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Apparatus and method for inspection and alignment of semiconductor chips and conductive lead frames

  • US 5,113,565 A
  • Filed: 07/06/1990
  • Issued: 05/19/1992
  • Est. Priority Date: 07/06/1990
  • Status: Expired due to Fees
First Claim
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1. A method for aligning a contact pattern on an electronic device held by a first movable support, with a bond site pattern on a lead frame held by a second movable support, comprising the steps of:

  • a. creating and storing precise models of contact and bond site patterns;

    b. deriving images of said electronic device contact pattern and said lead frame, said electronic device and lead frame to be hereafter moved by said first and second movable supports into a bonding position to enable said electronic device contact pattern to be bonded to bond sites on said lead frame;

    c. determining the position of contacts in said imaged contact pattern, and reorienting said contact pattern model to a best fit with said determined contact positions;

    d. determining the position of bond sites on said imaged lead frame, and reorienting said bond site model to a best fit with said determined bond site positions;

    e. finding positional differences between said reoriented bond site and contact pattern models; and

    f. generating signals to reorient said first and second movable supports to minimize said positional differences when said first and second supports are moved into said bonding position.

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