Photovoltaic device with decreased gridline shading and method for its manufacture

• US 5,110,370 A
• Filed: 09/20/1990
• Issued: 05/05/1992
• Est. Priority Date: 09/20/1990
• Status: Expired due to Term

• Current Assignee: United Solar Systems Corp.
• Original Assignee: United Solar Systems Corp.
• Inventors: Nath, Prem, Vogeli, Craig
• Primary Examiner(s): WEISSTUCH, AARON
• Application Number:
  US07/585,661
• Time in Patent Office: 593 Days
• Field of Search: 437/2-5, 136/256, 136/258 AM, 136/244
• US Class Current: 136/256
• CPC Class Codes: H01L 31/048 Encapsulation of modules
• CPC Class Codes: H01L 31/0543 comprising light concentrating means of the refractive type, e.g. lenses
• CPC Class Codes: H01L 31/0547 comprising light concentrating means of the reflecting type, e.g. parabolic mirrors, concentrators using total internal reflection
• CPC Class Codes: Y02E 10/52 PV systems with concentrators

Abstract

A photovoltaic cell includes a light-directing optical element integrally formed in an encapsulant layer thereof in the region of opaque current-collecting gridlines.The optical element redirects light which would be absorbed by the opaque structure to other regions of the photovoltaic device, thereby decreasing shading effects.

Claims

1. A method of manufacturing a photovoltaic device having decreased shading of incident illumination from collector grid lines, said method comprising the steps of:

providing a photovoltaic cell, said cell including a bottom electrode layer, a photovoltaic body disposed atop the bottom electrode layer, a top electrode layer disposed atop the photovoltaic body and an electrically-conductive, current-collecting grid line in electrical communication with said top electrode layer;

disposing a layer of embossable, transparent, organic, polymeric, encapsulating material directly atop the top electrode layer;

providing an embossing die, said die including at least one groove forming element;

aligning the embossing die with the photovoltaic cell so that the groove forming element thereof is in registry with at least a portion of the length of the grid line and in contact with the layer of polymeric encapsulating material; and

compressing the embossing die and photovoltaic cell so as to emboss a groove into the layer of encapsulating material; and

removing the embossing die, whereby there is provided a photovoltaic cell having a groove integral with the encapsulant layer, said groove operable to direct incident illumination away from the grid line so as to decrease the shading effects thereof.

2. A method as in claim 1, wherein the step of disposing a layer of encapsulating material atop the top electrode layer includes the further step of laminating said layer to the top electrode layer and wherein the steps of aligning and compressing are carried out after said laminating step.

3. A method as in claim 1, wherein the step of disposing said layer of organic polymeric material includes a further step of selecting said material from the group consisting of ethylene vinyl acetate, polytetrafluoroethylene, polyvinyl fluoride, polyvinyl acetate, polystyrene, polyurethane, and combinations thereof.

4. A method as in claim 1, wherein said polymeric material is a thermally cross-linkable material.

5. A method as in claim 1, including the further step of heating said embossing die.

6. A method as in claim 5, wherein the step of heating said die comprises heating to a temperature of approximately 150°

C.

7. A method as in claim 1, wherein the step of compressing said photovoltaic cell and die comprises compressing said cell and die at a pressure of approximately one atmosphere psi.

8. A method as in claim 1, wherein the step of compressing said photovoltaic cell and die further comprises maintaining said cell and die under compression for approximately 30 minutes.

9. A method as in claim 1, wherein the step of providing a photovoltaic cell comprises providing a photovoltaic cell having a photovoltaic body including at least one layer of a fluorinated, silicon alloy material.

10. A method of manufacturing a large area photovoltaic module, said method comprising the steps of:

providing a plurality of photovoltaic cells, each cell including a bottom electrode member, a photovoltaic body disposed in electrical communication with the bottom electrode, a top electrode disposed atop the photovoltaic body, and at least one electrically-conductive grid line associated in electrical communication with the top electrode;

disposing said plurality of cells on a support member in an electrically interconnected relationship;

disposing a layer of transparent, organic, polymeric, encapsulant material directly atop the top electrode and said at least one gridline of each of the photovoltaic cells;

laminating said encapsulant material onto said cells so as to provide a self-supporting assembly;

providing a plurality of embossing dies, each die including at least one groove-forming element;

aligning each of said plurality of dies with a corresponding one of said photovoltaic cells so that the groove-forming element thereof is in registry with at least a portion of the length of one of said at least one gridline; and

compressing said dies and laminated assembly of photovoltaic cells whereby said dies form grooves in the transparent encapsulating layer in the region of the gridlines so as to provide a light-directing optical element integral with said layer of encapsulant material and operable to decrease gridline shading.

11. A method as in claim 10, wherein the step of aligning each of said dies with a corresponding one of said cells comprises:

providing alignment pins on each of said plurality of dies;

providing corresponding alignment pin holes in said support member; and

placing said alignment pins in the said alignment pin holes.

12. A method as in claim 10, wherein the step of disposing said cells on said support member in an electrically interconnected relationship comprises the step of interconnecting said cells in a series electrical relationship.

13. A method as in claim 10, wherein the step of disposing said cells on said support member in an electrically interconnected relationship includes the further step of interconnecting said cells in a series electrical relationship.

14. A method as in claim 10, wherein the step of providing a layer of transparent, encapsulant material comprises selecting said material from the group consisting of:

ethylene vinyl acetate, poly tetrafluoroethylene, polyvinyl fluoride, polyurethane and combinations thereof.

15. A method as in claim 10, including the further step of heating said plurality of dies.

16. A photovoltaic cell having decreased shading, said cell comprising:

a layer of bottom electrode material;

a photovoltaic body disposed upon said layer of bottom electrode material;

a layer of top electrode material disposed upon said photovoltaic body in a spaced apart relationship with said layer of bottom electrode material so that the photovoltaic body is sandwiched therebetween;

at least one electrically-conductive, current-collecting grid line associated in electrical communication with said top electrode; and

a layer of transparent, electrically insulating synthetic organic polymeric material disposed directly upon said top electrode material and said at least one grid line so as to cover the top electrode and the at least one gridline, said encapsulating layer having a groove formed integrally therein generally coextensive with the length of said current-collecting gridline, said groove operative to diffract incident light away from the underlying grid line so that said light illuminates adjacent portions of said photovoltaic cell, whereby shading effects caused by said grid line are minimized.

17. A photovoltaic cell as in claim 16, wherein said photovoltaic body is comprised of at least one triad of superposed layers of N-type, I-type and P-type silicon alloy material.

18. A photovoltaic device as in claim 17, wherein said layer of I-type silicon alloy material is a layer of amorphous alloy material and at least one of said P-type and N-type layers of silicon alloy material is a layer of microcrystalline alloy material.