Thermal management of power conditioning systems

• US 5,111,280 A
• Filed: 05/01/1990
• Issued: 05/05/1992
• Est. Priority Date: 11/10/1988
• Status: Expired due to Fees

• Current Assignee: Arthur H. Iversen
• Original Assignee: Arthur H. Iversen
• Inventors: Iversen, Arthur H.
• Primary Examiner(s): Hille, Rolf
• Assistant Examiner(s): OSTROWSKI, DAVID M
• Application Number:
  US07/517,222
• Time in Patent Office: 735 Days
• Field of Search: 357/82, 357/80, 357/81, 361/385, 165/80.4, 165/133
• US Class Current: 257/713
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]

Abstract

A semi-conductor assembly including an elongated electrically conductive support structure defining a sinuous coolant flow path between respective upper and lower surfaces of the support structure. The sinuous coolant path includes alternating concave and convex coolant surfaces. A first series of semi-conductor devices is secured in a thermally intimate manner to the upper surface of the support structure, and a second series of semi-conductor devices is secured in a thermally intimate manner to the lower surface of the support structure. Each semi-conductor device is disposed proximate a concave curved surface of the coolant path.

Claims

1. A semi-conductor assembly, comprising:

an elongated, electrically isolated metallic support structure of generally rectangular cross section, said structure containing therein an enclosed coolant conduit spanning the length of said support structure, said conduit being of generally rectangular cross-section, the width dimension of said conduit being greater than its height;

a semi-conductor device mounted on at least one exterior surface of said structure, said device being bonded in a thermally intimate manner to said surface of said structure opposing said width dimension of said conduit and being placed opposing a concave curved heat transfer segment of the surface of said conduit;

first circuit means extending along and spaced from said structures, for providing electrical control to said semi-conductor device;

second circuit means, expending along and spaced from said structure, for carrying current from said semi-conductor device; and

electrical interconnect means for connecting said semi-conductor device to said first and second circuit means.

2. The assembly of claim 1, further comprising a plurality of passive electrical devices mounted on said exterior surface of said structure, passive devices being mounted opposing the convex curved surfaces of said conduit and electrically connected to said semi-conductor device.

3. The assembly of claim 1, wherein said coolant conduit comprises a heat exchange surface being concave curved in the direction of coolant flow, said heat exchange surface having fins of at least one of generally triangular and curved cross section, said fins extending in the direction of coolant flow substantially the length of said concave curved heat exchange surface.

4. The apparatus of claim 3 wherein said fins have heights, widths and spacings ranging from 0.1 mm to 3 mm, and effective half angles ranging from 1°

to 45°

.

5. The apparatus of claim 3 wherein said heat exchange surface is prepared with cavities said cavities having dimensions in the range of 0.002 mm to 0.2 mm, said cavities being spaced apart on said heat exchange surface said spacing generally ranging from 0.03 mm to 3mm whereby more efficient heat transfer is obtained.

6. The apparatus of claim 5 wherein said cavities are prepared with micro-cavities having dimension ranging from 10^-4 to 10-2 mm.

12. The assembly of claim 1, wherein said coolant flow path is substantially sinuous.

13. The assembly of claim 1, wherein said coolant flow path exhibits a substantially constant cross-section along the length thereof.

7. A semi-conductor assembly, comprising:

an elongated electrically conductive support structure having oppositely disposed upper and lower surfaces and an enclosed, substantially sinuous coolant flow path spanning the length thereof intermediate said upper and lower surfaces, said coolant flow path having a first width greater than its height;

a first series of semi-conductor devices spaced apart along the length of said upper surface of said support structure, disposed in intimate thermal contact therewith and electrically connected thereto;

a second series of semi-conductor devices spaced apart along the length of said lower surface of said support structure, disposed in intimate thermal contact therewith and electrically connected thereto; and

means for directing liquid coolant through said coolant flow path to thereby remove thermal energy from said first and second series of semi-conductor devises;

wherein said first and second series of semi-conductor devices each comprise at least one semi-conductor device having a width not exceeding said first width and disposed in a substantially symmetric overlying relationship with said coolant flow path.

8. The assembly of claim 7 wherein each of said first and second series of semi-conductor devices are disposed proximate a concave segment of said coolant flow path.

9. The assembly of claim 7 wherein said coolant flow path is substantially rectangular in cross section.

10. The assembly of claim 7 wherein:

said assembly further comprises an elongated ground bus and an elongated gate bus, each spanning the length of said support structure;

each of said first series of semi-conductor devices comprises a respective supply terminal, a ground terminal, and a gate terminal configured to selectively permit electric current flow from said supply terminal to said ground terminal;

each of said respective supply terminals are electrically connected to said support structure;

each of said respective gate terminals are electrically connected to said gate bus; and

each of said ground terminals are electrically connected to said ground bus.

14. The assembly of claim 7, wherein said coolant flow path exhibits a substantially constant cross-section along the length thereof.

11. A semi-conductor assembly including first and second semi-conductor devices and a supporting structure, wherein:

said supporting structure is formed of thermally conductive material and includes first and second opposing surfaces, there being a coolant passageway formed in said supporting structure between said first and second opposing surfaces, said coolant passageway being sinuous in shape and manifesting alternating curved approaches to said first and second surfaces;

said first semi-conductor device is disposed on and in thermal contact with said first surface overlying a curved approach by said coolant passageway to said first surface; and

said second semi-conductor device is disposed on and in thermal contact with said second surface overlying a curved approach by said coolant passageway to said second surface.