Photosensitive polyimide compositions

• US 5,114,826 A
• Filed: 12/28/1989
• Issued: 05/19/1992
• Est. Priority Date: 12/28/1989
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Sachdev, Krishna G., Kwong, Ranee W., Sachdev, Harbans S.
• Primary Examiner(s): Lovering, Richard D.
• Application Number:
  US07/458,130
• Time in Patent Office: 873 Days
• Field of Search: 252/600, 430/175, 430/176, 430/192, 430/197, 522/39, 522/47, 522/50
• US Class Current: 430/192
• CPC Class Codes: G03F 7/0387 Polyamides or polyimides
• CPC Class Codes: G03F 7/039 Macromolecular compounds which are photodegradable, e.g. positive electron resists G03F7/075 takes precedence; macromolecular quinonediazides G03F7/023
• CPC Class Codes: G03F 7/0758 with silicon- containing groups in the side chains
• CPC Class Codes: H01L 2224/11334 using preformed bumps

Abstract

New photosensitive polyimide compositions and processes of using the same in the fabrication of electronic components are provided. These compositions are comprised of ##STR1## containing polyamic acids and/or the corresponding hydroxy-polyamic esters, or hydroxypolyimides and a photoactive component as an additive or as covalently bonded functionality on the polymer chain. These compositions provide positive or negative patterning options and may be used as conventional resist materials, as imageable dielectric or passivating layers, as high Tg ion implant masks or as imageable lift-off layers in the fabrication of multilevel metal structures.

Claims

1. A thermally stable photosensitive polymer composition comprising a substantially gel-free polyamic acid, polyamic ester or polyimide formed in a solvent comprising a N-methylpyrrolidone-diglyme mixture by the condensation of

(a) a bis-(3-amino-4-hydroxyphenyl) composition of the structure ##STR32## where Q is selected from the group consisting of ##STR33## and (b) a dianhydride selected form the group consisting of

(1) a bis-(3,4 dicarboxyphenyl) anhydride composition of the structure ##STR34## where Z is selected from the group consisting of ##STR35## and (2) an aliphatic tetracarboxylic anhydride of the form ##STR36## and a photoactive compound.

2. The photosensitive polymer of claim 1 wherein at least one of Q and Z is ##STR37##

3. The photosensitive polymer of claim 1 wherein the mole equivalent ratio of diamine to dianhydride is from 1:

1 to 1.25;

1.

4. The photosensitive polymer of claim 3 which includes a chain terminating group selected from the group consisting of phthalic anhydride and hydroxyphthalic anhydride.

5. The photosensitive polymer of claim 1 wherein the photoactive compound is a diazoketone or bisazide.

6. The photosensitive polymer of claim 1 which is developable in aqueous alkaline developer.

7. The photosensitive polymer of claim 6 wherein the developer is potassium hydroxide, sodium hydroxide or tetramethyl ammonium hydroxide.

8. The photosensitive polymer of claim 1 which is solvent strippable.

9. The photosensitive polymer of claim 1 which is solvent strippable after heat treatment to about 250°

C.

10. The photosensitive polymer of claim 1 wherein the solvent further comprises xylene.

11. A thermally stable photosensitive polymer composition comprising a polyamic acid, polyamic ester or polyimide formed in a solvent comprising a N-methyl-pyrolidone-diglyme mixture by the condensation of

(a) a bis-(3-amino-4-hydroxyphenyl) composition of the structure ##STR38## where Q is selected from the group consisting of ##STR39## (b) a dianhydride selected from the group consisting of (1) a bis-(3,4 dicarboxyphenyl) anhydride composition of the structure ##STR40## where Z is selected from the group consisting of ##STR41## and (2) an aliphatic tetracarboxylic anhydride of the form ##STR42## where the polyimide is functionalized through its hydroxy groups.

12. The photosensitive polymer composition of claim 11 where the functionalizing group is a t-butyloxycarbonyl group, epoxypropyl group, methacryloyl group, o-naphthoquinone diazide-4-sulfonyl group, o-naphthoquinone diazide-5-sulfonyl group, or a polysiloxane group.

13. The photosensitive polymer composition of claim 11 wherein the mole equivalent ratio of diamine to dianhydride is from 1:

1 to 1.25;

1.

14. The photosensitive polymer composition of claim 13 which includes a chain terminating group selected from the group consisting of phthalic anhydride and hydroxyphthalic anhydride.

15. The photosensitive polymer composition of claim 13 wherein the mole equivalent ratio of diamine to dianhydride is from 1.05:

1 to 1.25;

1.

16. The photosensitive polymer composition of claim 15 which is imageable to provide high resolution submicron images in thin films.

17. The photosensitive polymer of claim 11 which further comprises a photoactive compound.

18. The photosensitive polymer of claim 17 wherein the photoactive compound is a diazoketone or bisazide.

19. The photosensitive polymer of claim 11 which is developable in aqueous alkaline developer.

20. The photosensitive polymer of claim 19 wherein the developer is potassium hydroxide, sodium metasilicate or tetramethyl ammonium hydroxide.

21. The photosensitive polymer of claim 11 which is solvent strippable.

22. The photosensitive polymer of claim 11 which is solvent strippable after heat treatment to about 250°

C.

23. The photosensitive polymer of claim 11 wherein the solvent further comprises xylene.