Superconducting bonds for thin film devices
First Claim
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1. A method of bonding a superconductive electrical lead to a superconductive thin film pad on a substrate, said method comprising the steps of:
- forming a thin film bonding pad of superconductive material on the substrate, the pad having a contact surface;
forming a thin ribbon of similar superconductive material, the ribbon having a facing surface;
coating at least one of the pad contact surface and the ribbon facing surface with a very thin layer of a different material which readily coheres to the superconductive surface material;
placing the different-material coated surface in contact with the c her superconductive material surface; and
thenbonding the thin ribbon to the bonding pad.
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Abstract
A method of bonding a superconductive ribbon lead to a superconducting bonding pad connected to superconducting circuitry. The thin ribbon is first coated with a fresh layer of the same material from which it is made and then a very thin layer of a noble metal is applied over that fresh layer. The bonding pad is also prepared with a very thin layer of the noble metal. Those coated surfaces are placed in facing contact and ultrasonically bonded.
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Citations
26 Claims
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1. A method of bonding a superconductive electrical lead to a superconductive thin film pad on a substrate, said method comprising the steps of:
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forming a thin film bonding pad of superconductive material on the substrate, the pad having a contact surface; forming a thin ribbon of similar superconductive material, the ribbon having a facing surface; coating at least one of the pad contact surface and the ribbon facing surface with a very thin layer of a different material which readily coheres to the superconductive surface material; placing the different-material coated surface in contact with the c her superconductive material surface; and
thenbonding the thin ribbon to the bonding pad. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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2. A method of bonding a superconductive electrical lead to a superconductive thin film pad on an electrically insulating substrate, said method comprising the steps of:
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forming a thin film bonding pad of niobium on the substrate, the pad having a contact surface; forming a thin ribbon of niobium, the ribbon having a facing surface; coating at least one of the niobium pad contact surface and ribbon facing surface with a very thin layer of palladium; placing the palladium coated surface and the niobium surface of the other element in contact; and
thenultrasonically bonding the thin ribbon to the bonding pad. - View Dependent Claims (3, 4, 5, 6, 7, 8, 9, 10)
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Specification