Motion restraints for micromechanical devices

• US 5,111,693 A
• Filed: 07/30/1990
• Issued: 05/12/1992
• Est. Priority Date: 01/13/1988
• Status: Expired due to Term

• Current Assignee: Charles Stark Draper Laboratory Incorporated
• Original Assignee: Charles Stark Draper Laboratory Incorporated
• Inventors: Greiff, Paul
• Primary Examiner(s): CHAPMAN JR, JOHN E
• Application Number:
  US07/560,374
• Time in Patent Office: 652 Days
• Field of Search: 73/505, 73/517 R, 73/517 A, 73/514, 73/862.62, 357/25, 357/26
• US Class Current: 73/514.35
• CPC Class Codes: B81B 2201/0235 Accelerometers
• CPC Class Codes: B81B 3/0051 For defining the movement, i.e. structures that guide or limit the movement of an element mechanical arrangements for preventing or damping vibration or shock H01H3/60
• CPC Class Codes: G01C 19/5719 using planar vibrating masses driven in a translation vibration along an axis

Abstract

Motion restraints and a method for their fabrication are provided for use with a micromechanical transducer, such as a gyroscope or an accelerometer, to limit the motion of resiliently supported transducer elements, preventing extreme lateral or rotational displacement of the elements. The motion restraints are fabricated of a material such as gold that prevents or reduces the sticking of the transducer elements at points of contact between them. In one embodiment, the motion restraints include cantilevered depositions that extend from the substrate over the transducer element. In a further embodiment, the restraints includes a metal capped post and close-tolerance lateral restraints.

Claims

1. A system of restraints for use with a micromechanical transducer comprising:

a moveable transducer element flexibly supported within a recess of a semiconductor substrate;

at least one thick metal layer region deposited over a region of plural thin metal layers, disposed at one or more positions about said recess, fixed to said semiconductor substrate, and extending towards said element so as to prevent displacement of said transducer element beyond a predetermined limit,

wherein said thick metal layer region extends from the surface of said semiconductor substrate over said moveable transducer element; and

a stalk supporting said thick metal layer region and extending from a portion of said substrate through an aperture in said transducer element.

2. The system of claim 1, wherein said thick metal layer region is of a diameter greater than said aperture.

3. The system of claim 1 wherein said transducer element or substrate has a non-stick material bonded to a surface that confronts said thick metal layer region.

4. The system of claim 1 wherein said stalk includes an annular portion radially extending toward the boundary of an aperture in said transducer element, together adapted to limit lateral displacement of said element.

5. The system of claim 1 wherein said transducer element and stalk include metallizations adapted to provide metal-to-metal limits to the lateral and rotational displacement of said transducer element.

6. The system of claim 1 wherein said transducer element is adapted to provide acceleration sensitive displacement.

7. The system of claim 1 wherein said transducer element further comprises first and second gimbal plates and a first set of metallizations from said substrate extending over said first gimbal plate and a second set between said first and second gimbal plates to restrain motion of said second gimbal plate relative to said first gimbal plate.

8. The system of claim 7 wherein said second set includes a metallization bridge between one of said gimbal plates and a plug in a hole of the other plate to provide rotational and translational restraint.