LED array chips with thermal conductor

• US 5,113,232 A
• Filed: 06/24/1991
• Issued: 05/12/1992
• Est. Priority Date: 07/31/1990
• Status: Expired due to Term

• Current Assignee: Eastman Kodak Company
• Original Assignee: Eastman Kodak Company
• Inventors: Itoh, Masahiro, Kuwabara, Masayuki
• Primary Examiner(s): MINTEL, WILLIAM A
• Application Number:
  US07/719,406
• Time in Patent Office: 323 Days
• Field of Search: 357/17, 357/45, 357/81, 357/68, 357/71, 357/53, 357/54
• US Class Current: 257/91
• CPC Class Codes: H01L 27/153 in a repetitive configuration, e.g. LED bars
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

The present invention is directed to an LED array chip which includes a plurality of LEDs which are integrated thereon and has a thermal conductor on the array chip in the vicinity of, and on the same side as a light emitting surface of each LED on the array chip. The thermal conductor extends away from each LED and is connected to a radiating member such as a heat sink which is provided outside of the array chip. The thermal conductor can be electrically conductive, and in such case can be electrically connected to an electrode on a surface of the array chip opposite to the light emitting surfaces of the plurality of LEDs.

Claims

1. A Light Emitting Diode (LED) array chip comprising:

a plurality of LEDs integrated on a major surface of the array chip, each LED comprising a light emitting surface which is substantially aligned with the major surface of the array chip; and

a thermal conductor formed on a surface of the array chip on the same side as the plurality of LEDs and extending to a position adjacent to but not in contact with the light emitting surface of each LED, the thermal conductor being overcoated with an insulator and connected to a radiating member provided outwardly of the array chip.

2. The LED array chip of claim 1 further comprising:

an electrode formed on a second major surface of the array chip opposite the light emitting surface of each LED; and

the thermal conductor is electrically connected to the electrode.

3. The LED array chip of 1 wherein the thermal conductor extends to a position close to the light emitting surface of each LED without exerting any substantial influence on light emissions from each of the LEDs.

4. A Light Emitting Diode (LED) array chip comprising:

a plurality of LEDs integrated on a major surface of the array chip, each LED comprising a light emitting surface which is substantially aligned with the major surface of the array chip;

a plurality of electrodes, each electrode connected to the light emitting surface of a separate one of the LEDs;

a thermal conductor formed on a surface of the array chip on the same side as the plurality of LEDs and extending to a position adjacent to, but not in contact with, the light emitting surface of each LED; and

an insulation layer for providing insulation between the thermal conductor and each of the electrodes and the light emitting surfaces.

5. The LED array chip of claim 4 wherein the thermal conductor is connected to a radiating member provided outwardly of the array chip.

6. The LED array chip of claim 4 further comprising:

a second electrode formed on a second major surface of the array chip opposite the light emitting surface of each LED; and

the thermal conductor is electrically connected to the second electrode.

7. The LED array chip of claim 6 wherein the thermal conductor is also connected to a radiating member provided outwardly of the array chip.

9. The LED array chip of claim 4 wherein the insulation layer is formed on top of and around an edge nearest the light emitting surface of the thermal conductor.

10. The LED array chip of claim 9 further comprising a second insulation layer formed between the thermal conductor and the major surface of the array chip.

8. The LED array chip of 4 wherein the thermal conductor extends to a position adjacent to, but not in contact with, the light emitting surface of each LED without exerting any substantial influence on light emissions from each of the LEDs.