Method of image enhancement for the coherence probe microscope with applications to integrated circuit metrology

• US 5,112,129 A
• Filed: 03/02/1990
• Issued: 05/12/1992
• Est. Priority Date: 03/02/1990
• Status: Expired due to Term

• Current Assignee: KLA Instruments, Corporation (KLA Corporation)
• Original Assignee: KLA Instruments, Corporation (KLA Corporation)
• Inventors: Davidson, Mark, Mazor, Isaac, Kaufman, Kalman
• Primary Examiner(s): Turner, Samuel
• Assistant Examiner(s): Kurtz, II, Richard E.
• Application Number:
  US07/488,583
• Time in Patent Office: 802 Days
• Field of Search: 356/359, 356/358, 356/357, 356/387, 250/560, 382/54, 382/50, 382/43
• US Class Current: 356/497
• CPC Class Codes: G01B 11/02 for measuring length, width or thickness G01B11/08 takes precedence
• CPC Class Codes: G01B 9/04 Measuring microscopes

Abstract

A method whereby the image produced in a coherence probe microscope is modified by means of a certain specific additive electronic transformation for the purpose of improving the measurement of selected features. The technique improves measurement accuracy on optically complex materials, in particular it improves the accuracy of linewidth measurement on semiconductor linewidths.

Claims

1. A method of inspecting an object and generating synthetic image data comprising the steps of:

(a) using an interference optical system including an object channel and a reference channel for simultaneously inspecting an object and a reflective reference surface and developing a plurality of images formed by the interference between object wave energy passing from said object and through said object channel to an image plane and reference wave energy passing from said reference surface and through said reference channel to said image plane, each said image being formed in response to a change in position of either said object or said reference surface;

(b) modifying each of the plurality of images by adding the intensity from a fixed selected point of the images to all the other points with a weighting factor to produce a modified plurality of images;

(c) determining for each modified image the absolute value of the coherence between said object wave energy and said reference wave energy; and

(d) using said absolute value coherence data to generate synthetic image data representative of a particular characteristic of said object, wherein the brightness of each pixel element of a synthetic image developed using said synthetic image data is proportional to said absolute value coherence data.

2. A method of inspecting an object and generating synthetic image data comprising the steps of:

(a) using an interference optical system including an object channel and a reference channel for simultaneously inspecting an object and a reflective reference surface and developing a plurality of images formed by the interference between object wave energy passing from said object and through said object channel to an image plane and reference wave energy passing from said reference surface and through said reference channel to said image plane, each said image being formed in response to a change in position of either said object or said reference surface;

(b) modifying each of the plurality of images by adding columnwise the intensity from a fixed selected column of points of the images to all the other points with a weighting factor to produce a modified plurality of images;

(c) determining for each image of the modified set the absolute value of the coherence between said object wave and said reference wave energy; and

(d) using said absolute value coherence data to generate synthetic image data representative of a particular characteristic of said object, wherein the brightness of each pixel element of a synthetic image developed using said synthetic image data is proportional to said absolute value coherence data.

3. A method of inspecting an object and generating synthetic image data comprising the steps of:

(a) using an interference optical system including an object channel and a reference channel for simultaneously inspecting an object and a reflective reference surface and developing a plurality of images formed by the interference between object wave energy passing from said object and through said object channel to an image plane and reference wave energy passing from said reference surface and through said reference channel to said image plane, each said image being formed in response to a change in position of either said object or said reference surface;

(b) modifying each of the plurality of images by adding a weighted sum of the intensities from a fixed set of selected points of the images to all the other points to produce a modified plurality of images;

(c) determining for each modified image the absolute value of the coherence between said object wave energy and said reference wave energy; and

(d) using said absolute value coherence data to generate synthetic image data representative of a particular characteristic of said object, wherein the brightness of each pixel element of a synthetic image developed using said synthetic image data is proportional to said absolute value coherence data.

4. A process for generating synthetic image data representative of a cross-section of an at-least partially reflective irregular surface of an object formed by a portion of a semiconductor wafer having an elongated strip of raised surface extending therethrough, comprising the steps of:

(a) illuminating the irregular object surface with light from a source of illumination;

(b) illuminating a reflective reference surface with light from said source of illumination, said reference surface being formed by an optically flat mirror;

(c) collecting object light reflected from said object surface and directing said object light along a first optical axis;

(d) collecting reference light reflected from said reference surface and directing said reference light along a second optical axis at least a portion of which is parallel to said first optical axis;

(e) focusing the light directed along said first and second optical axes to form a fringed image pattern resulting from interference of said object light and said reference light;

(f) orientating said wafer so that a selected scan line may be directed substantially orthogonal relative to the length of said elongated strip;

(g) modifying the scan data by adding to each pixel'"'"'s intensity the weighted sum of intensities of a set of other pixels;

(h) incrementally changing the position of said object along said first optical axis, each time repeating steps (a) through (e) and (g);

(i) inspecting the said modified image patterns to develop a series of absolute coherence data along said scan line;

(j) processing the plurality of series of coherence data to develop synthetic image data corresponding to a cross-sectional profile of said object surface taken in a plane including said selected scan lines;

(k) displaying said synthetic image data to visually depict a cross-sectional profile of said object surface taken in the plane including said scan lines; and

(l) determining the position of said object along said first optical axis at which the value of said coherence data corresponding to the crossing of a first particular scan line over said raised surface is at a maximum relative to the corresponding coherence data of the other scan lines and identifying this position as corresponding to the top surface of said strip.

5. A process as recited in claim 4, and further comprising the step of;

(m) detecting the width of the top said raised surface by measuring the length of the portion of said first particular scan line over which said coherence data is at a maximum.

6. A process as recited in claim 5, and further comprising the step of;

(n) determining the position of said object along said first optical axis when the value of said coherence data corresponding to the crossing of another particular scan line over portions of said surface other than said raised surface are at a maximum relative to the corresponding data of the other scanned lines; and

(o) determining the width of the base of said raised surface by measuring the separation between the portions of said other particular scan lines over which said data is at a maximum.

7. A process as recited in claim 6, and further comprising the step of;

(p) determining the height of said raised surface above the adjacent wafer surface by measuring the distance between the position at which the object is positioned along said first optical axis when the width of the top of said raised surface is detected and the position along said first optical axis when the width of the base of said raised surface is detected.

8. A process as recited in claim 7, and further comprising the step of;

(q) calculating the slopes of the side walls of said raised surface, in the plane including said scan lines, as a function of the height of the top of the raised surface above the base thereof and the difference in width of the top and the base along the corresponding scan lines.

9. A method of measuring certain dimensions of an elongated strip of raised surface formed on an object, such as a semiconductor wafer or photomask, using an interference optical system to develop images formed by interference between object wave energy passing from the object and through and object channel to an image plane and reference wave energy passing through a reference channel to the image plane, comprising the steps of:

(a) illuminating the object surface with light from a source of illumination;

(b) illuminating a reflective reference surface with light from said source of illumination;

(c) collecting object light reflected from said object surface and directed along a first optical axis through said object channel;

(d) collecting reference light reflected from said reference surface and directed along a second optical axis through said reference channel, said second optical axis having at least a portion thereof which is parallel to said first optical axis;

(e) focusing the light directed along said parallel portions of said first and second optical axes onto an image plane to form an interference image pattern resulting from interference of said object light and said reference light;

(f) inspecting the image pattern by detecting the light intensity at each pixel in an array of mxn pixels extending across the image of said strip to produce pixel data;

(g) modifying the array of mxn pixels by adding to each pixel'"'"'s intensity a weighted sum of intensities of a set of other pixels;

(h) incrementally changing the position of said object along said first optical axis, each time repeating steps (a) through (g);

(i) scanning the modified pixel data and calculating therefrom coherence data representing the absolute value or magnitude of the complex coherence between the light from the reference channel and that from the object channel and storing the calculated coherence data for subsequent reference; and

(j) using the stored coherence data to generate data from which a synthetic image corresponding to a transverse cross-section of the measured strip may be developed.

10. A method as recited in claim 9 and further including the step of:

(k) inspecting the stored coherence data to determine the height of the top surface of said strip relative to the adjacent surface of said object, such height being measured by determining a first position along said first optical axis at which maximum coherence occurs at a point in an array corresponding with said top surface, and by determining a second position along said first optical axis at which maximum coherence occurs at a point in an array corresponding with said adjacent surface, the measured height of said top surface being equal to the distance between said first position and said second position.

11. A method as recited in claim 9 further including the step of:

(k) measuring the width of the bottom of the strip by applying an edge finding algorithm to coherence data taken from the image corresponding to said adjacent surface without first calculating the height of said top surface and without first calculating the width of the top of said object.

12. A method as recited in claim 10 and further comprising the step:

(j) of determining the width of the top surface of said strip by applying an edge finding algorithm to coherence data taken from the image corresponding to said top surface.

13. A method as recited in claim 10 and further comprising the step of:

(j) measuring the width of the bottom of the strip by applying an edge finding algorithm to coherence data taken from the image corresponding to said adjacent surface.

14. A method as recited in claim 13 and further comprising the step of:

(k) of determining the width of the top surface of said strip by applying an edge finding algorithm to coherence data taken from the image corresponding to said top surface.