Method of making metal-film laminate resistant to delamination

• US 5,112,462 A
• Filed: 09/13/1990
• Issued: 05/12/1992
• Est. Priority Date: 09/13/1990
• Status: Expired due to Term

• Current Assignee: Multek Flexible Circuits, Inc. (Flex, Ltd.)
• Original Assignee: Sheldahl, Inc.
• Inventors: Swisher, Richard L.
• Primary Examiner(s): Weisstuch, Aaron
• Application Number:
  US07/580,505
• Time in Patent Office: 607 Days
• Field of Search: 204/15, 204/30, 204/38.4, 204/164-165, 204/192.14, 204/192.3, 427/40, 427/96, 427/98-99, 427/250, 427/296, 427/322, 427/404, 427/419.2
• US Class Current: 205/165
• CPC Class Codes: C08J 2379/08 Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
• CPC Class Codes: C08J 7/123 Treatment by wave energy or particle radiation C08J7/18 takes precedence
• CPC Class Codes: C23C 14/022 by means of bombardment with energetic particles or radiation
• CPC Class Codes: C23C 14/08 Oxides C23C14/10 takes precedence
• CPC Class Codes: C23C 14/20 on organic substrates
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 2201/0154 Polyimide
• CPC Class Codes: H05K 2203/095 Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
• CPC Class Codes: H05K 3/388 by the use of a metallic or inorganic thin film adhesion layer
• CPC Class Codes: Y10S 205/924 Electrolytic coating substrate predominantly comprised of specified synthetic resin
• CPC Class Codes: Y10S 205/926 Polyamide or polyimide, e.g. nylon
• CPC Class Codes: Y10T 428/12451 Macroscopically anomalous interface between layers
• CPC Class Codes: Y10T 428/12472 Microscopic interfacial wave or roughness
• CPC Class Codes: Y10T 428/12535 with additional, spatially distinct nonmetal component
• CPC Class Codes: Y10T 428/12549 Adjacent to each other
• CPC Class Codes: Y10T 428/12569 Synthetic resin
• CPC Class Codes: Y10T 428/1291 Next to Co-, Cu-, or Ni-base component

Abstract

A flexible metal-film laminate can comprise a layered film structure having a metal layer securely bonded to a film layer. The laminate contains a unique metal-oxide attachment structure between the film and metal layer comprising randomly distributed regions of metal-oxide. The peel strength of such a laminate is significantly improved over prior laminates and is resistant to peel strength reduction due to environmental stress. The preferred metal-film laminates made with polyester or polyimide can be used in the manufacture of high-quality, low cost, flexible printed circuit boards.

Claims

1. A process for the manufacture of a metal-polymeric film laminate resistant to the separation of the metal from the film, which process comprises:

(a) contacting a polymeric film with a plasma, produced from at least two metallic electrodes, said plasma comprising ionized oxygen, to form on said film a non-continuous random distribution of a metal or a metal-oxide, said metal being selected from the group consisting of iron, chromium, nickel, molybdenum, manganese, zirconium or mixtures thereof, said distribution being less than 20 atomic layers in thickness, said metal or metal-oxide being derived from said metallic electrodes; and

(b) forming by vapor metallization a metal layer having a thickness of about 50 to 500 nanometers on the metal-oxide treated film, wherein no metallic tie-coat layer is formed in the manufacture of the laminate.

2. The process of claim 1 wherein the film comprises a fluorine containing polymer.

3. The process of claim 1 wherein the film comprises a polyimide.

4. The process of claim 1 wherein the film comprises a thermoplastic resin.

5. The process of claim 1 wherein the film comprises a thermoset resin.

6. The process of claim 1 wherein the metal layer comprises gold, silver, nickel, chromium, tin, lead, platinum, or alloys thereof.

7. The process of claim 1 wherein the metal layer comprises copper.

8. A process for the manufacture of a metal-polymeric film laminate resistant to the separation of the metal from the film, which process comprises:

(a) contacting a polymeric film with a plasma, produced from at least two metallic electrodes, said plasma comprising ionized oxygen, to form on said film a non-continuous random distribution of a metal or a metal-oxide, said metal being selected from the group consisting of iron, chromium, nickel, molybdenum, manganese, zirconium or mixtures thereof, said distribution being less than 20 atomic layers in thickness, said metal or metal-oxide being derived from said metallic electrodes; and

(b) forming by vapor metallization a first metal layer having a thickness of about 50 to 500 nanometers on the metal-oxide treated film; and

(c) forming a second metal layer having a thickness of about 0.1 to 40 μ

m on the first metal layer, wherein no metallic tie-coat layer is formed in the manufacture of the laminate.

9. The process of claim 8 wherein the metal-film laminate has a peel strength greater than about 3 pounds per inch.

10. The process of claim 9 wherein the second metal layer is formed by electrodeposition.

11. The process of claim 8 wherein the film comprises a fluorine containing polymer.

12. The process of claim 8 wherein the film comprises a polyimide.

13. The process of claim 8 wherein the film comprises a thermoplastic resin.

14. The process of claim 8 wherein the film comprises a thermoset resin.

15. The process of claim 8 wherein the first metal layer and the second metal layer comprise gold, silver, nickel, chromium, tin, lead, platinum, or alloys thereof.

16. The process of claim 8 wherein the first metal layer comprises copper.

17. The process of claim 8 wherein the second metal layer comprises copper.

18. The process of claim 8 wherein the ionized oxygen is derived from oxygen gas.

19. A process for the manufacture of a flexible printed circuit board, having a copper circuit pattern on a polymeric film support, resistant to the delamination of the copper circuit pattern from the polymeric film, which process comprises:

(a) contacting a polymeric film with a plasma, produced from at least two metallic electrodes, said plasma comprising ionized oxygen, to form on said film a non-continuous random distribution of a metal or metal-oxide, said metal being selected from the group consisting of iron, chromium, nickel, molybdenum, manganese, zirconium or mixtures thereof, said distribution being less than 20 atomic layers in thickness, said metal or metal-oxide being derived from said metallic electrodes;

(b) forming by vacuum metallization a first copper layer having a thickness of about 50 to 500 nanometers on the metal-oxide treated film; and

(c) electro-plating a second copper layer on the first copper layer to form a copper film laminate resistant to the separation of the metal from the film wherein no chromium tie-coat layer is formed in the manufacture of the laminate.

20. The process of claim 19 wherein the copper layer is then etched to form said circuit pattern.

21. The process of claim 19 wherein in step (c) a resist layer is applied to the first copper layer, a second copper layer is electroplated onto the first copper layer forming the pattern revealed by the resist, removing the resist and lightly etching the revealed first copper layer.

22. The process of claim 19 wherein after contacting the film with the plasma, a copper layer is sputtered onto the metal-oxide treated film and is formed between the metal oxide treated film and the first copper layer.

23. The process of claim 19 wherein the peel strength of the copper-film laminate is at least 3 pounds per inch.

24. The process of claim 19 wherein the second copper layer has a thickness of about 0.1 to 35 μ

m.

25. The process of claim 19 wherein the film comprises a fluorine containing polymer.

26. The process of claim 19 wherein the film comprises a polyimide.

27. The process of claim 19 wherein the film comprises a thermoplastic.

28. The process of claim 27 wherein the thermoplastic comprises a polyester.

29. The process of claim 20 wherein the source of ionized oxygen comprises oxygen gas.

30. The process of claim 20 wherein the film comprises a thermoset.