Controlled heating of foodstuffs by microwave energy

• US 5,117,078 A
• Filed: 02/04/1991
• Issued: 05/26/1992
• Est. Priority Date: 02/02/1990
• Status: Expired due to Term

• Current Assignee: Graphic Packaging International Incorporated
• Original Assignee: Beckett Industries, Inc.
• Inventors: Beckett, D. Gregory
• Primary Examiner(s): Leung, Philip H.
• Application Number:
  US07/650,246
• Time in Patent Office: 477 Days
• Field of Search: 219/10.55 E, 219/10.55 F, 219/10.55 R, 219/10.55 D, 426/107, 426/234, 426/241, 426/243, 99/451, 99/DIG. 14, 126/390
• US Class Current: 219/728
• CPC Class Codes: B65D 2581/3405 Cooking bakery products
• CPC Class Codes: B65D 2581/344 Geometry or shape factors influencing the microwave heating properties
• CPC Class Codes: B65D 2581/3467 Microwave reactive layer shaped by delamination, demetallizing or embossing
• CPC Class Codes: B65D 2581/3472 Aluminium or compounds thereof
• CPC Class Codes: B65D 2581/3489 Microwave reflector, i.e. microwave shield B65D2581/3487 takes precedence
• CPC Class Codes: B65D 81/3453 Rigid containers, e.g. trays, bottles, boxes, cups
• CPC Class Codes: Y10S 99/14 Induction heating

Abstract

A novel structure for use in the microwave cooking of foodstuffs for consumption is described. The structure includes a layer of flexible electroconductive material normally opaque to microwave radiation and having a plurality of elongate apertures therethrough dimensioned to permit microwave energy to pass through to the interior of the foodstuff and to produce thermal energy at the surface of the foodstuff. Both a microwave shielding effect and a combined microwave energy heating and thermal energy heating effect are obtained, enabling close control of the manner and extent of microwave cooking of the foodstuff to be obtained. The layer of flexible electroconductive material is supported by and adhered to a substrate layer of microwave energy transparent material in a multiple layer article of manufacture adapted to be formed into a packaging structure in which a foodstuff may be heated by microwave energy to an edible condition.

Claims

1. A multiple layer article of manufacture, adapted to be formed into a packaging structure in which a foodstuff may be heated by microwave energy to an edible condition, comprising:

a layer of flexible electroconductive material supported on a substrate layer,

said layer of flexible electroconductive material having a thickness which is normally substantially opaque to microwave radiation and having a plurality of elongate apertures extending wholly through the thickness of said electroconductive material layer and effective to generate thermal energy in said plurality of apertures when said article is exposed to microwave energy and the foodstuff is in contact with or proximate to said plurality of apertures,

said plurality of apertures being sized and arranged in said layer of flexible electroconductive material to generate sufficient thermal energy to effect a desired surface browning of the foodstuff while permitting sufficient microwave energy to penetrate said layer of flexible electroconductive material through said plurality of apertures into the foodstuff to effect a desired degree of heating of the foodstuff, whereby the foodstuff may be provided in an edible condition, and

said substrate layer being formed of microwave energy transparent material and being in adhered structural supporting relationship with said flexible layer of electroconductive material so that a packaging structure may be formed from said article in which said foodstuff may be positioned.

3. The article of claim 1 wherein said layer of electroconductive material is aluminum foil having a thickness of from about 1 to about 15 microns.

4. The article of claim 3 wherein said aluminum foil has a thickness of about 3 to about 10 microns.

5. The article of claim 3 wherein each said aperture has a width of at least about 1 mm and a length of at least about 1.75 cm.

6. The article of claim 5 wherein said substrate layer is formed of microwave transparent structural stock material.

7. The article of claim 6 wherein said structural stock material is paper or paperboard.

8. The article of claim 7 wherein said stock material is provided on one side of the layer of electroconductive material and a polymeric film is provided on the other.

9. The article of claim 8 formed into a dish.

10. The article of claim 9 wherein said dish is a pot pie dish having a bottom wall and a side wall.

14. The article of claim 10 wherein said plurality of apertures comprises an elongate spiral extending from the side wall of the pot pie dish to the centre of the bottom wall.

15. The article of claim 14 in combination with a pot pie located in said dish.

16. The article of claim 8 formed into a bag structure.

17. The article of claim 16 wherein said plurality of apertures comprises a plurality of individual parallel elongate apertures closely spaced one from another.

18. The article of claim 16 in combination with said foodstuff enclosed within said bag structure.

19. The article of claim 7 wherein said structural stock material is provided on both sides of the layer of electroconductive material.

20. The article of claim 19 formed into a bag structure adapted to enclose said foodstuff.

21. The article of claim 20 in combination with said foodstuff enclosed within said bag structure.

22. The article of claim 21 wherein said foodstuff comprises a crusty filled product.

23. The article of claim 21 wherein said foodstuff comprises french fries.

24. The article of claim 5 wherein said layer of electroconductive material is laminated between outer layers of polymeric material.

25. The article of claim 24 wherein at least one of said polymeric material layers is formed of rigid moldable material.

26. The article of claim 25 molded into a tray or dish.

27. The article of claim 26 in combination with said foodstuff located in said tray or dish.

28. The article of claim 1 wherein a further layer of electroconductive material having a thickness sufficiently small as to effect conversion of a portion of incident microwave energy to thermal energy is positioned in engagement with said substrate layer to achieve an augmented heating effect in said plurality of apertures by exposure of said further layer of electroconductive material to microwave energy.

29. The article of claim 1 wherein said microwave transparent layer comprises a polymeric film layer to which said layer of electroconductive material is adhered by laminating adhesive.

30. The article of claim 29 wherein said plurality of elongate apertures in said layer of electroconductive material is formed therein by selective demetallization.

31. The article of claim 30 wherein said layer of electroconductive material is coated with a layer of detackifying material for said laminating adhesive following said selective demetallization.

32. The article of claim 30 wherein a layer of food release material is provided on food-contacting areas of said polymeric film layer on the opposite side thereof from that to which said electroconductive material is adhered.

33. The article of claim 1 in combination with said foodstuff packaged therein with said plurality of apertures located in thermal energy-generating relationship with said foodstuff.

2. The article of claim wherein said layer of flexible electroconductive material has a thickness of at least about 1 micron.

11. The article of claim wherein said plurality of apertures is arranged extending radially from the centre of the bottom wall of the dish and into the side walls of the dish to be engaged by the pot pie when located in the dish.

12. The article of claim 11 in combination with a pot pie located in said dish.

13. The article of claim 11 wherein each of said apertures a has the same width.