having a solder deposit, comprising the steps of:

providing a solder tip having a shaft, a base extremity configured with a stepped surface having at least one opening and at least one projecting leg and a counter bore room for excess solder;

contacting one end of the fine conductive lead with a surface forming said opening and immersing an other end of said wire into molten solder on the solder pad with said projecting leg;

burning the insulation on the conductive lead by heating said solder tip to a predetermined temperature;

accommodating a wide variation in the amount of solder applied by receiving excess solder in said counter bore room; and

allowing expanding gases to escape through said vent and preventing solder from being squeezed out by build up of pressure.

8. A method for forming a reliable solder joint, as defined in claim 7, further comprising the step of:

allowing the solder joint to solidify at a low temperature prior to retracting said solder tip.