Thick film and thin film composite substrate and electronic circuit apparatus using it

• US 5,110,664 A
• Filed: 07/10/1990
• Issued: 05/05/1992
• Est. Priority Date: 07/10/1989
• Status: Expired due to Term

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Yamada, Minoru, Yamamoto, Masakazu, Nakanishi, Keiichirou
• Primary Examiner(s): Robinson, Ellis P.
• Assistant Examiner(s): Ahmad, Nasser
• Application Number:
  US07/550,553
• Time in Patent Office: 665 Days
• Field of Search: 428/901, 428/209, 428/137, 428/433, 428/473.5, 428/195, 361/397, 361/414, 29/830, 174/250, 174/255, 174/256, 174/258
• US Class Current: 428/195.1
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/5383 Multilayer substrates H01L23/5385 takes precedence; multilayer metallisation on monolayer substrates H01L23/538
• CPC Class Codes: H01L 23/5384 Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors H01L23/5383, H01L23/5385 take precedence; pins attached to insulating substrates H01L23/49811
• CPC Class Codes: H01L 2924/15192 Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/15312 being a pin array, e.g. PGA
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H05K 1/0268 for electrical inspection or testing
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/092 Dispersed materials, e.g. conductive pastes or inks
• CPC Class Codes: H05K 1/167 incorporating printed resistors
• CPC Class Codes: H05K 2201/0154 Polyimide
• CPC Class Codes: H05K 2201/10318 Surface mounted metallic pins
• CPC Class Codes: H05K 2203/1581 Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
• CPC Class Codes: H05K 3/4061 for via connections in inorganic insulating substrates
• CPC Class Codes: H05K 3/4605 made from inorganic insulating material
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 428/24322 Composite web or sheet
• CPC Class Codes: Y10T 428/24802 Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
• CPC Class Codes: Y10T 428/24917 including metal layer
• CPC Class Codes: Y10T 428/31721 Of polyimide

Abstract

A thick film and thin film composite wiring substrate for mounting integrated circuit chips thereon, comprising a thin film substrate including a signal wiring layer therein, a thick film substrate laminated together with the thin film substrate, and at least a part of signal wiring being formed as a signal wiring layer included in the thick film substrate.

Claims

1. A thick film and thin film composite wiring substrate for mounting integrated circuit chips thereon, comprising:

a thin film substrate including a first signal wiring layer therein, said first signal wiring layer including a signal wiring for electrically interconnecting signal terminals of said integrated circuit chips; and

a thick film substrate laminated together with said thin film substrate and including a second signal wiring layer therein, said second signal wiring layer including a signal wiring for electrically interconnecting signal terminals of said integrated circuit chips.

2. A thick film and thin film composite substrate according to claim 1, wherein through-holes included in said thick film substrate and connected to the signal wiring included in said second signal wiring layer are electrically connected to through-holes included in said thin film substrate.

3. A thick film and thin film composite wiring substrate according to claim 1, wherein said thin film wiring substrate comprises an organic insulation material as the insulation material thereof.

4. A thick film and thin film composite wiring substrate according to claim 1, wherein said thick film wiring substrate comprises ceramic as insulation material thereof.

5. A thick film and thin film composite wiring substrate according to claim 1, wherein the second signal wiring layer comprises a signal wiring for supplying a clock signal to said integrated circuit chips. signal wiring for supplying clock.

6. A thick film and thin film composite wiring substrate according to claim 1, wherein the signal wiring layer included in said thick film substrate comprises signal wiring for test and maintenance of integrated circuit chips mounted on said thick film and thin film composite substrate.

7. A thick film and thin film composite wiring substrate according to claim 1, further comprising a wiring layer exclusively used for connecting through-holes included in said thin film wiring substrate with through-holes included in said thick film substrate, said wiring layer for exclusive use being disposed between said thin film wiring substrate and said thick film wiring substrate.

8. A thick film and thin film composite wiring substrate according to claim 7, wherein said wiring layer for exclusive use comprises a signal wiring layer included in said thin film substrate.

9. A thick film and thin film composite wiring substrate according to claim 8, wherein said wiring layer for exclusive use has a characteristic impedance which differs from a characteristic impedance of signal wiring included in other signal wiring layers of said thin film substrate.

10. A thick film and thin film composite wiring substrate according to claim 1, wherein the number of through-holes included in said thin film substrate is larger than the number of through-holes included in said thick film substrate.

11. A thick film and thin film composite wiring substrate according to claim 1, wherein signal wiring disposed in the signal wiring layers included in said thin film substrate comprises signal wiring carrying such signals that propagation time within the signal wiring layers affects the response speed of a logic circuit comprising integrated circuit chips mounted on said thick film and thin film composite substrate.

12. A thick film and thin film composite wiring substrate according to claim 7, wherein a signal path extending from an integrated circuit chip to a through-hole included in said thick film substrate comprises:

a signal spread layer for leading the signal from said integrated circuit chip to a test pad located around said integrated circuit chip on the surface of said thin film substrate;

a through-hole located right under said test pad and connected to said test pad; and

said wiring layer for exclusive use connecting said through-hole and a through-hole included in said thick film substrate, and

wherein at least a part of through-holes included in said thick film wiring layer is located right under said integrated circuit chip.

13. A thick film and thin film composite wiring substrate according to claim 7, wherein said wiring layer for exclusive use comprises wiring for connecting signals between said thin film substrate and said thick film substrate and wiring for power supply connection in an identical wiring layer.

14. A thick film and thin film composite wiring substrate according to claim 13, wherein wiring width of the wiring for power supply connection is wider than that of the wiring for transmitting signals therethrough.

15. A thick film and thin film composite wiring substrate according to claim 2, wherein through-holes included in said thin film wiring substrate are directly connected to through-holes included in said thick film wiring substrate.

16. A thick film and thin film composite wiring substrate according to claim 15, wherein said through-holes of said thin film substrate and said thick film substrate are arranged in lattice form, and lattice pitch of the through-holes of said thick film substrate is equivalent to an integer times that of the through-holes of said thin film substrate.

17. A thick film and thin film composite wiring substrate according to claim 1, wherein each signal wiring included in said thin film substrate is so dimensioned with respect to a cross section thereof that the DC resistance value of signal wiring within said thin film substrate having the greatest length may not exceed one tenth of the characteristic impedance value thereof.

18. A thick film and thin film composite wiring substrate according to claim 1, wherein each signal wiring layer included in said thin film substrate comprises two layers, i.e., a normal signal wiring layer and a test signal wiring layer.

19. A thick film and thin film composite wiring substrate according to claim 1, wherein the characteristic impedance of the signal wiring included in said second signal wiring layer is set at the same value as that of characteristic impedance of the signal wiring included in said first signal wiring layer.

20. A thick film and thin film composite wiring substrate according to claim 1, further comprising:

a test pad formed on the surface of said thin film substrate;

a wiring layer for connecting said test pad to an integrated circuit chip mounted on the surface of said thin film substrate;

a resistor element disposed right under said test pad; and

a partially-through-hole for connecting said resistor element to said test pad.

21. A thick film and thin film composite wiring substrate according to claim 1, further comprising:

a test pad formed on the surface of said thin film substrate;

a signal spread wiring layer including a wiring for connecting said test pad to an integrated circuit chip mounted on the surface of said thin film substrate;

a resistor element disposed in an area between said test pad and said integrated circuit chip, and under said signal spread wiring layer; and

a wiring layer including a wiring for connecting said resistor element to said test pad.

22. A thick film and thin film composite wiring substrate according to claim 1, wherein a plurality of through-holes included in said thick film substrate are connected to a pad included in pads so disposed on the surface of said thick film substrate as to fix input and output pins and connected to an input pin for power supply, and one through-hole included in said thick film substrate is connected to a pad included in the pads so disposed on the surface of said thick film substrate as to fix input and output pins and connected to an input/output pin for signal supply.

23. A thick film and thin film composite wiring substrate for mounting integrated circuit chips thereon, comprising:

a thick film substrate including a signal wiring layer therein; and

a thin film substrate including a signal wiring layer therein, said thin film substrate being formed above said thick film substrate,

wherein the signal wiring layer included in said thin film substrate is cross sectionally dimensioned so that a resulting DC resistance of the longest signal wiring thereof and included in said thin film substrate is equivalent to one tenth or less of characteristic impedance value of said signal wiring.

24. A thick film and thin film composite wiring substrate for mounting integrated circuit chips thereon, comprising:

a thick film substrate including a signal wiring layer therein;

a thin film substrate including a signal wiring layer therein, said thin film substrate being formed above said thick film substrate; and

the signal wiring layer included in said thin film substrate comprising a signal wiring layer for testing.

25. A thick film and thin film composite wiring substrate for mounting integrated circuit chips thereon, comprising:

a thick film substrate including a signal wiring layer therein;

a thin film substrate including a signal wiring layer therein, said thin film substrate being formed above said thick film substrate; and

through-holes included in said thin film substrate being arranged in a lattice form with a pitch equivalent to the lattice pitch of said thin film substrate.

26. A thick film and thin film composite wiring substrate for mounting integrated circuit chips thereon, wherein the characteristic impedance of a signal wiring in a thin film is made substantially equal to that of a signal wiring in a thick film.

27. A thick film and thin film composite wiring substrate for mounting integrated circuit chips thereon, comprising:

a thick film substrate including a signal wiring layer therein;

a thin film substrate including a signal wiring layer therein, said thin film substrate being formed above said thick film substrate; and

a resistor element for terminating said integrated circuit chip, said resistor element being disposed under a test pad on the surface of said thin film substrate, said resistor element being connectable to said test pad via a partially-through-hole.

28. A thick film and thin film composite wiring substrate according to claim 27, wherein a power supply layer for feeding power to said resistor element is not present right under a boundary portion between said integrated circuit chip and said test pad.

29. A thick film and thin film composite wiring substrate for mounting integrated circuit chips thereon, comprising:

a thick film substrate including a signal wiring layer therein;

a thin film substrate including a signal wiring layer therein, said thin film substrate being formed above said thick film substrate;

a resistor element for terminating said integrated circuit chip, said resistor element being disposed in an area between a test pad and an integrated circuit chip on the surface of said thin film substrate; and

a wiring layer used exclusively for forming wiring connecting said resistor element to said test pad.

30. A thick film and thin film composite wiring substrate for mounting integrated circuit chips thereon, comprising:

a thick film substrate including a signal wiring layer therein;

a thin film substrate including a signal wiring layer therein, said thin film substrate being formed above said thick film substrate;

a pad disposed on the back of said thick film substrate for connection with a power supply pin;

a plurality of through-holes included in said thick film substrate being connected to said pad;

another pad disposed on the back of said thick film substrate for connection with a signal input/out pin; and

one through-hole included in said thick film substrate being connected to said another pad.

31. An electronic circuit apparatus comprising:

a wiring substrate for mounting a plurality of integrated circuit chips or integrated circuit packages and for electrically interconnecting said integrated circuit chips or integrated circuit packages;

pins or connectors for inputting/outputting signals from/to the outside;

said wiring substrate comprising a thick film substrate including a signal wiring layer therein and a thin film substrate including a signal wiring layer therein, said thin film substrate being formed above said thick film substrate; and

at least a part of signal wiring carrying electric signals having no relation to response speed of said electronic circuit apparatus being disposed in signal wiring layers included in said thick film substrate.

32. An electronic circuit apparatus according to claim 31, wherein internal circuits of said integrated circuits or integrated circuit chip packages comprise ECL circuits.