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Automatic semiconductor package inspection method

  • US 5,115,475 A
  • Filed: 06/04/1990
  • Issued: 05/19/1992
  • Est. Priority Date: 06/04/1990
  • Status: Expired due to Term
First Claim
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1. A method of automatically inspecting lead-fingers of a semiconductor package comprising:

  • providing a sample package;

    obtaining an image of lead-fingers of the sample package;

    positioning a window around the sample lead-finger image;

    building a sample mask image from the sample lead-finger image;

    logical ANDing the window with the sample mask image;

    obtaining an image of lead-fingers under inspection;

    mathematically enhancing the image under inspection;

    dilating the enhanced image;

    aligning the mask image to the dilated image; and

    comparing the mask image to the dilated image to determine acceptability of the lead-fingers.

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